This application claims priority from Japanese Priority Patent Application No. 2021-205048 filed on Dec. 17, 2021. The entire teachings of the above application are incorporated herein by reference.
The present invention relates to light irradiation devices and light source units, particularly a light irradiation device and a light source unit using LED elements as a light source.
Printing apparatuses that perform printing using photo-curing ink that is cured by ultraviolet light irradiation (hereinafter referred to as “UV printing apparatuses”) are known. Conventionally, discharge lamps have been used as light sources for UV printing apparatuses. In recent years, however, LED (light-emitting diode) elements have begun to be used in place of discharge lamps because of their advantages such as low energy consumption and a long lifetime. However, since a single LED element has a low output, a plurality of LED elements is necessary to be arranged as a light source in order to radiate ultraviolet light at a light intensity that enables ink curing in a short period of time.
When a plurality of LED elements is made to be arranged as a light source, the problem of heat generation at the light source arises. Since the luminous efficiency and lifetime of LED elements decrease as their operating temperature increases, it is necessary to ensure high performance of exhausting heat from the viewpoint of improving efficiency and lifetime characteristics. For example, Japanese Patent 5940116 discloses technology related to cooling mechanisms provided in light source devices for UV printing apparatuses.
Currently, the market demands high-quality, high-speed printing technology. To meet these demands, it is necessary to further increase the light output from the light source. However, as mentioned above, when a light source is constituted by a plurality of LED elements, it is necessary to achieve even higher performance of exhausting heat because temperature rise is desirably avoided from the viewpoint of luminous efficiency and lifetime.
According to the configuration disclosed in Japanese Patent No. 5940116, the exhaust air after heat exchange through the heat sink is exhausted to the outside of the light irradiation device. From the viewpoint of further improving the light output as described above, it is desirable to increase the air volume of the cooling air supplied to the heat sink in order to improve the cooling efficiency.
In order to increase the air volume of the cooling air supplied to the heat sink, it is necessary to provide a large air inlet or air guide channel; however, such measures result in increasing the size of the entire light irradiation device. In particular, for light irradiation devices applied to UV printing apparatuses, such measures of increasing the size of the entire device are undesirable because the size of the entire device is determined, to a certain extent, by printing machines and printed matter, for example.
In view of the above problem, it is desirable to provide a light irradiation device and a light source unit with improved cooling efficiency of LED elements without increasing the size of the entire device.
The light irradiation device of the present invention includes:
The term “light-emitting area” as used in the present specification refers to an area enclosed by the envelope connecting the outer periphery of the entire plurality of LED elements mounted on a single LED substrate.
A heat pipe is a component that contains a fibrous or mesh-like element called a wick and a liquid that evaporates by absorbing heat (hereinafter referred to as “working fluid”) inside a tube body made of metal. The heat pipe performs heat transport through the evaporation of working fluid due to absorbed heat, the condensation of the working fluid due to heat dissipation, and the high-speed movement of the evaporated and condensed working fluid inside the tube body.
The heat pipe absorbs the heat generated in the light-emitting area of the LED substrate, i.e., the heat generated by the lighting of the plurality of LED elements, and allows the heat to move sequentially to an area away from the light-emitting area.
Hence, the above configuration allows the heat generated in the light-emitting area to be sequentially exhausted faster, thereby improving the heat exhaust efficiency in the light-emitting area of the heat sink. In other words, the light irradiation device of the above configuration can further cool the LED elements mounted in the light irradiation device compared with that of the conventional configuration.
The light irradiation device described above may include:
Furthermore, the above light irradiation device may be configured such that at least one end portion of the heat pipe is located outside the light-emitting area and closer to the air inflow area than the light-emitting area.
The cooling air that has been drawn from the outside of the enclosure flows through the vicinity of the heat pipe to which heat is transported from the light-emitting area, before reaching the surroundings of the light-emitting area. The cooling air that has absorbed heat to increase its temperature is pushed out by cooling air that is sequentially fed, thus it does not stay in the vicinity of the fins, and is exhausted out of the heat sink through the gap between the fins.
Hence, the above configuration allows the heat generated in the light-emitting area to be sequentially transported by the heat pipe to an area away from the light-emitting area. Then, the transported heat is sequentially exhausted by the cooling air having a relatively low temperature and flowing in from the outside of the enclosure. In other words, the light irradiation device of the present invention can exhaust the heat generated by the LED elements more efficiently, achieving higher cooling efficiency compared with the light irradiation device of the conventional configuration.
In the above light irradiation device, at least part of the heat pipe may be disposed along a first direction, and the separating portion may be formed in a manner that the cooling air flows along the first direction.
