Information
-
Patent Grant
-
6652123
-
Patent Number
6,652,123
-
Date Filed
Monday, May 7, 200123 years ago
-
Date Issued
Tuesday, November 25, 200321 years ago
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Inventors
-
-
Examiners
- Cariaso; Alan
- Negron; Ismael
Agents
-
CPC
-
US Classifications
Field of Search
US
- 362 241
- 362 252
- 362 227
- 362 235
- 362 237
- 362 240
- 362 249
- 362 800
- 200 46
-
International Classifications
-
Abstract
An LED display panel are mounted with an array of LEDs on a number of metallic partitions, serving as common electrodes foil a line of LEDs as well as heat sinks. Another number of rails serve as common electrodes for another line of LEDs. The metallic partitions and the rails are orthogonal to and insulated from one another at their cross-points.
Description
BACKGROUND OF THE INVENTION
(1) Field of the Invention
The invention relates to light emitting diode (LED) package, particularly to a heat sinking package for a LED display panel.
(2) Brief Description of Related Art
FIG. 1
shows the top view of a prior art LED unit
100
of a display panel. A LED
10
is mounted on a first metal extension
11
of the bottom electrode of the LED
10
. The top electrode (i.e. the second electrode) of the LED
10
is wire-bonded by wire
13
to the a second metal extension
12
. The LED
10
and the metal extensions
11
and
12
are mounted on an insulating substrate
15
. The extensions
11
and
12
are wrapped around the sides
151
and
152
respectively of the insulating substrate
15
to the backside as shown in
FIG. 2
to serve as surface contacts (not shown) on a motherboard
18
.
As the light intensity demand increases, the prior art LED panel encounters the problem of heat dissipation. The need for heat sinking becomes imminent.
SUMMARY OF THE INVENTION
An object of this invention is to devise a package capable of heating sinking the heat generated in a high light intensity for LED display panels. Another object of this invention is to activate a LED display by means of X-Y addressing.
These objects are achieved by mounting a number of LEDs on a metallic partition serving as a common first electrode for a line of LEDs and heat sink Another number of rails serve as common second electrode for another line of LEDs.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
FIG. 1
shows top view of a prior art LED package for surface mounting on a motherboard.
FIG. 2
shows the top view of the motherboard for a prior art LED display panel.
FIG. 3
shows a first embodiment of a LED display panel based on the present invention.
FIG. 4
shows a second embodiment of the LED display panel of the present invention.
FIG. 5
shows a first version of a grooved partition for supporting the common conducting rails of the LED display panel.
FIG. 6
shows a second version of the grooved partition for supporting the common conducting rails of the LED display panel.
FIG. 7
shows a second embodiment of the LED display panel.
FIG. 8
shows a third embodiment of the LED display panel.
FIG. 9
shows a grooved partition with focusing cups.
DETAILED DESCRIPTION OF THE INVENTION
FIG. 3
shows a first embodiment of the present invention. A number corrugated metallic partitions
21
are lined up in parallel. The grooves
25
of the partitions
21
are aligned in a direction perpendicular to the partitions. Another set of metallic rails
22
orthogonal to the metallic partitions
21
are anchored in the grooves
25
of the partitions
21
. On each pedestal of the corrugated partition
21
is mounted a LED
20
. The bottom electrode of the LED
20
is in contact with the pedestal and the top electrode of the LED
20
is wire bonded by wire
23
to the metallic rail
22
. Since the partitions
21
are made of conductors serving as heat sinks, the heat generated in LEDs
20
are conducted away.
FIG. 4
shows another embodiment of the LED package. The partitions
31
correspond to the partitions
21
in
FIG. 3
; the grooves
351
correspond to
25
; and LEDs
30
correspond to LED
20
, all serving the same functions. However, the metallic rails
33
in
FIG. 4
are different from the rails
22
in FIG.
3
. The runners or metallic rails
33
are corrugated in the bottom, such that the grooves of the runners
33
lock in the grooves
351
of the metal partitions
31
. With such a structure, the metallic rails
33
are locked in position with respect to the metal partitions
31
. Similar to
FIG. 3
, the LEDs
30
are mounted on the pedestals of the metal partitions
31
, and the top electrodes of the LEDs are wire-bonded by wires
33
to the rails
32
. The metal partitions
31
serve as heat sinks for the LEDs
30
.
To prevent short circuit between the partitions
21
and rails
23
in
FIG. 3
or between the partitions
31
and rails
33
in
FIG. 4
, the grooves of the partitions are coated with insulating material
361
at the bottom as shown in
FIG. 5
or at all sides
362
as shown in FIG.
6
.
FIG. 7
shows a third embodiment of the present invention. Unlike the corrugated partitions in
FIG. 3
or
FIG. 4
, the metallic partitions
41
are resting on the rails
42
. The LEDs
40
are mounted on the metallic partitions
41
, which in turn rest on the orthogonal rails
42
. The metallic partitions
41
and the rails
42
are insulated from each other with insulators
46
. As in FIG.
3
and
FIG. 4
, the metallic partitions
41
serve as the common bottom electrodes for the LEDs and the heat sink. The top electrodes of the LEDs are wire-bonded to the rail, each serving as a common electrode for a column of LEDs.
FIG. 8
shows a third embodiment of the present invention. Instead of orthogonal partitions in
FIGS. 3
,
4
or
7
, the partitions
51
are interleaved in parallel with the rails
52
. The partitions
51
and the rails
52
are separated by insulators
56
. As in the previous embodiments, the LEDs
50
are mounted on the partitions
51
serving as common bottom electrodes as well as a heat sink for a column of LEDs. The top electrodes of the LEDs are wire-bonded by wires
53
to the common rail
52
for a column of LEDs.
FIG. 9
shows another embodiment of the present invention. The top of pedestals in
FIGS. 3 and 4
is recessed as a cup
27
. The cup focuses the light emitted from the LED to intensify the light in the forward direction.
While particular embodiments of the invention have been described, it will be apparent to those skilled in the art that various modifications may be made in the embodiments without departing from the spirit of the present invention. Such modifications are all within the scope of this invention.
Claims
- 1. A light emitting diode (LED) display package, comprising:a plurality of parallel conducting partitions; a plurality of parallel conducting rails; a plurality of LEDs mounted on said plurality of parallel partitions serving as common first electrodes for a group of said LEDs mounted on the same partition of said partition and heat sink; and said plurality of parallel conducting rails connected to the second electrodes of said LEDs serving as a common electrode for a second group of LEDs lined up along said rails, wherein said partitions are grooved and aligned, and said rails are orthogonal to said partitions and anchored in the grooves of said partitions.
- 2. The LED display package as described in claim 1, wherein said rails are grooved so that the grooves of said rails are locked with the groves of said partitions.
- 3. The LED display package as described in claim 1, wherein said bottoms of said grooves are lined with insulators.
- 4. The LED display package as described in claim 1, wherein the sides of said grooves are lined with insulators.
- 5. The LED display package as described in claim 1, wherein said partitions are mounted orthogonally over and insulated from said rails.
- 6. The LED display package as described in claim 1, wherein said partitions are placed in parallel, interleaved and insulated with said rails.
- 7. The LED display package as described in claim 1, wherein said LEDs are recessed in a cup in said partitions for focusing the light emitted from the LEDs.
US Referenced Citations (12)