Patent Application
20080180014
(a) Field of the Invention
The present invention is related to a heat sink, and more particular, to one that is adapted to a light emitting diode to effectively promoting heat dissipation results.
(b) Description of the Prior Art
Whereas a light emitting diode (LED) is the device featuring the least complicated and most popularly applied in a photo-electronic semiconductor, the work principle of the LED relates to an operation on a PN junction of positive bias. With the positive bias, massive electric holes are inputted into the P side while massive electrons are injected into the N side. Both of these electric holes and electrons from both are as will respectively release small amount of carriers to the other side in a void are a so that at the moment when massive carriers are incorporated to each other in the void are a, energy system equivalent photons are eradiated to produce light emitting effects. The application range of the light emitting diode has transformed from indicator with comparatively weaker light emitting efficiency up to lighting fixtures with high luminance including highly powerful intensity of traffic signs, interior and exterior lighting of automobiles, and commercial billboards in a fast and wide-spreading development. Breakthroughs achieved in promoting the light emitting effects have been reported on after another; yet the problem of dissipation of high heat generated during the light emitting fails an effective solution due to that the LED is packed in a transparent colloid. As a result, once electrically conducted, resistance drops to bring down the luminance due to failure in effective dissipation of the heat. Therefore, how to effective cool down the temperature of the crystal when electrically conducted so to increase light emitting efficiency, improve luminance, and extend longer service life has become an issue pending urgent solution in the trade.
As illustrated in
A heat sink 23 is fixed using a thermal adhesive 22 to where below the circuit board 21 of the LED 1 so that heat generated by the working LED 1 is transmitted by the thermal adhesive 22 to the heat sink 23 for multiple fins allowing a greater surface are a disposed on the heat sink to contact the ambient air for fast heat dissipation. However, it is impossible to effectively and completely dissipate the heat generated from the LED 1 since it indirectly contacts the heat sink 23 via the thermal adhesive 22 to transmit the heat.
The primary purpose of the present invention is to provide a heat sink for an LED to effectively dissipate the heat. To achieve the purpose, the LED is disposed on a circuit board and a through hole is provided to the circuit board at where in opposition to that of the LED; a heat sink is disposed in the through hole and secured in position in relation to the circuit board by means of the through hole while permitting direct contact the LED for the heat generated by the working LED to be effectively dissipated from the heat sink.
Referring to
A through hole 32 is disposed on the circuit board 31 corresponding to where the light-emitting chip 41 is located. The through hole 32 is inserted with a heat dissipation means to directly contact and cool the light emitting chip and cool it. The heat sink means relates to a heat sink 51 made of metal (aluminum or copper), ceramic compound, graphite compound or polymer admixed with metal oxides. The heat sink 51 penetrates into the through hole 32 to define a locating portion 511, a heat dissipation portion 512 providing a greater contact surface for heat dissipation extends further from the locating portion 511. A locating means, e.g., an adhesive 52, is provided to where between the through hole and the heat sink 51 to secure the heat sink 51 as illustrated in
In practice, the heat sink 51 is secured to the circuit board 31 in position by means of the through hole 32 so to direct contact the light-emitting chip 41. Whereas the heat sink 51 is provided with a heat dissipation portion 512 with a greater contact surface to permit the heat generated from the working light emitting diode 4 to be effectively dissipated, thus for the light emitting chip 41 when electrically conducted to effectively lower its temperature, and in turn promotes its light emitting power, increase its luminance and extend its service life.
As illustrated in
Now referring to
The prevent invention provides an improved structure of a light emitting diode heat sink, and the application for a utility patent is duly filed accordingly. However, it is to be noted that the preferred embodiments disclosed in the specification and the accompanying drawings are not limiting the present invention; and that any construction, installation, or characteristics that is same or similar to that of the present invention should fall within the scope of the purposes and claims of the present invention.
