Patent Application
20230126847
The subject matter herein generally relates to imaging, to a lens module and an electronic device having the lens module.
Electronic devices, such as mobile phones or tablet computers, may have lens module. Such a lens module may include a circuit board, a photosensitive chip mounted on the circuit board, and a lens disposed above and facing the photosensitive chip. When the electronic device becomes smaller, a distance between the lower surface of the lens and the upper surface of the photosensitive chip (that is, a back focal length of the lens) needs to be reduced. However, the back focal length of the existing lens modules may be large, thereby affecting a height of the lens module, and miniaturization is problematic.
Implementations of the present disclosure will now be described, by way of embodiments, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale, and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
In at least one embodiment, the metal board 10 includes a metal body 101 and a convex box 102 located on a surface of the metal body 101. The convex box 102 protrudes outwards from a portion of surface of the metal body 101. In at least one embodiment, the metal board 10 may be rectangular. In at least one embodiment, the metal board 10 is made of steel.
In at least one embodiment, the circuit board 20 may be a flexible circuit board, a rigid circuit board, or a rigid-flexible circuit board. In an embodiment, the circuit board 20 is a rigid-flexible circuit board, including a first rigid portion 201, a second rigid portion 202, and a flexible portion 203 between the first rigid portion 201 and the second rigid portion 202.
The first rigid portion 201 includes a first through hole 21 passing through the first rigid portion 201. The first rigid portion 201 is mounted on the surface of the metal board 10, and the convex box 102 is received in the first through hole 21. A plurality of electronic components 22 are mounted on the first rigid portion 201. The electronic components 22 may be at least one of resistors, capacitors, diodes, triodes, relays, and electrically erasable programmable read-only memory (EEPROM).
A reinforcing board 23 is mounted on the second rigid portion 202. In at least one embodiment, the reinforcing board 23 and the plurality of electronic components 22 may be mounted on a same surface of the circuit board 20. Referring to
Referring to
The base 40 is mounted on the first rigid portion 201. In at least one embodiment, the base 40 may be rectangular. The base 40 includes a second through hole 41 passing through the base 40. The second through hole 41 faces the first through hole 21. That is, the second through hole 41 faces the photosensitive chip 30. The base 40 further includes a groove 42. The base 40 includes a surface 401 away from the circuit board 20, and a portion of the surface 401 surrounding the second through hole 41 is recessed inwardly to form the groove 42. In at least one embodiment, the base 40 may be made of plastic.
The optical filter 50 is received in the groove 42. The optical filter 50 faces the photosensitive chip 30. In at least one embodiment, the optical filter 50 may be rectangular.
The adhesive layer 60 bonds the base 40 to the first rigid portion 201. The adhesive layer 60 improves the binding force between the base 40 and the first rigid portion 201, to enhance the stability between the base 40 and the first rigid portion 201.
The voice coil motor 70 is installed on the surface 401 of base 40 facing away from the circuit board 20. In at least one embodiment, the voice coil motor 70 may be rectangular. The voice coil motor 70 includes a receiving hole 71 passing through the voice coil motor 70. In at least one embodiment, a first thread 711 is formed on the inner surface of the receiving hole 71.
The lens 80 is installed in the receiving hole 71 of the voice coil motor 70. In at least one embodiment, a second thread 81 is formed on an outer surface of the lens 80. The first thread 711 engages with the second thread 81 to fix the lens 80 on the voice coil motor 70.
Referring to
In the present disclosure, the metal board 10 includes the convex box 102, and the photosensitive chip 30 is mounted on the convex box 102. Thus, the distance between the photosensitive chip 30 and the lens 80 is reduced. Namely, the back focal length of the lens module 100 can be reduced, which can reduce the total size of the electronic device 200.
In addition, due to a high thermal conductivity of the metal board 10, the heat generated by the photosensitive chip 30 can be dissipated through the metal board 10. Thereby, the heat dissipation efficiency of the lens module 100 can be improved. In addition, the metal board 10 has a high strength, thus improving the strength and reliability of the lens module 100.
It is to be understood, even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only; changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present embodiments to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202111257958.5 | Oct 2021 | CN | national |