The above configuration allows the heat generated in the light-emitting area to be directly transported by at least part of the heat pipe toward the air inflow area in which cooling air without absorbing heat from the light-emitting area flows. In other words, the cooling air flows from the part to which the heat is transported toward the part in which the heat is absorbed. As a result, the cooling air can intensively absorb heat in the area to which heat is transported, thereby further improving the heat exhaust efficiency of the heat sink.
In the above light irradiation device, the enclosure may include a first air inlet and a first air guide channel through which the cooling air is introduced to one end edge portion of the fins, and a second air inlet and a second air guide channel through which the cooling air is introduced to the other end edge portion of the fins.
When the light-emitting area is formed on a center portion of the fin with respect to the first direction, and the end portions of the heat pipe to which the heat absorbed by the heat pipe is transported are disposed on the corresponding end edge portions, the above configuration allows the cooling air introduced from each of the first air guide channel and the second air guide channel to absorb the heat released from the heat pipe, and also to absorb the heat from the light-emitting area, resulting in exhausting the heat.
Furthermore, when heat is transported by one or more heat pipes from the center portion of the heat sink in the first direction to both end portions of the heat sink, the heat transported to both end portions thereof can be exhausted by the cooling air introduced from the respective air guide channels. Therefore, this configuration achieves the light irradiation device with higher heat exhaust efficiency.
In the light irradiation device described above, the heat sink may be configured such that a protruding length of the fins is shorter on the end edge portion than on the center portion.
In order to absorb more heat, the cooling air introduced between the fins of the heat sink preferably flows through close to the LED substrate, which is a heat source, and also the vicinity of a base body of the heat sink in which the heat pipe is provided, as much as possible. Hence, the area communicating between the air guide channel and the heat sink is designed to be in the vicinity of the base body of the heat sink as much as possible.
Increasing the total amount of cooling air supplied to the heat sink in order to improve cooling efficiency needs an increase in the cross-sectional area of the air guide channel as much as possible. However, simply enlarging the channel results in a larger size of the entire light irradiation device by the amount of the expanded air guide channel. Hence, for expanding the air guide channel, it is preferable to reduce some components in the light irradiation device to secure the area.
The above configuration allows the area communicating between the air guide channel and the heat sink to be narrowed such that the area is limited to the vicinity of the base body. The area where the protruding length of the fins is shortened can be used to expand the air guide channel. The heat sink may be configured such that the protruding length of the fins is relatively shortened in the area located outside the light-emitting area.
The light irradiation device described above may include an outlet channel through which the cooling air that has flowed through the separating portion is exhausted, a fan that is located in the outlet channel and that directs the cooling air from the air inlet to the outlet channel, and a wind shielding member provided between an inner wall face of the outlet channel and the fan.
If the fan is mounted in the vicinity of the heat sink, cooling air that has absorbed heat to become hot may flow backward in the outlet channel, posing a concern that the cooling air may mix with cooling air that has not absorbed heat flowing in from the air guide channel, and this mixed air may be introduced into the air inflow area. If this happens, the temperature of the cooling air introduced from the air guide channel rises, and the amount of cooling air flowing from the air guide channel into the heat sink is reduced, which may result in a decrease in cooling efficiency.
The above configuration prevents cooling air that has passed through the fan from flowing backward toward an upstream side through gaps in the surroundings of the fan.
In the above light irradiation device, part of the heat pipe may be arranged to overlap with the center of the light-emitting area when viewed from the direction in which the fin protrudes.
The “center of the light-emitting area” in the present specification corresponds to the center of gravity in the shape of the light-emitting area when viewed from a direction orthogonal to the main surface of the LED substrate.
The above configuration allows the heat pipe to absorb heat from the center of the light-emitting area, from which heat is difficult to be exhausted, and sequentially transport heat to the outside of the light-emitting area. This enables the heat pipe to exhaust a larger amount of heat from the LED substrate per unit time, further improving the cooling efficiency of the LED elements.
The above light irradiation device may be configured such that the LED substrate is in contact with at least part of the heat pipe.
Furthermore, in the above light irradiation device, the heat pipe may have a flattened shape at least in a portion at which the heat pipe is in contact with the LED substrate.
The above configuration improves the thermal conductivity between the LED substrate and the heat pipe, thereby improving the cooling efficiency of the LED elements.
The above light irradiation device may include a plurality of light source units including the LED substrate in which the light-emitting area is formed between both ends of two facing sides on the main surface, the heat pipe, and the heat sink, and the plurality of light source units may be arranged to emit light having a line shape.
