The present disclosure relates to a light source device and a projector.
Patent Document 1 discloses a light source device which includes a light source part having a light emitting element installed in a substrate and a heat radiation part thermally connected to the light source part. In the light source device of Patent Document 1, the light source part is placed on a flat placement surface of the heat radiation part.
Incidentally, in this type of light source device, ensuring the heat radiation performance of the light source part, dust prevention measures for the light source part, and electrical reliability of the light source device is required.
The present invention was made in consideration of the above-described circumstances, and an object of the present invention is to provide a light source device and a projector which can ensure the heat radiation performance of a light source part, dust prevention measures for the light source part, and electrical reliability.
A first aspect of the present invention is a light source device which includes: a light source part; heat radiation parts which each have a placement surface including a placement region on which the light source part is placed; a case member with which the light source part placed on the placement region is covered by pressing an edge of an opening toward a circumferential region of the placement surface which is located around the placement region; and a wiring board which is connected to the light source part and extends from the light source part to an outside of the placement surface along the placement surface. The light source part includes a substrate and a connector which is installed in a main surface of the substrate and connected to the wiring board. The connector is located at an interval from the placement region in a direction away therefrom by bringing a surface of the substrate which faces an opposite side to the main surface into contact with the placement region. The circumferential region is located to have a gap in a direction in which it is away from the placement region by providing a step between the circumferential region and the placement region.
A second aspect of the present invention is a projector which includes the light source device.
According to the present invention, it is possible to ensure the heat radiation performance of the light source part, dust prevention measures for the light source part, and electrical reliability of the light source device.
A first embodiment of the present invention will be described below with reference to
A projector 1 according to this embodiment shown in
The image light formation device creates image light on the basis of light output from the light source device 3 which will be described below. Although not shown in the drawings, an optical engine includes a light modulation element such as a Digital Micromirror Device (DMD) or a liquid crystal panel, electronic components which control the light modulation element, or the like.
The projection device 5 expands image light output from the image light formation device and projects the expanded image light onto a display surface such as a screen.
As shown in
The light source parts 10 emits light. The light source device 3 in this embodiment has the plurality of (six in the shown example) light source parts 10.
As shown in
Although not shown in the drawings, the substrate 11 also has a thermistor which measures a temperature of the light source parts 10 installed therein. The substrate 11 has an electrical wiring (not shown) which connects the light emitting element 12 and the thermistor to the connector 13 formed therein. The connector 13 is connected to the wiring board 40 which will be described later.
As shown in
In
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As shown in
In a state in which the light source parts 10 are placed on the placement region 21a1, the light generated in the light emitting elements 12 of the light source parts 10 is mainly directed in a direction in which it goes away from the placement surface 21a (the Z-axis forward direction). Furthermore, the connector 13 of the light source part 10 is located above and spaced apart from the placement region 21al by a thickness of the substrate 11.
As shown in
An area of the placement surface 21a is set to be small in consideration of the heat radiation efficiency of the light source parts 10 through the heat radiation part 20. In other words, a ratio of an occupation area of the plurality of light source parts 10 to the area of the placement surface 21a is set to be large. For this reason, a gap between the light source parts 10 placed in the placement region 21al and an edge of the placement region 21al (a boundary with the circumferential region 21a2) is reduced.
As shown in
The base part 21 is formed in a plate shape in which the Z-axis direction is defined as a thickness direction thereof. The base part 21 is, for example, made of a highly conductive material such as copper.
The extended heat radiation parts 22 each extend from both ends of the base part 21 in the second direction (the Y-axis direction) along the placement surface 21a. The extended heat radiation part 22 may extend from only one end of the base part 21, for example, in the second direction. The extended heat radiation part 22 is configured to radiate heat by flowing air through the extended heat radiation parts 22 in the direction which is orthogonal to that of the placement surface 21a (the Z-axis direction).
Specifically, the extended heat radiation part 22 include heat pipes 221 and a plurality of heat radiation fins 222 attached to the heat pipes 221. The heat pipes 221 each extend in the second direction from an end of the base part 21. In the embodiment, the heat pipe 221 passes through the base part 21 in the second direction and extends from both ends of the base part 21. The heat pipes 221 are arranged in the first direction (the X-axis direction).
Each of the plurality of heat radiation fins 222 of the extended heat radiation parts 22 is formed in a plate shape in which the direction in which the heat pipes 221 extend (the Y-axis direction) is defined as a thickness direction thereof. The plurality of heat radiation fins 222 on both sides of the base part 21 in the second direction are arranged to have gaps therebetween in the second direction. The heat pipes 221 are attached to the plurality of heat radiation fins 222 to pass through the heat radiation fins 222 in the thickness direction thereof.
In the extended heat radiation parts 22 configured in this way, air can flow between the plurality of heat radiation fins 222 in the direction which is orthogonal to that of the placement surface 21a (the Z-axis direction).
