This application claims the benefit of Taiwan application Serial No. 102130047, filed Aug. 22, 2013, the subject matter of which is incorporated herein by reference.
1. Field of the Invention
The invention relates in general to a light emitting module, and more particularly to a light emitting module having a complex circuit board.
2. Description of the Related Art
Along with the maturity in the technology of light emitting diode (LED), LED lamps have gradually replaced conventional incandescent light bulbs and fluorescent tubes. However, in an LED lamp, the connection between LED strips or the connection between LED strips and a driver is generally implemented by soldering, and the space reserved for the use of soldering points cannot be used for placing LEDs. Thus, it is not easy to assemble an LED lamp.
Therefore, the invention provides a light emitting module capable of resolving the problems, such as space waste and assembly difficulty, which are caused by conventional soldering.
The invention is directed to a light emitting module. Through the disposition of a complex circuit board, the light emitting module effectively utilizes the space for placing LEDs on a light strip, avoids dark bands, saves assembly time and reduces the complexity of assembly.
According to one embodiment of the present invention, a light emitting module including a complex circuit board, a light emitting element and an electronic element is provided. The complex circuit board has a light emitting element predetermined area, an electronic element predetermined area and an interval area formed between the light emitting element predetermined area and the electronic element predetermined area. The complex circuit board located at the light emitting element predetermined area and the electronic element predetermined area includes a flexible circuit board, a first rigid substrate and a second rigid substrate. The flexible circuit board has an upper surface and a lower surface opposite to the upper surface. The first rigid substrate is disposed on the upper surface of the flexible circuit board. The second rigid substrate is disposed on the lower surface of the flexible circuit board. The complex circuit board located at the interval area includes an exposed flexible circuit board whose upper and lower surfaces are not covered by the first rigid substrate or the second rigid substrate. The light emitting element is disposed on a surface of the first rigid substrate of the light emitting element predetermined area. The electronic element is disposed on a surface of the first rigid substrate of the electronic element predetermined area. The first rigid substrate and the second rigid substrate are electrically connected to each other through the flexible circuit board. The light emitting element and the electronic element are also electrically connected to each other through the flexible circuit board.
The above and other aspects of the invention will become better understood with regard to the following detailed description of the preferred but non-limiting embodiment (s). The following description is made with reference to the accompanying drawings.
The light emitting module of the invention includes a complex circuit board, a light emitting element and an electronic element.
The light emitting element of the light emitting module, such as an LED or an LED strip, can be disposed on a surface of the first rigid substrate 50 of the light emitting element predetermined area 10. The electronic element of the light emitting module, such as a driver, can be disposed on a surface of the first rigid substrate 50 of the electronic element predetermined area 20. The first rigid substrate 50 and the second rigid substrate 60 are electrically connected to each other through the flexible circuit board 40, and the light emitting element and the electronic element are also electrically connected to each other through the flexible circuit board 40.
In an embodiment, the first rigid substrate 50 includes a first substrate 501, a first insulation layer 502 and a first copper film 503. The first substrate 501 is disposed on the upper surface 401 of the flexible circuit board 40. The first insulation layer 502 is disposed on the first substrate 501. The first copper film 503 is disposed on the first insulation layer 502. The second rigid substrate 60 includes a second substrate 601, a second insulation layer 602 and a second copper film 603. The second substrate 601 is disposed on the lower surface 402 of the flexible circuit board 40. The second insulation layer 602 is disposed on the second substrate 601, and the second copper film 603 is disposed on the second insulation layer 602.
In an embodiment, the complex circuit board 100 further includes a first through hole 504 and a second through hole 604. The first through hole 504 penetrates the first copper film 503, the first insulation layer 502 and the first substrate 501, wherein an inner-wall surface of the first through hole 504 is further coated with a first conductor (not illustrated) for electrically connecting to the flexible circuit board 40. The second through hole 604 penetrates the second copper film 603, the second insulation layer 602 and the second substrate 601, wherein an inner-wall surface of the second through hole 604 is further coated with a second conductor (not illustrated) for electrically connecting to the flexible circuit board 40. Besides, the complex circuit board 100 may include two solder masks 505 and 605 disposed on the first copper film 503 and the second copper film 603, respectively.
In the present embodiment of the invention, the light emitting element may be an LED, the electronic element may be another LED or a drive module. The first substrate 501 and the second substrate 601 can be formed of such as glass fiber.
As indicated in the complex circuit board 100 of
Due to the structure of the complex circuit board 200, the LEDs 155 on the LED strips 70 do not need to reserve a space for soldering connectors, such that no dark band will be formed on the LED strips 70. Since the LED strips 70 and the driver 80 are connected to each other through the flexible circuit board 45, the LED strips 70 and the driver 80 can be disposed on the upper surface and the lower surface of the aluminum extrusion 90, respectively, not only saving the overall space but also avoiding the driver 80 being too long which may cause dark band in the light emitting module.
Suppose that the user would like to add a connector to enhance the connection between the two LED strips 70, the added connector does not have to be formed by metal for soldering purpose, and can also be formed by plastics or other materials to save cost because the two LED strips 70 are electrically connected to each other through a flexible circuit board 40.
As disclosed in the embodiments of the invention, the light emitting module uses a complex circuit board, not only effectively saving the space on the circuit board and saving the manufacturing process of connector, but further effectively utilizing the space for placing LED elements. Besides, product assembly is simplified, assembly labor is reduced, and product reliability is improved.
While the invention has been described by way of example and in terms of the preferred embodiment (s), it is to be understood that the invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Number | Date | Country | Kind |
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102130047 | Aug 2013 | TW | national |