In the present specification, “light-emitting area is formed between both ends” means that the LED elements are arranged such that the largest width of the light-emitting area is 80% or more with respect to the width of the LED substrate in a second direction.
The above configuration enables each light source unit in the light irradiation device to be replaced, for example, which makes maintenance, repair, or the like easier. In addition, the light irradiation device in the above configuration can be configured to adjust the number of light source units mounted therein and to select the light source unit that supplies electric power, thereby adjusting the length of light emitted therefrom in accordance with the size of the printed matter, for example.
The light source unit of the present invention may be a light source unit including the LED substrate, the heat sink, and the heat pipe; and the plurality of light source units may be arranged in the above light irradiation device in the second direction. The light-emitting areas may be formed between both ends of the LED substrates in the second direction on the first main surface of the LED substrate.
The present invention provides a light irradiation device and a light source unit with improved cooling efficiency of LED elements without increasing the size of the entire device.
Hereinafter, the light irradiation device of the present invention will be described with reference to the drawings. Not that each of the following drawings is illustrated schematically, and the dimensional ratios and numbers in the drawings do not necessarily correspond to the actual dimensional ratios and numbers.
As shown in
Hereinafter, as shown in
When a direction is expressed with distinguishing a positive direction from a negative direction, the direction is described with a positive or negative sign, such as “+Z direction” or “-Z direction”; and when a direction is expressed without distinguishing a positive direction from a negative direction, the direction is simply described as “Z direction”.
In the first embodiment, the air inlets (12a, 12b) are designed to draw air from the outside of the enclosure 10 into the inside of the enclosure 10 as the cooling air W1.
As shown in
Each of the air guide channels (15a, 15b) of the first embodiment, as shown in
The outlet channel 16, as shown in
In addition, the first embodiment is provided with the power supply unit 21 that supplies power to the light source unit 20 and the fan 14 in the outlet channel 16 (see
The fan 14 is disposed in the outlet channel 16 of the enclosure 10, as shown in
A wind shielding member 17 is provided between the fan 14 and an inner wall face 16a of the outlet channel 16, as shown in
Note that the wind shielding member 17 need not be provided in the case in which the fan 14 is mounted at a position closer to the air outlet 13 such that part of the cooling air W2 flowing backward is negligible. In addition, the air inlets (12a, 12b) and the fan 14 need not be provided in the case in which heat can be sufficiently exhausted by natural convection generated by temperature differences inside the enclosure, or in the case in which cooling mechanisms such as water-cooling is mounted.
The light-emission window 11 is a window provided to allow light emitted from the light source unit 20 to emit toward the -Z direction. The light-emission window 11 may be a simple aperture, but it may be covered with a material that transmits the light emitted from the light source unit 20 so as to prevent dust, for example, from adhering to the light source unit 20. When the opening is covered with such a material, examples of the material of the component constituting the light-emission window 11 include quartz glass and borosilicate glass.
As shown in
In the first embodiment, the LED substrate 32 has a size of (X, Y) = (70 mm, 25 mm), and is provided with the plurality of LED elements 31 arrayed in the X direction and the Y direction on the first main surface 32a thereof such that the light-emitting area 31a has a rectangular shape with a size of (X, Y) = (33 mm, 24 mm).
The LED element 31 in the first embodiment is an element that emits light having a main emission wavelength of 400 nm, which is a wavelength that exhibits the peak intensity in the intensity spectrum of the emitted light. However, any wavelength of the light emitted from the LED element 31 mounted can be selected.
In the case of light sources for curing ink used in UV printing apparatuses, the LED element 31 is preferably an element that emits light having a main emission wavelength within the range of 250 nm or more to 500 nm or less, and more preferably an element that emits light having a main emission wavelength within the range of 260 nm or more to 450 nm or less.
The LED elements 31 in the first embodiment are, as shown in
As shown in
In the heat sink 33 in the first embodiment, the base body 33a and the fins 33b are made of aluminum alloys; however, the base body 33a and the fins 33b can be made of other materials such as copper or magnesium alloys. If the heat sink 33 is configured to allow cooling air to flow in the vicinity thereof toward a predetermined direction using a fan or an air guide channel, the heat sink 33 need not be provided with the fins 33b.
The heat pipe 34 has a straight tube shape, as shown in
The heat pipe 34 in the first embodiment uses a heat pipe of 70 mm in length in its extension direction, and the tube body of which is made of copper. The heat pipe 34 is known to have a higher cooling efficiency as the length in which the heat pipe 34 transports heat is longer. However, the heat pipe 34 having an excessively long length becomes difficult to secure an area for its placement. For this reason, the length of the heat pipe 34 mounted on the light irradiation device 1 in the extension direction is preferably from 50 mm or more to 100 mm or less, and more preferably from 70 mm or more to 80 mm or less.
