This application is related to U.S. patent application Ser. No. 12/204,686 (granted as U.S. Pat. No. 7,646,943), Ser. Nos. 12/648,942, 12/270,233, 12/472,264, 12/472,271, 12/478,598, 12/573,582, 12/575,221, 12/633,323, 12/633,318, 12/633,313, 12/633,305, 12/621,497, 12/633,297, 61/266,064, 61/357,429, 61/306,421, and 61/306,421, the disclosures of which are hereby incorporated by reference in their entirety.
Nanostructures often exhibit fascinating physical properties not present in their bulk counterparts. Optical properties of nanostructures have been one of the recent research focuses. Tuning optical properties of nanostructures would facilitate their applications in the semiconductor, optics, and consumer electronics industry. In one example, optical properties of nanostructures can be controlled by their chemical composition. Chemical doping can change electronic structures of the materials semiconductor nanostructures are composed of, which in turn changes their interaction with light. In another example, arranging nanostructures into a regular lattice can yield optical properties individual nanostructures lack. However, these conventional approaches often require complex chemical synthesis or post-synthesis manipulation, and thus are less robust against minute variations of conditions and cannot easily and accurately position nanostructures in a functional device. In contrast, the approach described herein overcomes these problems of the conventional approaches by harnessing small physical sizes of nanostructures and a top-down fabrication process (i.e., part of a piece of bulk material is removed until desired nanostructures are achieved).
Described herein is a nanowire array, comprising a substrate and a plurality of nanowires extending essentially perpendicularly from the substrate; wherein: a refractive index of the nanowires is at least two times of a refractive index of a cladding of the nanowires. Preferably a number density of the nanowires is at most about 1.8/μm2.
The nanowire array can be fabricated using a method comprising: (a) coating the substrate with a resist layer; (b) generating a pattern of dots in the resist layer using a lithography technique; (c) developing the pattern in the resist layer; (d) depositing a mask layer; (e) lifting off the resist layer; (f) forming the nanowires by dry etching the substrate; (g) optionally removing the mask player; wherein shapes and sizes of the dots determine the cross-sectional shapes and sizes of the nanowires.
The nanowire array can be used as a photodetector, a submicron color filter, a static color display or a dynamic color display.
Described herein is a nanowire array, according to an embodiment, comprising a substrate and a plurality of nanowires extending essentially perpendicularly from the substrate; wherein a refractive index of the nanowires is at least two times of a refractive index of a cladding of the nanowires. A number density of the nanowires preferably is at most about 1.8/μm2.
According to an embodiment, a nanowire array comprises a substrate and a plurality of nanowires extending essentially perpendicularly from the substrate; wherein the nanowire array is operable as a submicron color filter. A “submicron color filter” as used herein means that an optical filter that allows light of certain wavelengths to pass through and optical elements in the filter are less than a micron at least in one dimension.
According an embodiment, a nanowire array comprises a substrate and a plurality of nanowires extending essentially perpendicularly from the substrate; wherein the nanowires do not substantially couple. The term “substantially couple” as used herein means the nanowires collectively interact with incident light such that spectral properties (e.g., reflectance spectrum) of the nanowire array are distinct from spectral properties of individual nanowire in the nanowire array. The term “the nanowires do not substantially couple” as used herein means one nanowire does not affect the properties of a neighboring nanowire. For example, when the pitch of the nanowires is changed and there is no color change of the light absorbed or reflected by the nanowire, then the nanowires do not substantially couple.
According an embodiment, a nanowire array comprises a substrate and a plurality of nanowires extending essentially perpendicularly from the substrate; the nanowire array does not appear black to naked eye. The term “naked eye” as used herein means human visual perception that is unaided by enhancing equipment. The term “the nanowire array does not appear black to naked eye” as used herein means that the reflected visible light from the nanowire is substantially zero, which could happen under certain conditions based on the nanowire length, radius and pitch, as well as the optical properties of the substrate.
According to an embodiment, a nanowire as used herein means a structure that has a size constrained to at most 1000 nm in two dimensions and unconstrained in the other dimension. An array as used herein means a systematic arrangement of objects such as a grid. The term “nanowires extending essentially perpendicularly from the substrate” as used herein means that angles between the nanowires and the substrate are from 85° to 90°. Cladding as used herein means a substance surrounding the nanowires, which can be vacuum, air, water, etc. A refractive index of the nanowires as used herein means a ratio of the speed of light in vacuum relative to that in the nanowires. A number density of the nanowires as used herein means that an average number of nanowires per unit area of the substrate.
According to an embodiment, each of the nanowires in the nanowire array has an essentially uniform chemical composition from one end of the nanowire to an opposite end of the nanowire in a longitudinal direction of the nanowire.
According to an embodiment, chemical composition of the nanowires as used herein means the simplest whole number ratio of atoms of each element present in the nanowires. The term “essentially uniform chemical composition” as used herein means that the ratio of atoms varies at most 3%, preferably at most 1%. A longitudinal direction of the nanowire as used herein means a direction pointing from one end of the nanowire farthest from the substrate to one end of the nanowire nearest to the substrate.
According to an embodiment, each of the nanowires in the nanowire array is single crystalline, multi-crystalline or amorphous. That the nanowire is single crystalline as used herein means that the crystal lattice of the entire nanowire is continuous and unbroken throughout the entire nanowire, with no grain boundaries therein. That the nanowire is multi-crystalline as used herein means that the nanowire comprises grains of crystals separated by grain boundaries. That the nanowire is amorphous as used herein means that the nanowire has a disordered atomic structure.
According to an embodiment, the nanowires in the nanowire array are composed of a semiconductor or an electrically insulating material. A conductor can be a material with essentially zero band gap. The electrical conductivity of a conductor is generally above 103 S/cm. A semiconductor can be a material with a finite band gap up to about 3 eV and general has an electrical conductivity in the range of 103 to 108 S/cm. An electrically insulating material can be a material with a band gap greater than about 3 eV and generally has an electrical conductivity below 108 S/cm.
According to an embodiment, the nanowires in the nanowire array, comprise one or more materials selected from the group consisting of Si, Ge, GaN, GaAs, SiO2, and Si3N4.
According to an embodiment, radii of the nanowires in the nanowire array are from 10 to 1000 nm; lengths of the nanowires are from 0.01 to 10 μm.
According to an embodiment, the nanowires and the substrate in the nanowire array have substantially the same chemical composition. The term “same chemical composition” as used herein means that the substrate and the nanowires are identical materials. The term “substantially same” here means the chemical composition differs by no more than 3%, preferably by no more than 1%.
According to an embodiment, the nanowires and the substrate in the nanowire array are single crystalline and the lattices of the nanowires and the lattice of the substrate are continuous at interfaces therebetween. Namely, there is no grain boundary at the interfaces between the nanowires and the substrate.
According to an embodiment, the nanowires in the nanowire array are arranged in a predetermined pattern such as a rectangular grid, a square grid, concentric circle, hexagonal grid.
According to an embodiment, a distance of a nanowire to a nearest neighbor of the nanowire along a direction parallel to the substrate (also known as “pitch” or “pitch distance”) is at least 800 nm, preferably at most 10000 nm.
According to an embodiment, a reflectance spectrum of the nanowire array has a dip; the dip position shifts to shorter wavelength with decreasing radii of the nanowires; and the dip position is independent from a distance of a nanowire to a nearest neighbor of the nanowire along a direction parallel to the substrate. A reflectance spectrum as used herein means a ratio of the intensity of reflected light at a certain wavelength to the intensity of incident light at the same wavelength, as a function of wavelength. A “dip” in a reflectance spectrum as used herein means that a region in the reflectance spectrum wherein the reflectance is smaller than the reflectance in surrounding regions of the reflectance spectrum. The “dip position” as used herein means the wavelength in the dip at which the reflectance is a minimum.
According to an embodiment, a reflectance spectrum of the nanowire array is independent from incident angles of illumination.
According to an embodiment, an incident angle as used herein means the angle between a ray of light incident on the substrate and the line perpendicular to the substrate at the point of incidence.
According to an embodiment, a method of fabricating the nanowire array comprises: (a) coating the substrate with a resist layer; (b) generating a pattern of dots in the resist layer using a lithography technique; (c) developing the pattern in the resist layer; (d) depositing a mask layer; (e) lifting off the resist layer; (f) forming the nanowires by dry etching the substrate; (g) optionally removing the mask player; wherein shapes and sizes of the dots determine the cross-sectional shapes and sizes of the nanowires.
