LIGHT EMITTING DIODE PACKAGE AND FABRICATING METHOD THEREOF

Abstract

A Light Emitting Diode (LED) package including a carrier, a package housing, an LED chip, and an electrostatic discharge protector (ESD protector) is provided. The package housing encapsulates a part of the carrier so as to provide a chip-accommodating space on the carrier. The LED chip disposed on the carrier and located in the chip-accommodating space is electrically connected to the carrier. The ESD protector disposed on the carrier and encapsulated by the package housing is electrically connected to the carrier. The LED package has excellent light-emitting intensity, since the light emitted from the LED chip is not absorbed by the ESD protector encapsulated by the package housing. Additionally, a fabricating method of the LED package is also provided.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A shows a schematic top view of a conventional LED package;

FIG. 1B shows a schematic sectional view of the LED package in FIG. 1A along Line A-A;

FIG. 2A shows a schematic top view of an LED package according to the first embodiment of the present invention;

FIG. 2B shows a schematic sectional view of the LED package in FIG. 2A along Line B-B;

FIG. 3 shows a schematic sectional view of another type of LED package according to the first embodiment of the present invention;

FIG. 4A-4E show schematic views of the fabricating method of the LED package according to the first embodiment;

FIG. 5A shows a schematic top view of an LED package according to the second embodiment of the present invention;

FIG. 5B shows a schematic sectional view of the LED package in FIG. 5A along Line C-C;

FIG. 6 shows a schematic sectional view of an LED package according to the third embodiment of the present invention.

Claims

1. A Light-Emitting Diode (LED) package, comprising: a carrier;a package housing, encapsulating a part of the carrier, so as to form a chip-accommodating space on the carrier;an LED chip, disposed on the carrier and located in the chip-accommodating space, wherein the LED chip is electrically connected to the carrier; andan electrostatic discharge protector (ESD protector), disposed on the carrier and encapsulated by the package housing, wherein the ESD protector is electrically connected to the carrier.

2. The LED package as claimed in claim 1, wherein the ESD protector and the LED chip are disposed on the same surface of the carrier.

3. The LED package as claimed in claim 1, wherein the ESD protector and the LED chip are respectively disposed on the two opposite surfaces of the carrier.

4. The LED package as claimed in claim 1, further comprising at least one bonding wire, wherein the ESD protector is electrically connected to the carrier via the bonding wire, and the package housing encapsulates the bonding wire.

5. The LED package as claimed in claim 1, further comprising a plurality of bumps, wherein the ESD protector is electrically connected to the carrier via the bumps, and the package housing encapsulates the bumps.

6. The LED package as claimed in claim 1, wherein the ESD protector is a Zener Diode chip, red-light LED chip, SMD type Zener Diode package, SMD type red-light LED package, Capacitor, Varistor, or Surge Absorber.

7. The LED package as claimed in claim 1, wherein the carrier is a Lead Frame.

8. The LED package as claimed in claim 7, wherein the package housing encapsulates parts of the regions of the two opposite surfaces of the carrier.

9. The LED package as claimed in claim 1, wherein the carrier is a package substrate.

10. The LED package as claimed in claim 9, wherein the package housing encapsulates at least part of the region of one surface of the carrier.

11. The LED package as claimed in claim 1, further comprising at least one bonding wire, wherein the LED chip is electrically connected to the carrier through the bonding wire.

12. The LED package as claimed in claim 1, further comprising a plurality of bumps, wherein the LED chip is electrically connected to the carrier via the bumps.

13. The LED package as claimed in claim 1, further comprising an encapsulant, wherein the encapsulant encapsulates the LED chip and the carrier exposed by the chip-accommodating space.

14. The LED package as claimed in claim 1, further comprising a Phosphor doped encapsulant for encapsulating the LED chip and the carrier exposed by the chip-accommodating space.

15. The LED package as claimed in claim 1, wherein the material of the package housing comprises plastic, metal, or metal oxide.

16. A fabricating method of an LED package, comprising: providing a carrier;disposing an ESD protector on the carrier;electrically connecting the ESD protector to the carrier;forming a package housing bonded to the carrier, wherein the package housing encapsulates the ESD protector and a part of the carrier, so as to form a chip-accommodating space on the carrier;disposing an LED chip on the carrier exposed by the chip-accommodating space; andelectrically connecting the LED chip to the carrier.

17. The fabricating method of an LED package as claimed in claim 16, wherein the ESD protector and the LED chip are disposed on the same surface of the carrier.

18. The fabricating method of an LED package as claimed in claim 16, wherein the ESD protector and the LED chip are respectively disposed on the two opposite surfaces of the carrier.

19. The fabricating method of an LED package as claimed in claim 16, wherein the ESD protector is disposed on the carrier and electrically connected to the carrier via SMD type technology.

20. The fabricating method of an LED package as claimed in claim 16, wherein the ESD protector is disposed on the carrier and electrically connected to the carrier via flip chip bonding technology.

21. The fabricating method of an LED package as claimed in claim 16, wherein the ESD protector is electrically connected to the carrier via wire bonding technology.

22. The fabricating method of an LED package as claimed in claim 16, wherein the LED chip is disposed on the carrier and electrically connected to the carrier via flip chip bonding technology.

23. The fabricating method of an LED package as claimed in claim 16, wherein the LED package is electrically connected to the carrier via wire bonding technology.

24. The fabricating method of an LED package as claimed in claim 16, further comprising forming an encapsulant to encapsulate the LED chip and the carrier exposed by the chip-accommodating space after electrically connecting the LED chip to the carrier.

25. The fabricating method of an LED package as claimed in claim 16, further comprising forming a Phosphor doped encapsulant to encapsulate the LED chip and the carrier exposed by the chip-accommodating space after electrically connecting the LED chip to the carrier.

26. The fabricating method of an LED package as claimed in claim 16, wherein the package housing bonded to the carrier is formed by a plastics injection molding process or a die casting molding process.