Yttrium [Y]

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H01L2924/01039

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01039Yttrium [Y]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,342,299
- Issue date May 24, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device
- Patent number 10,490,486
- Issue date Nov 26, 2019
- Renesas Electronics Corporation
- Hajime Hasebe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 10,434,749
- Issue date Oct 8, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 10,312,217
- Issue date Jun 4, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,199,338
- Issue date Feb 5, 2019
- Renesas Electronics Corporation
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 10,141,218
- Issue date Nov 27, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,115,658
- Issue date Oct 30, 2018
- Renesas Electronics Corporation
- Hajime Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 10,037,956
- Issue date Jul 31, 2018
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating nanostructures and nanowires and devices fab...
- Patent number 9,881,999
- Issue date Jan 30, 2018
- The Regents of the University of California
- Arun Majumdar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 9,805,980
- Issue date Oct 31, 2017
- Renesas Electronics Corporation
- Tadashi Munakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,496,204
- Issue date Nov 15, 2016
- Renesas Electronics Corporation
- Hajime Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,391,143
- Issue date Jul 12, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Room temperature metal direct bonding
- Patent number 9,385,024
- Issue date Jul 5, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,331,149
- Issue date May 3, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor element
- Patent number 9,245,838
- Issue date Jan 26, 2016
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,159,706
- Issue date Oct 13, 2015
- PS4 Luxco S.A.R.L.
- Masachika Masuda
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,082,627
- Issue date Jul 14, 2015
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic system modules and method of fabrication
- Patent number 9,059,070
- Issue date Jun 16, 2015
- SK hynix Inc.
- Peter C. Salmon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board having an embedded...
- Patent number 8,959,756
- Issue date Feb 24, 2015
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 8,952,550
- Issue date Feb 10, 2015
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,877,613
- Issue date Nov 4, 2014
- Renesas Electronics Corporation
- Tadashi Munakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cutting semiconductor substrate
- Patent number 8,865,566
- Issue date Oct 21, 2014
- Hamamatsu Photonics K.K.
- Fumitsugu Fukuyo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package and method of making the same
- Patent number 8,853,836
- Issue date Oct 7, 2014
- Amkor Technology, Inc.
- Thomas P. Glenn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,853,864
- Issue date Oct 7, 2014
- PS4 Luxco S.A.R.L.
- Masachika Masuda
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Room temperature metal direct bonding
- Patent number 8,846,450
- Issue date Sep 30, 2014
- Ziptronix, Inc.
- Qin-yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 8,841,002
- Issue date Sep 23, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor element, method of manufacturing semiconductor elemen...
- Patent number 8,822,323
- Issue date Sep 2, 2014
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including multi-chip
- Patent number 8,711,650
- Issue date Apr 29, 2014
- Renesas Electronics Corporation
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
REVERSABLE ATTACHMENT SYSTEM
- Publication number 20240213212
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
- Publication number 20240105703
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AI WIRING MATERIAL
- Publication number 20240105668
- Publication date Mar 28, 2024
- NIPPON MICROMETAL CORPORATION
- Yuto KURIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Al WIRING MATERIAL
- Publication number 20230299037
- Publication date Sep 21, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AL BONDING WIRE
- Publication number 20230146315
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20220108971
- Publication date Apr 7, 2022
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344534
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20190344533
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20190088618
- Publication date Mar 21, 2019
- Toshiba Memory Corporation
- Kazumichi TSUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027427
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20180374816
- Publication date Dec 27, 2018
- Nippon Micrometal Corporation
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20140370658
- Publication date Dec 18, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140206176
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140203407
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140159245
- Publication date Jun 12, 2014
- RENESAS ELECTRONICS CORPORATION
- Taku KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140084440
- Publication date Mar 27, 2014
- HITACHI HOKKAI SEMICONDUCTOR LTD.
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATION
- Publication number 20140061882
- Publication date Mar 6, 2014
- SK HYNIX INC.
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MAKING COMPLIANT SEMICONDUCTOR CHIP PACKAGES
- Publication number 20140042634
- Publication date Feb 13, 2014
- Tessera, Inc.
- Joseph Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130328046
- Publication date Dec 12, 2013
- Elpida Memory, Inc.
- Masachika MASUDA
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130264696
- Publication date Oct 10, 2013
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CUTTING SEMICONDUCTOR SUBSTRATE
- Publication number 20130252403
- Publication date Sep 26, 2013
- HAMAMATSU PHOTONICS K. K.
- Fumitsugu Fukuyo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20130233473
- Publication date Sep 12, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND MET...
- Publication number 20130224932
- Publication date Aug 29, 2013
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Process for Making Contact with and Housing Integrated Circuits
- Publication number 20130137259
- Publication date May 30, 2013
- WAFER-LEVEL PACKAGING PORTFOLIO LLC
- Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND MET...
- Publication number 20130045585
- Publication date Feb 21, 2013
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF CUTTING SEMICONDUCTOR SUBSTRATE
- Publication number 20120329248
- Publication date Dec 27, 2012
- HAMAMATSU PHOTONICS K. K.
- Fumitsugu Fukuyo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTI-CHIP
- Publication number 20120262992
- Publication date Oct 18, 2012
- RENESAS TECHNOLOGY CORP.
- Kazushige Ayukawa
- G11 - INFORMATION STORAGE

Yttrium [Y]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of room temperature covalent bonding

Bonding wire for semiconductor devices

Semiconductor device

Method of room temperature covalent bonding

Method for low temperature bonding and bonded structure

Semiconductor device and a method of manufacturing the same

Room temperature metal direct bonding

Semiconductor device

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Methods of fabricating nanostructures and nanowires and devices fab...

Method of manufacturing a semiconductor device

Epoxy resin composition for encapsulating semiconductor device and...

Semiconductor device

Method for low temperature bonding and bonded structure

Room temperature metal direct bonding

Method for low temperature bonding and bonded structure

Semiconductor element

Semiconductor device and a method of manufacturing the same

Method for low temperature bonding and bonded structure

Electronic system modules and method of fabrication

Method of manufacturing a printed circuit board having an embedded...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Method of manufacturing a semiconductor device

Method of cutting semiconductor substrate

Integrated circuit package and method of making the same

Semiconductor device and a method of manufacturing the same

Room temperature metal direct bonding

Method of room temperature covalent bonding

Semiconductor element, method of manufacturing semiconductor elemen...

Semiconductor device including multi-chip

Patents Applicationslast 30 patents

REVERSABLE ATTACHMENT SYSTEM

FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME

AI WIRING MATERIAL

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

Al WIRING MATERIAL

AL BONDING WIRE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

METHOD OF ROOM TEMPERATURE COVALENT BONDING

METHOD OF ROOM TEMPERATURE COVALENT BONDING

ROOM TEMPERATURE METAL DIRECT BONDING

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

ROOM TEMPERATURE METAL DIRECT BONDING

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATION

METHODS OF MAKING COMPLIANT SEMICONDUCTOR CHIP PACKAGES

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

METHOD OF CUTTING SEMICONDUCTOR SUBSTRATE

ROOM TEMPERATURE METAL DIRECT BONDING

ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND MET...

Process for Making Contact with and Housing Integrated Circuits

ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND MET...

METHOD OF CUTTING SEMICONDUCTOR SUBSTRATE

SEMICONDUCTOR DEVICE INCLUDING MULTI-CHIP