According to an embodiment, a resist layer as used herein means a thin layer used to transfer a pattern to the substrate which the resist layer is deposited upon. A resist layer can be patterned via lithography to form a (sub)micrometer-scale, temporary mask that protects selected areas of the underlying substrate during subsequent processing steps. The resist is generally proprietary mixtures of a polymer or its precursor and other small molecules (e.g. photoacid generators) that have been specially formulated for a given lithography technology. Resists used during photolithography are called photoresists. Resists used during e-beam lithography are called e-beam resists. “Dots” as used herein means discrete regions. A lithography technique can be photolithography, e-beam lithography, holographic lithography. Photolithography is a process used in microfabrication to selectively remove parts of a thin film or the bulk of a substrate. It uses light to transfer a geometric pattern from a photo mask to a light-sensitive chemical photo resist, or simply “resist,” on the substrate. A series of chemical treatments then engraves the exposure pattern into the material underneath the photo resist. In complex integrated circuits, for example a modern CMOS, a wafer will go through the photolithographic cycle up to 50 times. E-beam lithography is the practice of scanning a beam of electrons in a patterned fashion across a surface covered with a film (called the resist), (“exposing” the resist) and of selectively removing either exposed or non-exposed regions of the resist (“developing”). The purpose, as with photolithography, is to create very small structures in the resist that can subsequently be transferred to the substrate material, often by etching. It was developed for manufacturing integrated circuits, and is also used for creating nanotechnology artifacts. Holographic lithography (also known as Interference lithography) is a technique for patterning regular arrays of fine features, without the use of complex optical systems or photomasks. The basic principle is the same as in interferometry or holography. An interference pattern between two or more coherent light waves is set up and recorded in a recording layer (photoresist). This interference pattern consists of a periodic series of fringes representing intensity minima and maxima. Upon post-exposure photolithographic processing, a photoresist pattern corresponding to the periodic intensity pattern emerges. A mask layer as used herein means a layer that protects an underlying portion of the substrate from being etched. “Dry etching” as used herein means an etching technique without using a liquid etchant.
According to an embodiment, a method using the nanowire array 1 as a photodetector comprises: shining light on the nanowire array; measuring photocurrent on the nanowires; measuring photocurrent on the substrate; comparing the photocurrent on the nanowires to the photocurrent on the substrate. A photodetector as used herein means a sensor of light.
According to an embodiment, a method using the nanowire array as a static color display comprises: determining locations and radii of the nanowires from an image to be displayed; fabricating the nanowires with the determined radii at the determined locations on the substrate; shining white light on the nanowire array.
According to an embodiment, a dynamic color display comprises the nanowire array, an array of independently addressable white light sources on a side of the substrate opposite the nanowires, wherein each white light source corresponds to and is aligned in the substrate plane with one of the nanowires. “Independently addressable white light sources” as used herein mean that each source can be controlled, adjusted, turned on or off, independently from other sources. “White light” as used herein means a combination of visible light of different wavelengths in equal proportions.
According to an embodiment, the white light sources in the dynamic color display are white LEDs. LEDs are also known as light-emitting diodes. There are two primary ways of producing whitelight using LEDs. One is to use individual LEDs that emit three primary colors—red, green, and blue—and then mix all the colors to form white light. The other is to use a phosphor material to convert monochromatic light from a blue or UV LED to broad-spectrum white light, much in the same way a fluorescent light bulb works.
According to an embodiment, in the dynamic color display, a first group of the nanowires have a first radius, a second group of the nanowires have a second radius, and a third group of the nanowires have a third radius, wherein the first group of the nanowires only allow red light to pass, the second group of the nanowires only allow green light to pass, and the third group of the nanowires only allow blue light to pass.
According to an embodiment, a submicron color filter comprising the nanowire array, wherein each nanowire is placed on a photodetector, wherein only incident light with wavelengths in a dip of a reflectance spectrum of each nanowire is allowed reach the photodetector below. A method using the submicron color filter comprises shining white light on the nanowire array, detecting transmitted light below the nanowires.
According to an embodiment, a ratio of a radius of the nanowires to a pitch of the nanowires is at most 0.5.
The reflectance spectra can be measured with focused or collimated incident illumination. In an exemplary measurement as shown in
Wavelength selective reflection of the nanowire array 100 as shown in
The position of the dip of the reflectance spectrum is determined by the radius of the nanowire 120.
In each trace, neff increases sharply and approaches nSi (refractive index of silicon) for wavelengths shorter than the corresponding dip position in
A method of fabricating the nanowire array 100 includes (a) coating the substrate 110 with a resist layer (e.g. e-beam resist, photo resist, etc.); (b) generating a pattern of dots in the resist layer using a lithography technique (e.g. photolithography, e-beam lithography, holographic lithography, etc.); (c) developing the pattern in the resist layer; (d) depositing a mask layer (e.g. Al, Cr, SiO2, Si3N4, Au, Ag, etc.); (e) lifting off the resist layer; (f) forming the nanowires 120 by dry etching the substrate 110; (g) optionally removing the mask player; wherein shapes and sizes of the dots determine the cross-sectional shapes and sizes of the nanowires 120. The resist can be poly(methyl methacrylate) (available from MicroChem located in Newton, Mass.). The mask layer can be aluminum deposited by a suitable technique such as e-beam evaporation, thermal evaporation, sputtering, etc. The mask layer can be about 40 nm thick. The substrate 110 can be a single crystalline silicon wafer. Dry etching can be conducted in an inductively coupled plasma-reactive ion etcher (such as those available from Surface Technology Systems, located at Redwood City, Calif.). An exemplary dry etching process includes alternating etch and deposition steps at room temperature, wherein 60 sccm of SF6 and 160 sccm of C4F8 gases were used therein, respectively. The mask layer can be removed using a suitable etchant (e.g. Type A aluminum etchant available from Transene Company Inc. located in Danvers, Mass.) or solvent (e.g. acid, base, or organic solvent). SEM images can be taken in an SEM such as Zeiss Ultra55 available from Carl Zeiss NTS located at Peabody, Mass.
A method using the nanowire array 100 as a photodetector comprises shining light on the nanowire array 100; measuring photocurrent on the nanowires 120; measuring photocurrent on the substrate 110; comparing the photocurrent on the nanowires 120 to the photocurrent on the substrate 110.
The nanowire array 100 can also be used as a submicron color filter. For example, each of the nanowires 120 in the nanowire array 100 can be placed on a photodetector. Only incident light with wavelengths in the dip of the reflectance spectrum of a nanowire can reach the photodetector below this nanowire. A method using the nanowire array 100 as a submicron color filter comprises shining white light on the nanowire array 100, detecting transmitted light below the nanowires 120.
A method using the nanowire array 100 as a static color display comprises: determining locations and radii of nanowires from an image to be displayed; fabricating the nanowires with the determined radii at the determined locations on the substrate; shining white light on the nanowire array. The word “static” here means that the display can only show one fixed image. By appropriate choice of individual nanowire placement and radius in the nanowire array 100, the nanowire array 100 can display a color image under white light illumination.
The nanowire array can also be used in a dynamic color display. The word “dynamic” here means that the display can display different images at different times. The dynamic color display, according to one embodiment, comprises the nanowire array 100, an array of independently addressable white light sources on a side of the substrate 110 opposite the nanowires 120, wherein each white light source corresponds to and is aligned in the substrate plane with one of the nanowires 120. The nanowires 120 can have predetermined radii and thus only allow light of desired wavelengths from the light sources to pass. For example,
While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated by the following claims.