The heat pipe 34, in order to be in contact with the LED substrate 32 on the surface, may be configured to have entirely a flattened shape, or may be configured to have a flattened shape only at the portion that is made to be in contact with the LED substrate 32. The heat pipe 34 may have a flat surface on the -Z side only at the portion that is made to be in contact with the LED substrate 32.
In addition, the heat pipe 34 may be configured to have a straight tube shape and to be entirely embedded in the base body 33a of the heat sink 33 so as not to be directly in contact with the LED substrate 32. Furthermore, the heat pipe 34 having a straight tube shape with its length in the extension direction being longer than the width of the heat sink 33 in the X direction may be employed.
The above configuration allows the heat generated in the light-emitting area 31a to be transported sequentially by the heat pipe 34 to a position closer to the air inflow area (A1, A2), which is away from the light-emitting area 31a. The heat that has been transported to a position closer to the air inflow area (A1, A2) is sequentially absorbed by the cooling air W1 and exhausted. The cooling air W1 flows in from each of the air guide channels (15a, 15b) and has a relatively low temperature because it has not yet absorbed heat in the enclosure 10. Therefore, the light irradiation device 1 can exhaust heat generated by the LED element 31 more efficiently than the conventional configuration of the light irradiation device, thereby achieving higher cooling efficiency.
In the light source unit 20 in the first embodiment, as shown in
In addition, as shown in
The above description is that the light irradiation device 1 is capable of emitting light in the form of a line by arranging the plurality of light source units 20. However, it is also possible to configure a device that can emit light in the form of an even longer line by connecting the plurality of light irradiation devices 1 in the Y direction.
The light irradiation device 1 may be configured to be provided with only one light source unit 20 in which the light-emitting area 31a is formed for the desired size when, for example, the light irradiation device 1 is used only for objects to be irradiated that are small in size. Also as shown in
The enclosure 10 in the first embodiment is configured such that it can be disassembled into multiple components, as shown in
The fan 14 in the first embodiment is located in the outlet channel 16, but it can also be located in the air inlet 12 or the air guide channels (15a, 15b).
The heat sink 33 in the first embodiment is configured such that the base body 33a is directly in contact with the LED substrate 32; however, instead of the direct contact, the heat sink 33 may be disposed to be thermally in contact with the LED substrate 32 via the heat pipe 34.
The following describes the configuration of the second embodiment of the light irradiation device 1 of the present embodiment, focusing on the points that differ from those of the first embodiment.
The heat pipe 34 has a higher cooling efficiency as the distance in which the heat is transported from its position in the light-emitting area 31a is longer. In other words, the heat pipe 34 itself has a higher cooling efficiency as the length in the extension direction per pipe is longer.
The heat pipe 34 provided in the light source unit 20 of the second embodiment is longer in the extension direction than the heat pipe 34 provided in the light source unit 20 of the first embodiment, thereby further improving the cooling performance.
The light source unit 20 in the second embodiment has a configuration in which the two U-shaped heat pipes 34 are arranged, but it is also possible to have a configuration in which one S-shaped heat pipe 34 is arranged to pass through the +Z side of each light-emitting area 31a.
The configuration of the third embodiment of the light irradiation device 1 of the present embodiment will be described, focusing on the points that differ from those of the first embodiment and the second embodiment.
The light irradiation device 1 of the third embodiment has the heat pipes 34 shorter per pipe than those provided in the light source unit 20 of the first embodiment; however, the plurality of heat pipes 34 remove heat generated at a single light-emitting area 31a, thereby further improving the cooling performance.
Hereinafter, another embodiment is described.
As shown in
The light source unit 20 in another embodiment is also configured such that one end portion of the heat pipe 34 is located inside the light-emitting area 31a when viewed in the Z direction. In other words, the heat pipe 34 in this configuration absorbs heat at the one end portion located on the light-emitting area 31a and transports it to a position closer to the first air inflow area A1. Then, as shown in
The above configuration enables the light irradiation device 1 to be configured with only one air inlet 12 and one air guide channel 15, leading to downsizing the entire light irradiation device 1.
The above-mentioned configuration of the light irradiation device 1 is merely an example, and the present invention is not limited to each of the illustrated configurations.
Number | Date | Country | Kind |
---|---|---|---|
2021-205048 | Dec 2021 | JP | national |