The rear-surface heat radiation part 23 has a plurality of heat radiation fins 231 provided on a rear surface 21b of the base part 21 which faces an opposite side to the placement surface 21a. The rear surface 21b of the base part 21 is a surface which is generally parallel to the placement surface 21a. In the following description, the direction along the rear surface 21b corresponds to the first direction (the X-axis direction) and the second direction (the Y-axis direction) and the direction which is orthogonal to that of the rear surface 21b corresponds to the Z-axis direction.
Each of the plurality of heat radiation fins 231 is formed in a plate shape in which the second direction along the rear surface 21b of the base part 21 is defined as a thickness direction. Furthermore, each of the heat radiation fins 231 extends in the first direction along the rear surface 21b of the base part 21. The plurality of heat radiation fins 231 are arranged to have gaps between these in the second direction, as in the heat radiation fins 222 in the extended heat radiation parts 22.
The plurality of heat radiation fins 231 each extend from both ends of the base part 21 in the first direction. Thus, on both sides of the base part 21 in the first direction, air can pass in a direction which is orthogonal to that of the rear surface 21b (the Z-axis direction) so that air passes between the plurality of heat radiation fins 231 of the rear-surface heat radiation part 23. The plurality of heat radiation fins 231 may, for example, extend from only one end of the base part 21 in the first direction.
The heat radiation part 20 configured as described above plays a role in cooling the light source parts 10. Specifically, heat generated in the light source parts 10 placed in the placement region 21al is transferred to the base part 21 and then mainly to the heat pipes 221 and the plurality of heat radiation fins 222 of the extended heat radiation parts 22. Moreover, by flowing air between the plurality of heat radiation fins 222 in the direction which is orthogonal to that of the placement surface 21a (the Z-axis direction), specifically by flowing air in the Z-axis forward direction, the heat transferred from the light source parts 10 to the plurality of heat radiation fins 222 of the extended heat radiation parts 22 is radiated.
Also, a part of the heat transferred to the base part 21 is also transferred to the plurality of heat radiation fins 231 in the rear-surface heat radiation part 23. Furthermore, by flowing air between the plurality of heat radiation fins 231 of the rear-surface heat radiation part 23 in the direction which is orthogonal to that of the placement surface 21a (the Z-axis direction), specifically, by flowing air as indicated by the arrows in
As shown in
As shown in
The first opening 31 of the case member 30 is blocked using the heat radiation part 20 and the second opening 32 of the case member 30 is blocked using the optical unit (or the image light formation device or the like), thereby preventing or suppressing dust from entering the inside of the case member 30.
The case member 30 is formed not to protrude outward (in the X-axis direction, the Y-axis direction) from an edge of the placement surface 21a. Thus, this can prevent a flow of air passing between the plurality of heat radiation fins 222 and 231 of the extended heat radiation parts 22 and the rear-surface heat radiation part 23 from the rear surface 21b side of the base part 21 toward the placement surface 21a side (Z-axis forward direction) around the base part 21 from being obstructed by the case member 30.
As shown in
The wiring board 40 is formed in a long and narrow strip shape and is disposed so that longitudinal and width directions thereof are aligned along the placement surface 21a. The wiring board 40 is a flexible wiring board which can be easily bent in the thickness direction of the wiring board 40 at any intermediate portion in a longitudinal direction thereof.
As shown in
The wiring board 40 arranged as described above is disposed so that the wiring board 40 and a part in a circumferential direction of the circumferential region 21a2 of the placement surface 21a overlap and the wiring board 40 is disposed between a part in the radial direction of the circumferential region 21a2 and the edge 311 of the first opening 31 of the case member 30 (refer to particularly
In the light source device 3 of the first embodiment and the projector 1 including the light source device 3, it is possible to ensure the heat radiation performance of the light source parts 10, the dust prevention measures of the light source parts 10, and the electrical reliability. These points will be described below.
The edge 311 of the first opening 31 of the case member 30 can be pressed toward the circumferential region 21a2 of the placement surface 21a, and specifically is in contact with the circumferential region 21a2, thereby ensuring dust prevention measures for the light source parts 10.
Moreover, in the light source device 3 of this embodiment, the circumferential region 21a2 of the placement surface 21a which is in contact with the edge 311 of the first opening 31 of the case member 30 is located above the placement region 21al to have a gap, as in the connector 13 of the light source parts 10. For this reason, it is possible to ensure the electrical reliability of the light source device 3. This point will be described below.
When the connector 13 of the light source part 10 is located above the placement region 21al to have a gap, the wiring board 40 which is connected to the connector 13 is located above the placement region 21al to have a gap near the connector 13 (refer to
For this reason, for example, when there is no step between the placement region 21al and the circumferential region 21a2, the wiring board 40 which extends from the light source parts 10 is located above the circumferential region 21a2 to have a gap therebetween. Thus, if the wiring board 40 is disposed between the edge 311 of the first opening 31 of the case member 30 and the circumferential region 21a2, a force acting on the connection portion (the connector 13) between the light source parts 10 and the wiring board 40 will become large. As a result, the electrical reliability of the connection is reduced.