Number | Name | Date | Kind |
---|---|---|---|
1918848 | Land | Apr 1929 | A |
3903427 | Pack | Sep 1975 | A |
4017332 | James | Apr 1977 | A |
4357415 | Hartman | Nov 1982 | A |
4387265 | Dalal | Jun 1983 | A |
4400221 | Rahilly | Aug 1983 | A |
4443890 | Eumurian | Apr 1984 | A |
4513168 | Borden | Apr 1985 | A |
4620237 | Traino | Oct 1986 | A |
4678772 | Segal | Jul 1987 | A |
4827335 | Saito | May 1989 | A |
4846556 | Haneda | Jul 1989 | A |
4880613 | Satoh | Nov 1989 | A |
4896941 | Hayashi | Jan 1990 | A |
4950625 | Nakashima | Aug 1990 | A |
4971928 | Fuller | Nov 1990 | A |
4972244 | Buffet | Nov 1990 | A |
5071490 | Yokota | Dec 1991 | A |
5081049 | Green | Jan 1992 | A |
5096520 | Faris | Mar 1992 | A |
5124543 | Kawashima | Jun 1992 | A |
5247349 | Olego | Sep 1993 | A |
5272518 | Vincent | Dec 1993 | A |
5311047 | Chang | May 1994 | A |
5347147 | Jones | Sep 1994 | A |
5362972 | Yazawa | Nov 1994 | A |
5374841 | Goodwin | Dec 1994 | A |
5391896 | Wanlass | Feb 1995 | A |
5401968 | Cox | Mar 1995 | A |
5449626 | Hezel | Sep 1995 | A |
5468652 | Gee | Nov 1995 | A |
5602661 | Schadt | Feb 1997 | A |
5612780 | Rickenbach | Mar 1997 | A |
5671914 | Kalkhoran | Sep 1997 | A |
5696863 | Kleinerman | Dec 1997 | A |
5723945 | Schermerhorn | Mar 1998 | A |
5747796 | Heard | May 1998 | A |
5767507 | Unul | Jun 1998 | A |
5798535 | Huang | Aug 1998 | A |
5844290 | Furumiya | Dec 1998 | A |
5853446 | Carre | Dec 1998 | A |
5857053 | Kane | Jan 1999 | A |
5877492 | Fujieda | Mar 1999 | A |
5880495 | Chen | Mar 1999 | A |
5885881 | Ojha | Mar 1999 | A |
5900623 | Tsang et al. | May 1999 | A |
5943463 | Unuma | Aug 1999 | A |
5968528 | Deckner | Oct 1999 | A |
6033582 | Lee | Mar 2000 | A |
6037243 | Ha et al. | Mar 2000 | A |
6046466 | Ishida et al. | Apr 2000 | A |
6074892 | Bowers et al. | Jun 2000 | A |
6100551 | Lee | Aug 2000 | A |
6270548 | Campbell | Aug 2001 | B1 |
6301420 | Greenaway | Oct 2001 | B1 |
6326649 | Chang | Dec 2001 | B1 |
6388243 | Berezin | May 2002 | B1 |
6388648 | Clifton | May 2002 | B1 |
6407439 | Hier | Jun 2002 | B1 |
6459034 | Muramoto et al. | Oct 2002 | B2 |
6463204 | Ati | Oct 2002 | B1 |
6542231 | Garrett | Apr 2003 | B1 |
6563995 | Keaton | May 2003 | B2 |
6566723 | Vook | May 2003 | B1 |
6680216 | Kwasnick et al. | Jan 2004 | B2 |
6709929 | Zhang | Mar 2004 | B2 |
6720594 | Rahn | Apr 2004 | B2 |
6771314 | Bawolek | Aug 2004 | B1 |
6805139 | Savas | Oct 2004 | B1 |
6812473 | Amemiya | Nov 2004 | B1 |
6904187 | Fischer et al. | Jun 2005 | B2 |
6927145 | Yang | Aug 2005 | B1 |
6960526 | Shah | Nov 2005 | B1 |
6967120 | Jang | Nov 2005 | B2 |
6969899 | Yaung | Nov 2005 | B2 |
6987258 | Mates | Jan 2006 | B2 |
6996147 | Majumdar | Feb 2006 | B2 |
7052927 | Fletcher | May 2006 | B1 |
7064372 | Duan | Jun 2006 | B2 |
7105428 | Pan | Sep 2006 | B2 |
7106938 | Baek et al. | Sep 2006 | B2 |
7109517 | Zaidi | Sep 2006 | B2 |
7153720 | Augusto | Dec 2006 | B2 |
7163659 | Stasiak | Jan 2007 | B2 |
7192533 | Bakkers | Mar 2007 | B2 |
7208783 | Palsule | Apr 2007 | B2 |
7230286 | Cohen | Jun 2007 | B2 |
7235475 | Kamins | Jun 2007 | B2 |
7241434 | Anthony | Jul 2007 | B2 |
7254151 | Lieber | Aug 2007 | B2 |
7262400 | Yaung | Aug 2007 | B2 |
7265328 | Mouli | Sep 2007 | B2 |
7272287 | Bise | Sep 2007 | B2 |
7285812 | Tang et al. | Oct 2007 | B2 |
7306963 | Linden | Dec 2007 | B2 |
7307327 | Bahl | Dec 2007 | B2 |
7311889 | Awano | Dec 2007 | B2 |
7330404 | Peng | Feb 2008 | B2 |
7335962 | Mouli | Feb 2008 | B2 |
7336860 | Cyr | Feb 2008 | B2 |
7358583 | Reznik | Apr 2008 | B2 |
7381966 | Starikov | Jun 2008 | B2 |
7388147 | Mulligan | Jun 2008 | B2 |
7416911 | Heath et al. | Aug 2008 | B2 |
7446025 | Cohen | Nov 2008 | B2 |
7462774 | Roscheisen | Dec 2008 | B2 |
7471428 | Ohara | Dec 2008 | B2 |
7491269 | Legagneux | Feb 2009 | B2 |
7507293 | Li | Mar 2009 | B2 |
7521322 | Tang et al. | Apr 2009 | B2 |
7524694 | Adkisson | Apr 2009 | B2 |
7582857 | Gruev | Sep 2009 | B2 |
7598482 | Verhulst | Oct 2009 | B1 |
7622367 | Nuzzo | Nov 2009 | B1 |
7626685 | Jin | Dec 2009 | B2 |
7646138 | Williams | Jan 2010 | B2 |
7646943 | Wober | Jan 2010 | B1 |
7647695 | MacNutt | Jan 2010 | B2 |
7649665 | Kempa et al. | Jan 2010 | B2 |
7655860 | Parsons | Feb 2010 | B2 |
7663202 | Wang | Feb 2010 | B2 |
7692860 | Sato | Apr 2010 | B2 |
7704806 | Chae | Apr 2010 | B2 |
7713779 | Firon | May 2010 | B2 |
7719678 | Kamins | May 2010 | B2 |
7719688 | Kamins | May 2010 | B2 |
7732769 | Snider | Jun 2010 | B2 |
7732839 | Sebe | Jun 2010 | B2 |
7736954 | Hussain | Jun 2010 | B2 |
7740824 | Godfried | Jun 2010 | B2 |
7790495 | Assefa et al. | Sep 2010 | B2 |
7888155 | Chen | Feb 2011 | B2 |
7902540 | Cohen | Mar 2011 | B2 |
7948555 | Kwon et al. | May 2011 | B2 |
8030729 | Quitoriano | Oct 2011 | B2 |
8035184 | Dutta et al. | Oct 2011 | B1 |
8049203 | Samuelson | Nov 2011 | B2 |
8063450 | Wernersson et al. | Nov 2011 | B2 |
8067299 | Samuelson | Nov 2011 | B2 |
8084728 | Tsang | Dec 2011 | B2 |
8093675 | Tsunemi et al. | Jan 2012 | B2 |
8118170 | Sato | Feb 2012 | B2 |
8143658 | Samuelson | Mar 2012 | B2 |
8154127 | Kamins | Apr 2012 | B1 |
8193524 | Bjoerk | Jun 2012 | B2 |
8208776 | Tokushima | Jun 2012 | B2 |
8212138 | Landis | Jul 2012 | B2 |
8222705 | Ogino | Jul 2012 | B2 |
8242353 | Karg | Aug 2012 | B2 |
8269985 | Wober | Sep 2012 | B2 |
8274039 | Wober et al. | Sep 2012 | B2 |
8299472 | Yu | Oct 2012 | B2 |
8330090 | Agarwal | Dec 2012 | B2 |
8384007 | Yu | Feb 2013 | B2 |
8455857 | Samuelson | Jun 2013 | B2 |
8471190 | Wober | Jun 2013 | B2 |
8546742 | Wober | Oct 2013 | B2 |
20020003201 | Yu | Jan 2002 | A1 |
20020020846 | Pi et al. | Feb 2002 | A1 |
20020021879 | Lee | Feb 2002 | A1 |
20020071468 | Sandstrom | Jun 2002 | A1 |
20020104821 | Bazylenko | Aug 2002 | A1 |
20020109082 | Nakayama | Aug 2002 | A1 |
20020117675 | Mascarenhas | Aug 2002 | A1 |
20020130311 | Lieber | Sep 2002 | A1 |
20020172820 | Majumdar | Nov 2002 | A1 |
20030003300 | Korgel | Jan 2003 | A1 |
20030006363 | Campbell | Jan 2003 | A1 |
20030077907 | Kao et al. | Apr 2003 | A1 |
20030089899 | Lieber | May 2003 | A1 |
20030103744 | Koyama | Jun 2003 | A1 |
20030132480 | Chau | Jul 2003 | A1 |
