Light emitting device package and method of manufacturing the same

Abstract

A light emitting device package including a transparent cover having an electrode pattern formed on a bottom surface thereof; a light emitting device installed below the transparent cover and electrically connected to an external circuit via the electrode pattern; a fixing resin which fixes the light emitting device onto the bottom surface of the transparent cover; and a metal slug provided under the fixing resin to dissipate heat away from the light emitting device.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other exemplary aspects and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention, taken in conjunction with the accompanying drawings in which:

FIG. 1 is a perspective view of a light emitting device package according to an exemplary embodiment of the present invention;

FIG. 2 is a top view of the light emitting device package of FIG. 1;

FIG. 3 is a cross-sectional view of the light emitting device package of FIG. 1;

FIG. 4 is a cross-sectional view of an example of installing the light emitting device of FIG. 1;

FIGS. 5 through 10 are cross-sectional views of an exemplary method of manufacturing the light emitting device package of FIG. 1;

FIG. 11 is a cross-sectional view of a light emitting device package according to another exemplary embodiment of the present invention;

FIG. 12 is a top view of a light emitting device package according to another exemplary embodiment of the present invention; and

FIG. 13 is a cross-sectional view of the light emitting device package of FIG. 12.

Claims

1. A light emitting device package, comprising: a transparent cover;an electrode pattern formed on a bottom surface of the transparent cover;a light emitting device disposed below the transparent cover and electrically connected to the electrode pattern;a fixing resin fixing the light emitting device to the transparent cover; anda metal slug, disposed below the fixing resin, which dissipates heat away from the light emitting device.

2. The package of claim 1, wherein the transparent cover comprises a plano-convex lens unit disposed above the light emitting device.

3. The package of claim 1, wherein the electrode pattern comprises a plurality of electrode patterns electrically separated from each other and formed on the bottom surface of the transparent cover; andthe package further comprises a solder ball provided at an end of each of the plurality of electrode patterns.

4. The package of claim 1, wherein the fixing resin comprises a light-transmissive material.

5. The package of claim 4, wherein the fixing resin is colored.

6. The package of claim 1, further comprising a wavelength conversion layer, comprising a luminescent material, disposed between the transparent cover and the light emitting device.

7. The package of claim 1, wherein the transparent cover comprises a luminescent material.

8. The package of claim 1, wherein the transparent cover comprises a recess on the bottom surface thereof, and wherein the light emitting device is disposed in the recess.

9. The package of claim 1, further comprising a seed layer between the fixing resin and the metal slug; wherein the metal slug is formed on the seed layer by electroplating.

10. A light emitting device package, comprising: a transparent cover;a plurality of electrode patterns disposed on a bottom surface of the transparent cover;a light emitting device disposed below the transparent cover and electrically connected to the plurality of electrode patterns;a wavelength conversion layer, comprising a luminescent material, disposed between the transparent cover and the light emitting device;a transparent epoxy resin which fixes the light emitting device onto the bottom surface of the transparent cover;a metal slug disposed below the transparent epoxy resin; anda solder ball formed on an end portion of each of the plurality of electrode patterns.

11. The package of claim 10, wherein the transparent cover comprises a plano-convex lens unit disposed above the light emitting device.

12. The package of claim 10, wherein the transparent epoxy resin is colored.

13. The package of claim 10, wherein the transparent cover comprises a recess in the bottom surface thereof and wherein the light emitting device is disposed in the recess.

14. A package for a light emitting device, the package comprising: a transparent cover;a plurality of light emitting devices disposed below the transparent cover;electrode patterns formed on a bottom surface of the transparent cover and electrically connecting terminals of the plurality of light emitting devices and external circuits to each other;a transparent epoxy resin which fixes the plurality of the light emitting devices to the bottom surface of the transparent cover, respectively; anda metal slug disposed below the transparent epoxy resin.

15. The package of claim 14, wherein the transparent cover comprises a plano-convex lens unit disposed above the plurality of the light emitting devices.

16. The package of claim 14, further comprising a wavelength conversion layer comprising a luminescent material disposed between the transparent cover and the plurality of the light emitting devices.

17. The package of claim 14, wherein the transparent cover comprises a plurality of recesses in the bottom surface thereof; and wherein each of the plurality of light emitting devices is disposed in one of the plurality of recesses.

18. The package of claim 14, further comprising a solder ball disposed on an end portion of each of the second plurality of electrode patterns.

19. A light emitting device package, comprising: a transparent cover;a plurality of light emitting devices disposed below the transparent cover;a first plurality of electrode patterns, formed on a bottom surface of the transparent cover, which electrically connect terminals of the plurality of light emitting devices to each other;a second plurality of electrode patterns, formed on the bottom surface of the transparent cover, which are electrically connected to terminals of the plurality of light emitting devices;a transparent epoxy resin which fixes the plurality of the light emitting devices to the bottom surface of the transparent cover; anda metal slug disposed below the transparent epoxy resin.

20. A method of manufacturing a light emitting device package, the method comprising: forming an electrode pattern on a bottom surface of a transparent cover;disposing a light emitting device below the transparent cover;electrically connecting the electrode pattern to a terminal of the light emitting device;fixing the light emitting device to the bottom surface of the transparent cover via a fixing resin; andforming a metal slug below the fixing resin.

21. The method of claim 20, further comprising forming a plano-convex lens unit on a surface of the transparent cover corresponding to a position of the light emitting device.

22. The method of claim 20, further comprising forming at least one solder ball on an end portion of the electrode pattern.

23. The method of claim 20, wherein the fixing resin comprises a light-transmissive epoxy resin.

24. The method of claim 20, further comprising, before disposing the light emitting device below the transparent cover, forming a wavelength conversion layer comprising a luminescent material on the bottom surface of the transparent cover corresponding to a position of the light emitting device.

25. The method of claim 20, wherein the transparent cover comprises a luminescent material.

26. The method of claim 20, wherein the transparent cover comprises a recess in the bottom surface thereof, and disposing the light emitting device below the transparent cover comprises disposing the light emitting device in the recess.

27. The method of claim 20, wherein forming the metal slug below the fixing resin comprises: forming a seed layer on the bottom surface of the fixing resin; andforming the metal slug on the seed layer.