TREA

using means for thermal conduction connection in the thickness direction of the substrate

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Industry

  • CPC
  • H05K1/0204
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0204using means for thermal conduction connection in the thickness direction of the substrate
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