20030160176 | Vispute | Aug 2003 | A1 |
20030189202 | Li | Oct 2003 | A1 |
20030227090 | Okabe | Dec 2003 | A1 |
20040021062 | Zaidi | Feb 2004 | A1 |
20040026684 | Empedocles | Feb 2004 | A1 |
20040058058 | Shchegolikhin | Mar 2004 | A1 |
20040065362 | Watabe | Apr 2004 | A1 |
20040075464 | Samuelson | Apr 2004 | A1 |
20040095658 | Buretea et al. | May 2004 | A1 |
20040109666 | Kim | Jun 2004 | A1 |
20040114847 | Fischer et al. | Jun 2004 | A1 |
20040118337 | Mizutani | Jun 2004 | A1 |
20040118377 | Bloms | Jun 2004 | A1 |
20040122328 | Wang | Jun 2004 | A1 |
20040124366 | Zeng | Jul 2004 | A1 |
20040155247 | Benthien | Aug 2004 | A1 |
20040156610 | Charlton et al. | Aug 2004 | A1 |
20040180461 | Yaung | Sep 2004 | A1 |
20040213307 | Lieber | Oct 2004 | A1 |
20040217086 | Kawashima | Nov 2004 | A1 |
20040223681 | Block | Nov 2004 | A1 |
20040241965 | Merritt | Dec 2004 | A1 |
20040252957 | Schmidt et al. | Dec 2004 | A1 |
20040261840 | Schmit | Dec 2004 | A1 |
20050009224 | Yang | Jan 2005 | A1 |
20050035381 | Holm | Feb 2005 | A1 |
20050082676 | Andry | Apr 2005 | A1 |
20050087601 | Gerst, III | Apr 2005 | A1 |
20050095699 | Miyauchi et al. | May 2005 | A1 |
20050116271 | Kato | Jun 2005 | A1 |
20050133476 | Islam | Jun 2005 | A1 |
20050161662 | Majumdar et al. | Jul 2005 | A1 |
20050164514 | Rauf | Jul 2005 | A1 |
20050190453 | Dobashi | Sep 2005 | A1 |
20050201704 | Ellwood | Sep 2005 | A1 |
20050218468 | Owen | Oct 2005 | A1 |
20050224707 | Guedj | Oct 2005 | A1 |
20050242409 | Yang | Nov 2005 | A1 |
20050284517 | Shinohara | Dec 2005 | A1 |
20060011362 | Tao | Jan 2006 | A1 |
20060027071 | Barnett | Feb 2006 | A1 |
20060038990 | Habib | Feb 2006 | A1 |
20060113622 | Adkisson | Jun 2006 | A1 |
20060115230 | Komoguchi et al. | Jun 2006 | A1 |
20060121371 | Wu | Jun 2006 | A1 |
20060146323 | Bratkovski | Jul 2006 | A1 |
20060162766 | Gee | Jul 2006 | A1 |
20060257071 | Bise | Nov 2006 | A1 |
20060260674 | Tran | Nov 2006 | A1 |
20060273262 | Sayag | Dec 2006 | A1 |
20060273389 | Cohen | Dec 2006 | A1 |
20060284118 | Asmussen | Dec 2006 | A1 |
00700012980 | Duan | Jan 2007 | |
20070012980 | Duan | Jan 2007 | A1 |
20070012985 | Stumbo | Jan 2007 | A1 |
20070023799 | Boettiger | Feb 2007 | A1 |
20070025504 | Tumer | Feb 2007 | A1 |
20070029545 | Striakhilev | Feb 2007 | A1 |
20070052050 | Dierickx | Mar 2007 | A1 |
20070076481 | Tennant | Apr 2007 | A1 |
20070082255 | Sun | Apr 2007 | A1 |
20070099292 | Miller | May 2007 | A1 |
20070104441 | Ahn et al. | May 2007 | A1 |
20070108371 | Stevens | May 2007 | A1 |
20070114622 | Adkisson | May 2007 | A1 |
20070120254 | Hurkx | May 2007 | A1 |
20070126037 | Ikeda | Jun 2007 | A1 |
20070137697 | Kempa | Jun 2007 | A1 |
20070138376 | Naughton | Jun 2007 | A1 |
20070138380 | Adkisson | Jun 2007 | A1 |
20070138459 | Wong | Jun 2007 | A1 |
20070139740 | Igura | Jun 2007 | A1 |
20070140638 | Yang | Jun 2007 | A1 |
20070145512 | Rhodes | Jun 2007 | A1 |
20070148599 | True | Jun 2007 | A1 |
20070152248 | Choi | Jul 2007 | A1 |
20070155025 | Zhang | Jul 2007 | A1 |
20070164270 | Majumdar | Jul 2007 | A1 |
20070170418 | Bowers | Jul 2007 | A1 |
20070172623 | Kresse | Jul 2007 | A1 |
20070187787 | Ackerson | Aug 2007 | A1 |
20070196239 | Vink | Aug 2007 | A1 |
20070200054 | Reznik | Aug 2007 | A1 |
20070205483 | Williams | Sep 2007 | A1 |
20070217754 | Sasaki | Sep 2007 | A1 |
20070228421 | Shioya et al. | Oct 2007 | A1 |
20070238265 | Kurashina | Oct 2007 | A1 |
20070238285 | Borden | Oct 2007 | A1 |
20070241260 | Jaeger | Oct 2007 | A1 |
20070246689 | Ge | Oct 2007 | A1 |
20070248958 | Jovanovich | Oct 2007 | A1 |
20070272828 | Xu | Nov 2007 | A1 |
00700290265 | Augusto | Dec 2007 | |
20070278500 | Lin | Dec 2007 | A1 |
20070285378 | Lankhorst | Dec 2007 | A1 |
20070290193 | Tucker | Dec 2007 | A1 |
20070290265 | Augusto et al. | Dec 2007 | A1 |
20080001498 | Muller | Jan 2008 | A1 |
20080006319 | Bettge | Jan 2008 | A1 |
20080029701 | Onozawa | Feb 2008 | A1 |
20080036038 | Hersee | Feb 2008 | A1 |
20080044984 | Hsieh | Feb 2008 | A1 |
20080047601 | Nag | Feb 2008 | A1 |
20080047604 | Korevaar | Feb 2008 | A1 |
20080055451 | Kanbe | Mar 2008 | A1 |
20080073742 | Adkisson | Mar 2008 | A1 |
20080079022 | Yamamoto | Apr 2008 | A1 |
20080079076 | Sheen | Apr 2008 | A1 |
20080083963 | Hsu | Apr 2008 | A1 |
20080088014 | Adkisson | Apr 2008 | A1 |
20080090401 | Bratkovski | Apr 2008 | A1 |
20080092938 | Majumdar | Apr 2008 | A1 |
20080096308 | Santori | Apr 2008 | A1 |
20080108170 | Adkisson | May 2008 | A1 |
20080116537 | Adkisson | May 2008 | A1 |
20080128760 | Jun | Jun 2008 | A1 |
20080145965 | Reznik | Jun 2008 | A1 |
20080149914 | Samuelson | Jun 2008 | A1 |
20080149944 | Samuelson | Jun 2008 | A1 |
20080157253 | Starikov | Jul 2008 | A1 |
20080166883 | Liu et al. | Jul 2008 | A1 |
20080169017 | Korevaar | Jul 2008 | A1 |
20080169019 | Korevaar | Jul 2008 | A1 |
20080173615 | Kim | Jul 2008 | A1 |
20080178924 | Kempa | Jul 2008 | A1 |
20080188029 | Rhodes | Aug 2008 | A1 |
20080191278 | Maekawa | Aug 2008 | A1 |
20080191298 | Lin | Aug 2008 | A1 |
20080211945 | Hong | Sep 2008 | A1 |
20080218740 | Williams | Sep 2008 | A1 |
20080224115 | Bakkers | Sep 2008 | A1 |
20080225140 | Raynor | Sep 2008 | A1 |
20080233280 | Blanchet | Sep 2008 | A1 |
20080237568 | Kobayashi | Oct 2008 | A1 |
20080246020 | Kawashima | Oct 2008 | A1 |
20080246123 | Kamins | Oct 2008 | A1 |
20080248304 | Hanrath | Oct 2008 | A1 |
20080251780 | Li | Oct 2008 | A1 |
20080258747 | Kluth | Oct 2008 | A1 |
20080260225 | Szu | Oct 2008 | A1 |
20080264478 | Ahn | Oct 2008 | A1 |
20080266556 | Kamins | Oct 2008 | A1 |
20080271783 | Murakami | Nov 2008 | A1 |
20080277646 | Kim et al. | Nov 2008 | A1 |
20080283728 | Inoue | Nov 2008 | A1 |
20080283883 | Shim | Nov 2008 | A1 |
20080297281 | Ayazi | Dec 2008 | A1 |
20080311693 | Maxwell | Dec 2008 | A1 |
20080311712 | Anwar | Dec 2008 | A1 |
20090001498 | Wang | Jan 2009 | A1 |
20090020150 | Atwater et al. | Jan 2009 | A1 |
20090032687 | Lapstun | Feb 2009 | A1 |
20090046362 | Guo | Feb 2009 | A1 |
20090046749 | Mizuuchi | Feb 2009 | A1 |
20090050204 | Habib | Feb 2009 | A1 |
20090057650 | Lieber | Mar 2009 | A1 |
20090072145 | Peczalski et al. | Mar 2009 | A1 |
