using means for thermal conduction connection in the thickness direction of the substrate

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H05K1/0204

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0204using means for thermal conduction connection in the thickness direction of the substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embeddable electrically insulating thermal connector and circuit bo...
- Patent number 12,200,853
- Issue date Jan 14, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,193,145
- Issue date Jan 7, 2025
- Kyocera Corporation
- Yukio Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,144
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yukio Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High powered RF part for improved manufacturability
- Patent number 12,176,592
- Issue date Dec 24, 2024
- TTM Technologies Inc.
- Michael Len
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal Interface Material (TIM) filling structure for high warpage...
- Patent number 12,156,324
- Issue date Nov 26, 2024
- Cisco Technology, Inc.
- Yongguo Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assemblies having embedded power electronics devices
- Patent number 12,144,158
- Issue date Nov 12, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control of a compressor, compressor and cooling equipment
- Patent number 12,144,153
- Issue date Nov 12, 2024
- NIDEC GLOBAL APPLIANCE BRASIL LTDA.
- Felipe Guilherme Stein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic interference shielding and thermal management syste...
- Patent number 12,137,515
- Issue date Nov 5, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation apparatus and methods for UV-LED photoreactors
- Patent number 12,134,572
- Issue date Nov 5, 2024
- The University of British Columbia
- Fariborz Taghipour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory card and memory system
- Patent number 12,136,606
- Issue date Nov 5, 2024
- Kioxia Corporation
- Yuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-OLED display module thermal management
- Patent number 12,127,430
- Issue date Oct 22, 2024
- Meta Platforms Technologies, LLC
- Giti Karimi Moghaddam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board with thermally conductive connection to a he...
- Patent number 12,127,329
- Issue date Oct 22, 2024
- HELLA GMBH & CO. KGAA
- Dirk Bösch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of an electronic board and a heat sink, and motor-fan unit...
- Patent number 12,108,519
- Issue date Oct 1, 2024
- Valeo Systemes Thermiques
- Ismaël Franco
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interposer for electronic device
- Patent number 12,108,576
- Issue date Oct 1, 2024
- Meta Platforms Technologies, LLC
- Michael Nikkhoo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wireless controllable lighting device
- Patent number 12,104,776
- Issue date Oct 1, 2024
- Lutron Technology Company LLC
- Ryan M. Bocock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixing structure
- Patent number 12,096,550
- Issue date Sep 17, 2024
- DTECH PRECISION INDUSTRIES CO., LTD.
- Ting-Jui Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics device assemblies including dual graphite layers...
- Patent number 12,096,596
- Issue date Sep 17, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for delivering power to semiconductors
- Patent number 12,088,208
- Issue date Sep 10, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated circuit board
- Patent number 12,089,342
- Issue date Sep 10, 2024
- Mitsubishi Materials Corporation
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,075,558
- Issue date Aug 27, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhaozheng Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink integrated insulating circuit board
- Patent number 12,068,219
- Issue date Aug 20, 2024
- Mitsubishi Materials Corporation
- Toyo Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for and apparatuses of a circuit board cooling device
- Patent number 12,069,795
- Issue date Aug 20, 2024
- Aptiv Technologies AG
- Frank H. Adam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier board and power module using same
- Patent number 12,028,969
- Issue date Jul 2, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with thermal pad
- Patent number 12,021,019
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with active heat transfer
- Patent number 12,016,110
- Issue date Jun 18, 2024
- Microsoft Technology Licensing, LLC
- Kang-Ming Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective enclosure for an electronic device
- Patent number 12,016,111
- Issue date Jun 18, 2024
- Western Digital Technologies, Inc.
- Chun Sean Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation module and electronic device having the same
- Patent number 12,007,816
- Issue date Jun 11, 2024
- ASUSTeK COMPUTER Inc.
- Dun-Hao Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low inductance power module with vertical power loop structure and...
- Patent number 12,004,331
- Issue date Jun 4, 2024
- OHIO STATE INNOVATION FOUNDATION
- Xintong Lyu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC SYSTEM ASSEMBLY
- Publication number 20240422893
- Publication date Dec 19, 2024
- EPIRUS, INC.
- Shawn Warren Merritt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS
- Publication number 20240414837
- Publication date Dec 12, 2024
- Bitmain Technologies Inc.
- Shitao TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240407077
- Publication date Dec 5, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe Waltrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRELESS CONTROLLABLE LIGHTING DEVICE
- Publication number 20240401791
- Publication date Dec 5, 2024
- Lutron Technology Company LLC
- Ryan M. Bocock
- F21 - LIGHTING
Information Patent Application
GRAPHENE INTEGRATED CORE AND ASSOCIATED METHODS FOR THERMAL MANAGEM...
- Publication number 20240397604
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...
- Publication number 20240389237
- Publication date Nov 21, 2024
- IndiaVPSemiconductor Pvt Ltd.
- VIJAY BOLLOJU BOLLOJU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20240373557
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT ASSEMBLY, UNIT, AND LIGHT MODULE FOR A MOTOR VEHICLE LIGHTI...
- Publication number 20240373542
- Publication date Nov 7, 2024
- HELLA GmbH & Co. KGaA
- Sebastian BARTSCHER
- F21 - LIGHTING
Information Patent Application
COLD PLATE HAVING OPENING AND RELATED SYSTEMS
- Publication number 20240357729
- Publication date Oct 24, 2024
- Tesla, Inc.
- Mohamed Haitham Helmy Nasr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20240347441
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELE...
- Publication number 20240332121
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION FROM ACTIVE DEVICES CONNECTED TO CONNECTORS
- Publication number 20240334590
- Publication date Oct 3, 2024
- Reflex Photonics, Inc.
- David Robert Rolston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board And Method For Soldering A Chip Housing In A...
- Publication number 20240292514
- Publication date Aug 29, 2024
- LISA DRAXLMAIER GMBH
- Andreas Brinkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20240292513
- Publication date Aug 29, 2024
- Sumitomo Wiring Systems, Ltd.
- Hideki Goto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROUGHNESS EDGE OF A HEAT SINK
- Publication number 20240284587
- Publication date Aug 22, 2024
- Dell Products L.P.
- ENOCH CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND DISPLAY MODULE
- Publication number 20240251501
- Publication date Jul 25, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jiahua WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONIC DEVICE ASSEMBLIES HAVING HEAT SPREADERS AND ELECTR...
- Publication number 20240244805
- Publication date Jul 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY WITH MULTIPLE CONDUCTION PATHS
- Publication number 20240244739
- Publication date Jul 18, 2024
- Milwaukee Electric Tool Corporation
- Joshua D. Widder
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
BI-DIRECTIONAL POWER CONVERTER MODULE
- Publication number 20240203635
- Publication date Jun 20, 2024
- Navitas Semiconductor Limited
- Hao SUN
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC ASSEMBLY, LIGHT MODULE, AND METHOD FOR CONSTRUCTING AN E...
- Publication number 20240206047
- Publication date Jun 20, 2024
- HELLA GmbH & Co. KGaA
- Sebastian BARTSCHER
- F21 - LIGHTING
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20240206048
- Publication date Jun 20, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING OF ULTRASOUND ENERGIZERS MOUNTED ON PRINTED CIRCUIT BOARDS
- Publication number 20240196514
- Publication date Jun 13, 2024
- Sofwave Medical Ltd.
- Ariel SVERDLIK
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240179829
- Publication date May 30, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES
- Publication number 20240130093
- Publication date Apr 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS DEVICE ASSEMBLIES INCLUDING DUAL GRAPHITE LAYERS...
- Publication number 20240130076
- Publication date Apr 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SOURCE SUPPORT ASSEMBLY
- Publication number 20240107672
- Publication date Mar 28, 2024
- VALEO VISION
- Sebastian KRICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20240106320
- Publication date Mar 28, 2024
- Mitsubishi Electric Corporation
- Ryoma HAYASHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE WITH ANTENNA
- Publication number 20240088083
- Publication date Mar 14, 2024
- Fujitsu Limited
- Junya IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With an Embedded Thermally Conductive Block and M...
- Publication number 20240090118
- Publication date Mar 14, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20240064940
- Publication date Feb 22, 2024
- VALEO COMFORT AND DRIVING ASSISTANCE
- Matthias Wellens
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using means for thermal conduction connection in the thickness direction of the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embeddable electrically insulating thermal connector and circuit bo...

