Patent Application
20130148337
1. Technical Field
The present disclosure relates to lamps, and more particularly to an LED (light emitting diode) lamp having stable and reliable performance.
2. Description of Related Art
LEDs have many advantages, such as high luminosity, low operational voltage, low power consumption, easy driving, long-term reliability, environmental friendliness for not having to use mercury (Hg), and high impact resistance, which have LEDs to be widely used as light sources.
LED illumination devices, such as streetlight, spotlight, and searchlight, include an LED module and a metallic housing receiving the LED module therein. The heavy weight of the metallic housing is a disadvantage for disassembling or repairing of the devices, especially for the streetlight which is mounted on a lamp pole. In addition, the metallic housing is easy to be corroded, therefore the lifespan of the metallic housing is shortened and stability of the LED illumination device is adversely affected.
Accordingly, it is desirable to provide an LED lamp which can overcome the described limitations.
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Each chip 121 is made of phosphide such as AlxInyGa(1-x-y)P (0≦x≦1, 0≦y≦1, x+y≦1), arsenide such as AlInGaAs, oxide such as ZnO, nitride such as GaN, or a mixture thereof. The material of the chip 121 can emit light with wavelength varied between yellow light to red light. Preferably, the material of the chip 121 is a nitride compound (InxAlyGa(1-x-y)N, 0≦x≦1, 0≦y≦1, x+y≦1). The number of the chips 121 is nine in this embodiment. The chips 121 are spaced from each other and arranged in three parallel rows. The chips 121 of each row are electrically connected in series. The chips 121 of adjacent rows are electrically connected in parallel.
The base 122 includes a patterned metal layer 61 formed on a top surface thereof. The chips 121 are formed on the patterned metal layer 61 and electrically connected to the patterned metal layer 61 via wire bonding, in which two gold wires 323 are respectively soldered to connect terminals 3212, 3213 of the chip 121 and the patterned metal layer 61. Two spaced electrodes 123 are formed on the top surface of the base 122 to electrically connect a power source (not shown) and the chips 121 whereby power source can be supplied to the chips 121. The base 122 is electrically insulated from the chips 121 and absorbs heat generated by the chips 121.
The base 122 is an intrinsic semiconductor or a pure semiconductor. A carrier concentration of the base 122 is not larger than 5×106 cm−3. Preferably, the carrier concentration of the base 122 is not larger than 2×106 cm−3. The base 122 is made of spinelle, SiC, Si, ZnO, GaN, GaAs, GaP, AlN, or a mixture thereof. In other embodiment, the base 122 may be a diamond. The chips 121 are mounted on the base 122 by Ag gluing or eutectic bonding.
The packaging layer 124 is made of transparent, electrically insulating materials, such as silicone, epoxy, quartz, or glass. The packaging layer 124 encapsulates the LED chips 121 therein. The electrodes 123 exposes outwards from the packaging layer 124.
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The LED module 12 is received in the first receiving chamber 111 and mounted on a central portion of a top surface of the supporting plate 113. The power module 15 is a cylinder and received in the second receiving chamber 112. The power module 15 electrically connects the electrodes 123 of the LED module 12 through wires (not shown) extending through the through holes 114. The power module 15 includes an AC-AC transformer, an AC-DC Converter, a DC-DC transformer, and a high power drive integrate circuit. The power module 15 transforms the alternating current to the directing current.
The connecting member 14 is a standard socket and mounted on a bottom end of the main body 11. The connecting member 14 seals the second receiving chamber 112 at the bottom end of the main body 11. The connecting member 14 electrically connects a power source (not shown) to drive the LED module 12 via the power module 15.
The cover 13 is transparent and has a hollow bowl-shaped configuration. The cover 13 is mounted on a top end of the main body 11 and seals the first receiving chamber 111 at the top end of the main body 11.
In this embodiment, the main body 11 of the LED lamp 10 is ceramic, the weight of LED lamp 10 is lighter than the conventional LED illumination device, thus the LED lamp 10 is easy to be disassembled or repaired. In addition, the ceramic is not easy to be corroded or expanded, therefore the LED lamp 10 has stable and reliable performance. Furthermore, the main body 11 of the ceramic is safe for users because of its electrical insulation.
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The clips 24 extend from the bottom surface of the covering portion 231 and respectively align with the through holes 114 of the supporting plate 113 of the main body 11. Each clip 24 is elastic and includes a cylindrical connecting pole 241 extending from the covering portion 231 and a cone-shaped engaging portion 242 formed on a bottom end of the connecting pole 241. A diameter of the engaging portion 242 decreases from a top to bottom. A diameter of a top end of the engaging portion 242 is larger than that of the connecting pole 241 and the through hole 114. A diameter of the connecting pole 241 is equal to or slightly less than that of the through hole 114. The connecting poles 241 respectively extend through the through holes 114 and the engaging portions 242 extend into the heat conductive material 115 and elastically abut against and under the supporting plate 113. A central portion of a bottom end of the engaging portion 242 defines a recess 2421 therein to enhance an elastic deformation capability of the engaging portion 242.
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It is to be understood, however, that even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