20090120498 | Yamazaki | May 2009 | A1 |
20090121136 | Gruss et al. | May 2009 | A1 |
20090127442 | Lee | May 2009 | A1 |
20090146198 | Joe | Jun 2009 | A1 |
20090151782 | Ko | Jun 2009 | A1 |
20090152664 | Klem | Jun 2009 | A1 |
20090153961 | Murakami | Jun 2009 | A1 |
20090165844 | Dutta | Jul 2009 | A1 |
20090173976 | Augusto | Jul 2009 | A1 |
20090179225 | Fertig et al. | Jul 2009 | A1 |
20090179289 | Park | Jul 2009 | A1 |
20090188552 | Wang | Jul 2009 | A1 |
20090189144 | Quitoriano | Jul 2009 | A1 |
20090189145 | Wang | Jul 2009 | A1 |
20090194160 | Chin | Aug 2009 | A1 |
20090199597 | Danley | Aug 2009 | A1 |
20090201400 | Zhang et al. | Aug 2009 | A1 |
20090206405 | Doyle | Aug 2009 | A1 |
20090224245 | Umezaki | Sep 2009 | A1 |
20090224349 | Gambino | Sep 2009 | A1 |
20090230039 | Hoenig et al. | Sep 2009 | A1 |
20090233445 | Lee | Sep 2009 | A1 |
20090242018 | Ahn | Oct 2009 | A1 |
20090243016 | Kawahara et al. | Oct 2009 | A1 |
20090244514 | Jin | Oct 2009 | A1 |
20090260687 | Park | Oct 2009 | A1 |
20090261438 | Choi | Oct 2009 | A1 |
20090266418 | Hu et al. | Oct 2009 | A1 |
20090266974 | Verhulst et al. | Oct 2009 | A1 |
20090272423 | Niira | Nov 2009 | A1 |
20090278998 | El-Ghoroury et al. | Nov 2009 | A1 |
20090289320 | Cohen | Nov 2009 | A1 |
20090305454 | Cohen | Dec 2009 | A1 |
20100006817 | Ohlsson et al. | Jan 2010 | A1 |
20100019252 | Bratkovski et al. | Jan 2010 | A1 |
20100019296 | Cha | Jan 2010 | A1 |
20100019355 | Kamins | Jan 2010 | A1 |
20100025710 | Yamada | Feb 2010 | A1 |
20100078055 | Vidu | Apr 2010 | A1 |
20100090341 | Wan | Apr 2010 | A1 |
20100101633 | Park | Apr 2010 | A1 |
20100104494 | Meng | Apr 2010 | A1 |
20100110433 | Nedelcu | May 2010 | A1 |
20100116976 | Wober | May 2010 | A1 |
20100127153 | Agarwal | May 2010 | A1 |
20100132779 | Hong | Jun 2010 | A1 |
20100133986 | Kim et al. | Jun 2010 | A1 |
20100136721 | Song | Jun 2010 | A1 |
20100148221 | Yu | Jun 2010 | A1 |
20100163714 | Wober | Jul 2010 | A1 |
20100163941 | Jung | Jul 2010 | A1 |
20100178018 | Augusto | Jul 2010 | A1 |
20100186809 | Samuelson et al. | Jul 2010 | A1 |
20100187404 | Klem | Jul 2010 | A1 |
20100200065 | Choi | Aug 2010 | A1 |
20100207103 | Farrow | Aug 2010 | A1 |
20100218816 | Guha | Sep 2010 | A1 |
20100229939 | Shen | Sep 2010 | A1 |
20100230653 | Chen | Sep 2010 | A1 |
20100237454 | Fujisawa | Sep 2010 | A1 |
20100244108 | Kohnke et al. | Sep 2010 | A1 |
20100244169 | Maeda et al. | Sep 2010 | A1 |
20100249877 | Naughton | Sep 2010 | A1 |
20100258184 | Laughlin | Oct 2010 | A1 |
20100276572 | Iwabuchi | Nov 2010 | A1 |
20100277607 | Choi | Nov 2010 | A1 |
20100282314 | Coakley | Nov 2010 | A1 |
20100295019 | Wang et al. | Nov 2010 | A1 |
20100302440 | Wober | Dec 2010 | A1 |
20100304061 | Ye et al. | Dec 2010 | A1 |
20100308214 | Wober | Dec 2010 | A1 |
20100313952 | Coakley | Dec 2010 | A1 |
20100320444 | Dutta | Dec 2010 | A1 |
20110018424 | Takada | Jan 2011 | A1 |
20110036396 | Jayaraman | Feb 2011 | A1 |
20110037133 | Su et al. | Feb 2011 | A1 |
20110050042 | Choi et al. | Mar 2011 | A1 |
20110080508 | Katsuno et al. | Apr 2011 | A1 |
20110084212 | Clark | Apr 2011 | A1 |
20110127490 | Mi | Jun 2011 | A1 |
20110133060 | Yu et al. | Jun 2011 | A1 |
20110133160 | Yu et al. | Jun 2011 | A1 |
20110135814 | Miyauchi et al. | Jun 2011 | A1 |
20110139176 | Cheung et al. | Jun 2011 | A1 |
20110146771 | Chuang et al. | Jun 2011 | A1 |
20110147870 | Ang et al. | Jun 2011 | A1 |
20110180894 | Samuelson | Jul 2011 | A1 |
20110195577 | Kushibiki et al. | Aug 2011 | A1 |
20110226937 | Yu | Sep 2011 | A1 |
20110248315 | Nam | Oct 2011 | A1 |
20110249219 | Evans | Oct 2011 | A1 |
20110249322 | Wang | Oct 2011 | A1 |
20110253982 | Wang et al. | Oct 2011 | A1 |
20110272014 | Mathai | Nov 2011 | A1 |
20110297214 | Kim et al. | Dec 2011 | A1 |
20110309237 | Seo et al. | Dec 2011 | A1 |
20110315988 | Yu et al. | Dec 2011 | A1 |
20110316106 | Kim | Dec 2011 | A1 |
20120009714 | Mouli | Jan 2012 | A1 |
20120014837 | Fehr et al. | Jan 2012 | A1 |
20120029328 | Shimizu | Feb 2012 | A1 |
20120075513 | Chipman | Mar 2012 | A1 |
20120196383 | Nitkowski et al. | Aug 2012 | A1 |
20120196401 | Graham | Aug 2012 | A1 |
20120258563 | Ogino | Oct 2012 | A1 |
20120298843 | Yu | Nov 2012 | A1 |
20120318336 | Hekmatshoar-Tabari et al. | Dec 2012 | A1 |
20120322164 | Lal | Dec 2012 | A1 |
20130020620 | Wober | Jan 2013 | A1 |
20130112256 | Yu | May 2013 | A1 |
20130220406 | Day | Aug 2013 | A1 |
20140045209 | Chou | Feb 2014 | A1 |
Number | Date | Country |
---|---|---|
100568516 | Dec 2009 | CN |
0809303 | Sep 2006 | EP |
2348399 | Apr 2000 | GB |
359013708 | Jan 1984 | JP |
359013708 | Jan 1984 | JP |
59198413708 | Jan 1984 | JP |
2000324396 | Nov 2000 | JP |
2002151715 | May 2002 | JP |
2005252210 | Sep 2005 | JP |
200742115 | Apr 2007 | JP |
2007134562 | May 2007 | JP |
2007152548 | Jun 2007 | JP |
2007520877 | Jul 2007 | JP |
2007201091 | Aug 2007 | JP |
2007317961 | Dec 2007 | JP |
2008288585 | Nov 2008 | JP |
2009506546 | Feb 2009 | JP |
I228782 | Mar 2005 | TW |
200810100 | Feb 2008 | TW |
200845402 | Nov 2008 | TW |
200915551 | Apr 2009 | TW |
8603347 | Jun 1986 | WO |
0002379 | Jan 2000 | WO |
03107439 | Dec 2003 | WO |
2005064337 | Jul 2005 | WO |
2008069565 | Jun 2008 | WO |
2008079076 | Jul 2008 | WO |
2008131313 | Oct 2008 | WO |
2008135905 | Nov 2008 | WO |
2008135905 | Nov 2008 | WO |
2008135905 | Nov 2008 | WO |
2008143727 | Nov 2008 | WO |
WO2008135905 | Nov 2008 | WO |
2009116018 | Sep 2009 | WO |
2009137241 | Nov 2009 | WO |
2010019887 | Feb 2010 | WO |
2010039631 | Apr 2010 | WO |
Entry |
---|
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2011/060348, mailed Mar. 9, 2012. |
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2011/064635, mailed Apr. 13, 2012. |
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2011/066097, mailed Mar. 12, 2012. |
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2011/067712, mailed May 3, 2012. |
Sarkar et. al., Integrated polarization-analyzing CMOS image sensor for detecting incoming light ray direction, Sensors Application Symposium (SAS) p. 194-199, 1010 IEEE. |