Substrate for mounting electronic element, electronic device, and e...

Module

High powered RF part for improved manufacturability

Thermal Interface Material (TIM) filling structure for high warpage...

Power electronics assemblies having embedded power electronics devices

Electronic control of a compressor, compressor and cooling equipment

Electromagnetic interference shielding and thermal management syste...

Heat dissipation apparatus and methods for UV-LED photoreactors

Memory card and memory system

Micro-OLED display module thermal management

Flexible circuit board with thermally conductive connection to a he...

Assembly of an electronic board and a heat sink, and motor-fan unit...

Thermal interposer for electronic device

Wireless controllable lighting device

Fixing structure

Manufacturing method of insulated metal substrate

Power electronics device assemblies including dual graphite layers...

Panel molded electronic assemblies with multi-surface conductive co...

Method and apparatus for delivering power to semiconductors

Insulated circuit board

Printed circuit board

Heat sink integrated insulating circuit board

Methods for and apparatuses of a circuit board cooling device

Carrier board and power module using same

Semiconductor device package with thermal pad

Electronic device with active heat transfer

Protective enclosure for an electronic device

Heat dissipation module and electronic device having the same

Low inductance power module with vertical power loop structure and...

Patents Applicationslast 30 patents

ELECTRONIC SYSTEM ASSEMBLY

COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

WIRELESS CONTROLLABLE LIGHTING DEVICE

GRAPHENE INTEGRATED CORE AND ASSOCIATED METHODS FOR THERMAL MANAGEM...

SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

SUPPORT ASSEMBLY, UNIT, AND LIGHT MODULE FOR A MOTOR VEHICLE LIGHTI...

COLD PLATE HAVING OPENING AND RELATED SYSTEMS

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELE...

HEAT DISSIPATION FROM ACTIVE DEVICES CONNECTED TO CONNECTORS

Printed Circuit Board And Method For Soldering A Chip Housing In A...

CIRCUIT STRUCTURE

ROUGHNESS EDGE OF A HEAT SINK

FLEXIBLE CIRCUIT BOARD AND DISPLAY MODULE

POWER ELECTRONIC DEVICE ASSEMBLIES HAVING HEAT SPREADERS AND ELECTR...

PRINTED CIRCUIT BOARD ASSEMBLY WITH MULTIPLE CONDUCTION PATHS

BI-DIRECTIONAL POWER CONVERTER MODULE

ELECTRONIC ASSEMBLY, LIGHT MODULE, AND METHOD FOR CONSTRUCTING AN E...

Thermal Management in Circuit Board Assemblies

COOLING OF ULTRASOUND ENERGIZERS MOUNTED ON PRINTED CIRCUIT BOARDS

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES

POWER ELECTRONICS DEVICE ASSEMBLIES INCLUDING DUAL GRAPHITE LAYERS...

LIGHT SOURCE SUPPORT ASSEMBLY

POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE WITH ANTENNA

Component Carrier With an Embedded Thermally Conductive Block and M...

ELECTRONIC ASSEMBLY