Claims
- 1. A reed switch module, comprising:
a reed switch device further comprising a plurality of contact tongues merged in a tube, the contact tongues terminating in signal leads extending outside the tube said signal leads terminated to a plurality of signal contacts, a ground shield conductor disposed around the exterior of the tube and terminated to a plurality of ground contacts, and a magnetic coil assembly disposed around the exterior of the ground shield conductor, said magnetic coil assembly further comprising a coil bobbin and a wire coil wrapped around the coil bobbin where the wire is terminated to coil contacts; a substrate having a main body with a top surface and a bottom surface, said reed switch device being disposed on said substrate; a plurality of electrically conductive terminals disposed along one or more surfaces of the substrate in electrical connection to said reed switch device, wherein a plurality of said terminals are connected to the signal contacts, a plurality of said terminals are connected to the ground contacts, and a plurality of the terminals are connected to the coil contacts, and said terminals are further capable of being connected to a signal line, a ground line, and a magnetic coil line of a circuit; and an over mold being disposed on the top surface of the substrate and containing the reed switch device.
- 2. The reed switch module of claim 1 wherein said substrate is made of dielectric material.
- 3. The reed switch module of claim 1 wherein said substrate is made of ceramic material.
- 4. The reed switch module of claim 1 wherein said terminals are connected to said circuit by a plurality of solder balls.
- 5. The reed switch module of claim 1 wherein said substrate is substantially thin and flat on both surfaces and said terminals are terminated to a plurality of contact pins in electrical connection with the signal leads, the ground shield conductor, and the magnetic coil assembly of said reed switch device.
- 6. The reed relay device of claim 1 wherein said substrate comprises a depression on one surface capable of receiving and seating said reed relay, shield, coil bobbin, and coil.
- 7. The reed relay device of claim 1 wherein said substrate defines a hollow space capable of receiving and seating said reed relay, shield, coil bobbin, and coil.
- 8. The reed relay device of claim 1 wherein said device is capable of maintaining a high frequency response while carrying radio frequency signals at a frequency of at least 10 GHz.
- 9. The reed relay device of claim 1 wherein said device is capable of carrying fast digital pulses with clock speeds of at least 3 GHz, where pulse rise times of at least 30 picoseconds to at least 50 picoseconds are substantially not distorted or slewed.
- 10. A reed switch module, comprising:
a reed switch device further comprising a plurality of contact tongues merged in a tube, the contact tongues terminating in signal leads extending outside the tube said signal leads terminated to a plurality of signal contacts, a ground shield conductor disposed around the exterior of the tube and terminated to a plurality of ground contacts, a magnetic coil assembly disposed around the exterior of the ground shield conductor, said magnetic coil assembly further comprising a coil bobbin and a wire coil wrapped around the coil bobbin where the wire is terminated to coil contacts; a substrate having a main body with a top surface and a bottom surface; said reed switch device being disposed on said substrate; a plurality of electrically conductive terminals disposed along one or more surfaces of the substrate in electrical connection to said reed switch device, wherein a plurality of said terminals are connected to the signal contacts, a plurality of said terminals are connected to the ground contacts, and a plurality of the terminals are connected to the coil contacts, and said terminals are further capable of being connected to a signal line, a ground line, and a magnetic coil line of a circuit; and an over mold being disposed on the top surface of the substrate and containing the reed switch device, said over mold recessed from a plurality of sides of said substrate.
- 11. The reed switch module of claim 10 wherein the terminals are partially covered by the over mold and the exposed regions are adapted for surface mounting of the reed switch module to a circuit board.
- 12. The reed switch module of claim 11 wherein the over mold of the module is contained within a hole in a circuit board and the profile of the module on the circuit board is reduced.
- 13. A reed switch module, comprising:
a plurality of reed switch devices, each device further comprising a plurality of contact tongues merged in a tube, the contact tongues terminating in signal leads extending outside the tube said signal leads terminated to a plurality of signal contacts, a ground shield conductor disposed around the exterior of the tube and terminated to a plurality of ground contacts, a magnetic coil assembly disposed around the exterior of the ground shield conductor, said magnetic coil assembly further comprising a coil bobbin and a wire coil wrapped around the coil bobbin where the wire is terminated to coil contacts; a substrate having a main body with a top surface and a bottom surface adapted for an array of reed switch devices; said reed switch devices being disposed on said substrate; a plurality of electrically conductive terminals disposed along one or more surfaces of the substrate in electrical connection to said reed switch device, wherein a plurality of said terminals are connected to the signal contacts, a plurality of said terminals are connected to the ground contacts, and a plurality of the terminals are connected to the coil contacts, and said terminals are further capable of being connected to a signal line, a ground line, and a magnetic coil line of a circuit; and an over mold being disposed on the top surface of the substrate and containing the reed switch devices, said over mold recessed from a plurality of sides of said substrate.
- 14. The reed switch module of claim 13 wherein the terminals are partially covered by the over mold and the exposed regions are adapted for surface mounting of the reed switch module to a circuit board.
- 15. The reed switch module of claim 14 wherein the over mold of the module is contained within a hole in a circuit board and the profile of the module on the circuit board is reduced.
- 16. The reed switch module of claim 13 wherein said substrate is made of dielectric material.
- 17. The reed switch module of claim 13 wherein said substrate is made of ceramic material.
- 18. The reed switch module of claim 13 wherein said terminals are connected to said circuit by a plurality of solder balls.
- 19. The reed switch module of claim 13 wherein said substrate is substantially thin and flat on both surfaces and said terminals are terminated to a plurality of contact pins in electrical connection with the signal leads, the ground shield conductor, and the magnetic coil assembly of said reed switch device.
- 20. The reed relay device of claim 13 wherein said substrate comprises a depression on one surface capable of receiving and seating said reed relay, shield, coil bobbin, and coil.
- 21. The reed relay device of claim 13 wherein said substrate defines a hollow space capable of receiving and seating said reed relay, shield, coil bobbin, and coil.
- 22. The reed relay device of claim 13 wherein said device is capable of maintaining a high frequency response while carrying radio frequency signals at a frequency of at least 10 GHz.
- 23. The reed relay device of claim 13 wherein said device is capable of carrying fast digital pulses with clock speeds of at least 3 GHz, where pulse rise times of at least 30 picoseconds to at least 50 picoseconds are substantially not distorted or slewed.
RELATED APPLICATIONS
[0001] This is a continuation of PCT Application Serial Number PCT/US01/29056, filed Sep. 18, 2001, which claims the benefit of U.S. Provisional Application Serial No. 60/233,594, filed Sep. 18, 2000, the entirety of all these applications are hereby incorporated herein by reference.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60233594 |
Sep 2000 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/US01/29056 |
Sep 2001 |
US |
Child |
10391217 |
Mar 2003 |
US |