CMOS image sensor pixel microlens array optimization using FDTD Solutions, http://www.lumerical—com/ fdtd—microlens/cmos—image—sensor—pixel—microlens.php, pp. 1-2, Jun. 25, 2008. |
Jin-Kon Kim; ‘New Functional Nanomaterials Based on Block Copolymers’ http://www.ziu.edu.cn/adver/subjectizyhd/jz0707061313.html. |
Kalkofen et al., Atomic Layer Deposition of Boron Oxide As Dopant Source for Shallow Doping of Silicon, Meeting Abstract 943, 217th ECS Meeting, MA Jan. 2010, Apr. 25-30, 2010, Vancouver Canada, El—Advanced Gate Stack, Source/Drain, and Channel Engineering for Si-Based CMOS 6: New Materials, Processes, and Equipmen. |
Kempa, Thomas J. et al. Single and Tandem Axial p-i-n. Nanowire Photovoltaic Devices. Nano Letters. 2008, vol. 8, No. 10, 3456-3460. |
N. L. Dmitruk, et al.; ‘Modeling and Measurement of Optical Response of 1D Array of Metallic Nanowires for Sensing and Detection Application’; 26th International Conference on Microelectronics (MIEL 2008), NIS, SERBIA, May 11-14, 2008. |
Ozgur Yavuzcetin, et al.; ‘Index-tuned Anti-reflective Coating using a Nanostructured Metamaterial’; http://www.umass.edu/research/rld/bioportal/vuewtech.php?tid=40. |
Reynard Corporation; ‘Anti-Reflection Coatings (AR)’, http://www.reynardcorp.com/coating—anti—reflection.php. |
Schmidt et al., Realization of a Silicon Nanowire Vertical Surround-Gate Field-Effect Transistor, Small, Jan. 2006, vol. 2, No. 1, pp. 85-88. |
Shimizu et al., Homoepitaxial Growth of Vertical Si Nanowires on Si(100) Substrate using Anodic Aluminum Oxide Template, (abstract only), Materials Research Society. |
Wang, Introduction to Nanotechnology—Where Opportunities arise & Great Future Being Built from Small Things. |
International Preliminary Report and Written Opinion re PCT/US2010/059491, mailed Jun. 21, 2012. |
International Preliminary Report and Written Opinion re PCT/US2010/059468, mailed Jun. 21, 2012. |
U.S. Office Action for U.S. Appl. No. 12/573,582, dated Jun. 28, 2012. |
International Search Report and Written Opinion re PCT/US2011/57325, mailed Jun. 22, 2012. |
International Preliminary Report and Written Opinion re PCT/US2010/059504, mailed Jun. 21, 2012. |
International Preliminary Report and Written Opinion re PCT/US2010/059496, mailed Jun. 21, 2012. |
William Shockley and H. Queisser, Detailed Balance Limit of Efficiency of p-n. Junction Solar Cells, J. of Appl. Physics, 1961, March 32(3). |
International Preliminary Report on Patentability for PCT International Application No. PCT/US2010/035722, mailed Nov. 3, 2011. |
Baomin Wang and Paul W. Leu, Nanotechology 23 (2012) 194003, 7 pages. |
Sangmoo Jeon, et al., Nano Lett. 2012, 12, 2971-2976. |
Sangmoo Jeong et al., J. Vac. Sci. Technol. A 30(6), Nov./Dec. 2012. |
Sarkar et. al., Integrated polarization-analyzing CMOS image sensor for detecting incoming light ray direction, Sensors Application Symposium (SAS), Mar. 29, 2012, p. 194-199, 1010 IEEE. |
Jin-Kon Kim; ‘New Functional Nanomaterials Based on Block Copolymers’ http://www.ziu.edu.cn/adver/subjectizyhd/jz0707061313.html, Jul. 7, 2011. |
Ozgur Yavuzcetin, et al.; ‘Index-tuned Anti-reflective Coating using a Nanostructured Metamaterial’; http://www.umass.edu/research/rld/bioportal/vuewtech.php?tid=40, Feb. 28, 2007. |
Reynard Corporation; ‘Anti-Reflection Coatings (AR)’, http://www.reynardcorp.com/coating—anti—reflection.php, undated. |
Shimizu et al., Homoepitaxial Growth of Vertical Si Nanowires on Si(100) Substrate using Anodic Aluminum Oxide Template, (abstract only), Materials Research Society, Fall 2007. |
Wang, Introduction to Nanotechnology—Where Opportunities arise & Great Future Being Built from Small Things, Fall 2008. |
International Preliminary Search Report on Patentability of PCT/US2011/057325, mailed May 2, 2013 (9 pages). |
U.S. Office Action for U.S. Appl. No. 13/494,661 by Examiner Thanh X. Luu, notification date Nov. 7, 2012. |
Canadian Office Action of Canadian Application No. 3,676,376, dated Oct. 11, 2013. |
Catrysse, et al., An Integrated Color Pixel in 0.18pm CMOS Technology, Proceedings IEDM 2001, pp. 559-562. |
Choi et al., Optimization of sidewall roughness in silica waveguides to reduce propagation losses, May 2001, Lasers and Electro-Optics, 2001. CLEO '01. Technical Digest. Summaries of papers presented at the Conference on, pp. 175-176. |
Geyer et al., Model for the Mass Transport during Metal-Assisted Chemical Etching with Contiguous Metal Films as Catalysts, J. Phys. Chem. C 2012, 116, 13446-13451. |
Hopkins, Addressing sidewall roughness using dry etching silicon and Si02, Jul. 1, 2004, ElectrolQ, vol. 47, Issue 7. |
Mei-Ling Kuo et al. “Realization of a near-perfect antireflection coating for silicon solar energy utilization” (Nov. 1, 2008, vol. 33, No. 21, Optics Letters). |
Mukhopadhyay, When PDMS Isn't the Best, American Chemical Society, May 1, 2007. |
Seo, et. al., “Multicolored vertical silicon nanowires,” Nano Letters, vol. 11, issue 4, pp. 1851-6, 2010. |
U.S. Final Office Action for U.S. Appl. No. 12/966,514, mailed Mar. 19, 2013, 50 pages. |
U.S. Final Office Action for U.S. Appl. No. 13/494,661, mailed Mar. 7, 2013, 10 pages. |
U.S. Office Action for U.S. Appl. No. 12/633,313, dated Aug. 1, 2013, 20 pages. |
U.S. Office Action for U.S. Appl. No. 12/966,514, dated Aug. 15, 2013, 17 pages. |
U.S. Office Action for U.S. Appl. No. 12/966,535, mailed Jun. 14, 2013, 22 pages. |
U.S. Office Action for U.S. Appl. No. 12/966,573, dated Aug. 6, 2013, 13 pages. |
U.S. Office Action for U.S. Appl. No. 13/048,635, mailed Jun. 6, 2013, 24 pages. |
International Preliminary Search Report on Patentability of PCT/US201-057325, mailed May 2, 2013 (9 pages). |
Taiwanese Office Action of Taiwan Patent Application No. 099116881, issued Jul. 18, 2013 (8 pages). |
U.S. Office Action for U.S. Appl. No. 12/966,514, mailed Feb. 25, 2014. |
U.S. Office Action for U.S. Appl. No. 12/945,492 mailed May 13, 2014. |
U.S. Office Action for U.S. Appl. No. 12/982,269 mailed Jun. 11, 2014. |
U.S. Office Action for U.S. Appl. No. 13/106,851 mailed May 29, 2014. |
U.S. Office Action for U.S. Appl. No. 13/556,041 mailed Jun. 12, 2014. |
Office Action issued on Jun. 19, 2014 in Taiwanese Application No. 099133891. |
Office Action issued on Jan. 28, 2014 in Taiwanese Application No. 100146327. |
Office Action issued on Mar. 17, 2014 in Korean Application No. 10-2013-7018243. |
U.S. Office Action for U.S. Appl. No. 12/910,664, mailed Feb. 26, 2014. |
U.S. Office Action for U.S. Appl. No. 12/633,313 mailed Aug. 1, 2014. |
U.S. Office Action for U.S. Appl. No. 13/693,207 mailed Oct. 9, 2014. |
U.S. Office Action for U.S. Appl. No. 12/966,514 mailed Sep. 23, 2014. |
Berstein et al., “Modern Physics”, Chapter 14, Section 6, pp. 420-421, 2000, Prentice-Hall, Inc. |
University of California San Diego, Class ECE 183 Lab 1, 2013. |
Deptuch et al., Vertically Integrated Circuits at Fermilab, IEEE Transactions on Nuclear Science, Aug. 2010, vol. 54, Issue 4, pp. 2178-2186. |
Gadelrab et al., The Source-Gated Amorphous Silicon Photo-Transistor, IEEE Transactions on Electron Devices, Oct. 1997, vol. 44, No. 10, pp. 1789-1794. |
Guillaumée, et al., Polarization Sensitive Silicon Photodiodes Using Nanostructured Metallic Grids, Applied Physics Letters 94, 2009. |
Junger, et. al., Polarization- and wavelength-sensitive sub-wavelength structures fabricated in the metal layers of deep submicron CMOS processes, Proc. of SPIE, vol. 7712, 2010. |
Lin et al., Reducing Dark Current in a High-Speed Si-Based Interdigitated Trench-Electrode MSM Photodetector, IEEE Transactions on Electron Devices, May 2003, vol. 50, No. 5, pp. 1306-1313. |
Loose et al., CMOS Detector Technology, Scientific Detector Workshop, Sicily, 2005, Experimental Astronomy, vol. 19, Issue 1-3, pp. 111-134. |
Ye et al., Fabrication Techniques of High Aspect Ratio Vertical Lightpipes Using a Dielectric Photo Mask, SPIE, Proceedings, Feb. 2010, vol. 7591. |
CMOS image sensor pixel microlens array optimization using FDTD Solutions, http://www.lumerical—com/fdtd—microlens/cmos—image—sensor—pixel—microlens.php, pp. 1-2, Jun. 25, 2008. |
“CMOS image sensor pixel optical efficiency and optical crosstalk optimization using FDTD Solutions” www.lumerical.com/fdtd—microlens/cmos—image—sensor—pixel—microlens.php, Mar. 19, 2009. |
Adler, Nanowire Lawns Make for Sheets of Image Sensors, NewScientist.com, Jul. 28, 2008. |
Babinec et al., High-Flux, Low-Power Diamond Nanowire Single-Photon Source Arrays: An Enabling Material for Optical and Quantum Computing and Cryptography, obtained on Jul. 22, 2010 at URL: <http://otd.harvard.edu/technologies/tech.php?case=3702>. |
Baillie et al., ‘Zero-space microlenses for CMOS image sensors: optical modeling and lithographic process development’, Publication Date May 2004, http://adsabs.harvard.edu/abs/2004SPIE.5377..953B, pp. 1-2.vbTab. |
Barclay et al., Chip-Based Microcavities Coupled to NV Centers in Single Crystal Diamond, Applied Physics Letters, Nov. 12, 2009, vol. 95, Issue 19. |
Brouri et al., Photon Antibunching in the Flurescence of Individual Colored Centers in Diamond, Optics Letters, Sep. 1, 2000, vol. 25, Issue 17. |
Chung, Sung-Wook et al. Silicon Nanowire Devices. Applied Physics Letters, vol. 76, No. 15 (Apr. 10, 2000), pp. 2068-2070. |
Ekroll, On the Nature of Simultaneous Color Contrast, Dissertation, University of Kiel, 2005. |
Fan et al., Large-Scale, Heterogeneous Integration of Nanowire Arrays for Image Sensor Circuitry, Proceedings of the National Academy of Sciences (PNAS) of the United States of America, Aug. 12, 2008, vol. 105, No. 32. |
Fang et al., Fabrication of Slantingly-Aligned Silicon Nanowire Arrays for Solar Cell Applications, Nanotechnology, 2008, vol. 19, No. 25. |
Furumiya, et al. “High-sensitivity and no-crosstalk pixel technology for embedded CMOS image sensor”; IEEE Electron Device Letters, vol. 48, No. 10, Oct. 2001. |
Gambino et al., ‘CMOS Imager with Copper Wiring and Lightpipe,’ Electron Devices Meeting, 2006. IEDM '06, International Publication Date: Dec. 11-13, 2006, pp. 1-4. |
Garnett et al., Light Trapping in Silicon Nanowire Solar Cells, Nanoletters, Jan. 28, 2010, vol. 10, No. 3, pp. 1082-1087. |
Ge et al., Orientation-Controlled Growth of Single-Crystal Silicon-Nanowire Arrays, Advanced Materials, Jan. 18, 2005, vol. 17, No. 1, pp. 56-61. |
Hanrath et al., Nucleation and Growth of Germanium Nanowires Seeded by Organic Monolayer-Coated Gold Nanocrystals, J. Am. Chem. Soc., Feb. 20, 2002, vol. 124, No. 7, pp. 1424-1429. |
Hanrath et al., Supercritical Fluid-Liquid-Solid (SFLS) Synthesis of Si and Ge Nanowires Seeded by Colloidal Metal Nanocrystals, Advanced Materials, Mar. 4, 2003, vol. 15, No. 5, pp. 437-440. |
Hochbaum et al., Controlled Growth of Si Nanowire Arrays for Device Integration, Nano Letters, Mar. 2005, vol. 5, No. 3, pp. 457-460. |
Holmes et al., Control of Thickness and Orientation of Solution-Grown Silicon Nanowires, Science, Feb. 25, 2000, vol. 287, No. 5457, pp. 1471-1473. |
International Preliminary Report on Patentability for PCT International Patent Application No. PCT/U62009/055963, mailed Mar. 17, 2011. |
International Search Report and Written Opinion for PCT International Application No. PCT/US2010/035722, mailed Jul. 20, 2010. |
International Search Report and Written Opinion for PCT International Application No. PCT/US2010/035726, mailed Jul. 21, 2010. |
International Search Report and Written Opinion for PCT International Application No. PCT/US2010/057227, mailed Jan. 26, 2011. |
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2009/055963, mailed Oct. 15, 2009.vbTab. |
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/035727, mailed Sep. 27, 2010. |
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/051435, mailed Dec. 3, 2010. |
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/059468, mailed Feb. 11, 2011. |
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/059491, mailed Feb. 9, 2011. |
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/059501, mailed Feb. 15, 2011. |
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/059504, mailed Apr. 7, 2011. |
Juan et al., High Aspect Ratio Polymide Etching Using an Oxygen Plasma Generated by Electron Cyclotron Resonance Source, Journal of Vacuum Science and Technology, Jan./Feb. 1994, vol. 12, No. 1., pp. 422-426. |
Kalkofen et al., Atomic Layer Deposition of Boron Oxide As Dopant Source for Shallow Doping of Silicon, Meeting Abstract 943, 217th ECS Meeting, MA Jan. 2010, Apr. 25-30, 2010, Vancouver Canada, El—Advanced Gate Stack, Source/Drain, and Channel Engineering for Si-Based CMOS 6: New Materials, Processes, and Equipment. |
Kane, Why Nanowires Make Great Photodetectors, EurekAlert.com article, Apr. 25, 2007. |
Kempa, Thomas J. et al. Single and Tandem Axial p-i-n Nanowire Photovoltaic Devices. Nano Letters. 2008, vol. 8, No. 10, 3456-3460. |
Kim et al., Electronic Structure of Vertically Aligned Mn-Doped CoFe2O4 Nanowires and Their Application as Humidity Sensors and Photodetectors, Journal of Physical Chemistry C, Apr. 7, 2009. |
Law, et al., ‘Semiconductor Nanowires and Nanotubes’; Annu. Rev. Mater. Res. 2004, 34:83-122. |
Lee et al., Vertical Pillar-Superlattice Array and Graphene Hybrid Light Emitting Diodes, Nano Letters, 2010, vol. 10, pp. 2783-2788. |
Lin et al., Fabrication of Nanowire Anisotropic Conductive Film for Ultra-fine Pitch Flip Chip Interconnection, Electronic Components and Technology Conference, Jun. 20, 2005, 55th Proceedings, pp. 66-70. |
Loncar et al., Diamond Nanotechnology, SPIE Newsroom, May 18, 2010, obtained at url: <http://spie.org/x40194.xml?ArticleID=x40194>. |
Lu et al., Growth of Single Crystal Silicon Nanowires in Supercritical Solution from Tethered Gold Particles on a Silicon Substrate, NanoLetters, Jan. 2003, vol. 3, No. 1, pp. 93-99. |
Lugstein et al., Ga/Au Alloy Catalyst for Single Crystal Silicon-Nanowire Epitaxy, Applied Physics Letters, Jan. 8, 2007, vol. 90, No. 2, pp. 023109-1-023109-3. |
Madou, Properties and Growth of Silicon, Including Crystalline Silicon, Fundamentals of Microfabrication, 2nd Ed., CRC Press, 2002, pp. 125-204. |
Makarova et al., Fabrication of High Density, High-Aspect-Ratio Polyimide Nanofilters, Journal of Vacuum Science and Technology, Nov./Dec. 2009, vol. 27, No. 6., pp. 2585-2587. |
Morales et al., A Laser Ablation Method for the Synthesis of Crystalline Semiconductor Nanowires, Science, Jan. 9, 1998, vol. 279, pp. 208-211. |
N.L. Dmitruk, et al.; ‘Modeling and Measurement of Optical Response of 1D Array of Metallic Nanowires for Sensing and Detection Application’; 26th International Conference on Microelectronics (MIEL 2008), NIS, SERBIA, May 11-14, 2008. |
Nguyen et al., Deep Reactive Ion etching of Polyimide for Microfluidic Applications, Journal of the Korean Physical Society, Sep. 2007, vol. 51, No. 3, pp. 984-988. |
Pain et al., A Back-Illuminated Megapixel CMOS Image Sensor, IEEE Workshop on Charge-Coupled Devices and Advanced Image Sensors, Karuizawa, Japan, Jun. 9-11, 2005, Jet Propulsion Laboratory, National Aeronautics and Space Administration, Pasadena California. |
Parraga et al., Color and Luminance Information In Natural Scenes, Journal of Optical Society of America A, Optics, Image, Science and Vision, Jun. 1998, vol. 15, No. 6. |
Rosfjord et al., Nanowire Single-Photon Detector with an Integrated Optical Cavity and Anti-Reflection Coating, Optics Express: The International Electronic Journal of Optics, Jan. 23, 2006, vol. 14, No. 2, pp. 527-534. |
Rugani, First All-Nanowire Sensor, Technology Review, Aug. 13, 2008, Published by MIT. |
Rutter, Diamond-Based Nanowire Devices Advance Quantum Science, SEAS Communications, Feb. 14, 2010, obtained at url:<http://news.harvard.edu/gazette/story/2010/02/digging-deep-into-diamonds/>. |
Schmidt et al., Realization of a Silicon Nanowire Vertical Surround-Gate Field-Effect Effect Transistor, Small, Jan. 2006, vol. 2, No. 1, pp. 85-88. |
Song et al., Vertically Standing Ge Nanowires on GaAs(110) Substrates, Nanotechnology 19, Feb. 21, 2008. |
T. H. Hsu, et al. ‘Light Guide for Pixel Crosstalk Improvement in Deep Submicron CMOS Image Sensor’; IEEE Electron Device Letters, vol. 25, No. 1, Jan. 2004. |
Thelander et al., Nanowire-Based One-Dimensional Electronics, Materials Today, Oct. 2006, vol. 9, No. 10, pp. 28-35. |
Trentler, Timothy J. et al. Solution-Liquid-Solid Growth of Cyrstalline III-V Semiconductors: An Analogy to Vapor Liquid-Solid Growth. vol. 270(5243), Dec. 15, 1995, pp. 1791-1794. |
Tseng, et al. ‘Crosstalk improvement technology applicable to 0.14μm CMOS image sensor’; IEEE International Electron Devices Meeting, Dec. 13-15, 2004; IEDM Technical Digest, pp. 997-1000.vbTab. |
Verheijen, Marcel A. et al. Growth Kinetics of Heterostructured GaP-GaAs Nanowires. J. Am. Chem. Soc. 2006, 128, 1353-1359. |
Wagner, R.S. and Ellis, W.C. Vapor-Liquid-Solid Mechanism of Single Crystal Growth. Applied Physics Letters. vol. 4, No. 5 (Mar. 1, 1964), pp. 89-90. |
Wong et al., Lateral Nanoconcentrator Nanowire Multijunction Photovoltaic Cells, GCEP Progress report, Apr. 20, 2009, pp. 1-18. |
Zhang et al., Ultrahigh Responsivity Visible and Infrared Detection Using Silicon Nanowire Phototransistors, Nanoletters, May 14, 2010, vol. 10, No. 6, pp. 2117-2120. |
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/051446, mailed Jan. 3, 2011. |
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2009/063592, mailed Jan. 13, 2010. |
Office Action issued on Oct. 29, 2014 in Korean Application No. 10-2013-7020107. |
U.S. Office Action for U.S. Appl. No. 13/925,429 mailed Nov. 4, 2014. |
Corrected Notice of Allowability issued on Oct. 14, 2014 in U.S. Appl. No. 12/966,535. |
U.S. Office Action for U.S. Appl. No. 13/543,307 mailed Dec. 24, 2014. |
U.S. Office Action for U.S. Appl. No. 14/274,448 mailed Dec. 5, 2014. |
International Search Report and Written Opinion for International Application No. PCT/US2014/056558 mailed Dec. 12, 2014. |
Office Action issued on Nov. 11, 2014 in Taiwanese Application No. 098129911. |
Notice of Allowance issued Jan. 30, 2015 in U.S. Appl. No. 14/487,375. |
International Search Report and Written Opinion for International Application No. PCT/US2014/050544 mailed Jan. 9, 2015. |
Office Action for U.S. Appl. No. 12/982,269, mailed Jan. 15, 2015. |
Office Action for U.S. Appl. No. 12/945,492 mailed Jan. 16, 2015. |
Office Action issued on Jan. 16, 2015 in Chinese Application No. 201180054442.9. |
Number | Date | Country | |
---|---|---|---|
20110309237 A1 | Dec 2011 | US |
Number | Date | Country | |
---|---|---|---|
61357429 | Jun 2010 | US |