On the other hand, when the circumferential region 21a2 is located above the placement region 21al to have a gap therebetween, the wiring board 40 which extends from the light source parts 10 can be located on the circumferential region 21a2 so that the gap with respect to the circumferential region 21a2 is small or so that the gap is eliminated. Thus, even when the wiring board 40 is disposed between the edge 311 of the first opening 31 of the case member 30 and the circumferential region 21a2, a force acting on the connection portion (the connector 13) between the light source parts 10 and the wiring board 40 can be reduced or eliminated. Therefore, it is possible to ensure the electrical reliability of the light source device 3.
The above-described effect (the effect of ensuring the electrical reliability of the light source device 3 by locating the circumferential region 21a2 above the placement region 21al to have a gap) is effective when the size of the base part 21 when viewed in a plan view (that is, an area of the placement surface 21a) is small and a distance between the light source parts 10 placed on the placement surface 21a and a circumference of the placement surface 21a when viewed in a plan view is small. That is to say, according to this embodiment, while keeping the area of the placement surface 21a small, the connection between the light source parts 10 and the wiring board 40 is ensured, and the electrical reliability of the light source device 3 can be ensured.
Moreover, by making the area of the placement surface 21a smaller, even if there are restrictions on an installation space of the light source device 3 in the projector 1, it is possible to secure a space around the base part 21 (the placement surface 21a) for placing other components of the heat radiation part 20 (the heat radiation fins 222 and 231 of the extended heat radiation parts 22 and the rear-surface heat radiation part 23). Thus, by circulating air through heat radiation fins 222 and 231 disposed around the placement surface 21a, it is possible to ensure the heat radiation performance of the light source parts 10.
Also, in the light source device 3 and the projector 1 of the first embodiment, the heat radiation part 20 has the extended heat radiation parts 22 which extend from the end of the base part 21 in the second direction (the Y-axis direction) along the placement surface 21a. The extended heat radiation parts 22 dissipate heat by flowing air in the direction which is orthogonal to that of the placement surface 21a (the Z-axis direction). On the other hand, the wiring board 40 which extends from the light source part 10 placed on the placement surface 21a extends in the first direction along the placement surface 21a.
For this reason, even if the wiring board 40 extends along the placement surface 21a to the outside of the placement surface 21a, it is possible to prevent the overlapping of the wiring board 40 and the extended heat radiation parts 22 in the direction which is orthogonal to that of the placement surface 21a. Thus, this makes it possible to prevent the wiring board 40 from obstructing a flow of air in the extended heat radiation parts 22. Therefore, it is possible to improve the heat radiation efficiency of the light source parts 10.
Also, in the light source device 3 and the projector 1 of this embodiment, the heat radiation part 20 has the plurality of heat radiation fins 231 which are provided on the rear surface 21b of the base part 21 and extend in the first direction (the X-axis direction). The plurality of heat radiation fins 231 extend from the end of the base part 21 in the first direction (the X-axis direction).
Thus, by flowing air in the first direction through the portions of the heat radiation fins 231 which protrude from the end of the base part 21, it is possible to efficiently radiate the heat transferred from the light source parts 10 to the heat radiation fins 231. Therefore, it is possible to improve the heat radiation efficiency of the light source parts 10.
Furthermore, in the light source device 3 and the projector 1 of this embodiment, the wiring board 40 is a flexible wiring board. Thus, the wiring board 40 can be freely curved outside the placement surface 21a (the circumferential region 21a2).
In the first embodiment, the wiring board 40 is not limited to a flexible wiring board and may be, for example, a rigid wiring board which does not undergo bending deformation.
A second embodiment of the present invention will be described below with reference to
As shown in
The wiring board 40C in this embodiment is a rigid wiring board which does not curve in the thickness direction thereof.
As shown in
As shown in
In the wiring board 40C of this embodiment, a through hole 43 which passes through the wiring board 40C in a plate thickness direction thereof is formed. The through hole 43 is formed in a portion of the wiring board 40C which is located outside the circumferential region 21a2. The through hole 43 passes through the wiring board 40C in the direction which is orthogonal to that of the placement surface 21a (the Z-axis direction) in a state in which the wiring board 40C is disposed so that the wiring board 40C and the circumferential region 21a2 overlap.
As shown in
According to the light source device 3C of the second embodiment, the same effect as in the first embodiment is achieved. For example, an edge 311 of the first opening 31 of the case member 30 can be pressed toward the circumferential region 21a2 of the placement surface 21a, thereby ensuring dust prevention measures for the light source parts 10.
Specifically, the wiring board 40C is disposed between the circumferential region 21a2 and the edge 311 of the first opening 31 of the case member 30. For this reason, compared to when the wiring board 40C and only a part in the radial direction of the circumferential region 21a2 overlap, even if the wiring board 40C is thick, the occurrence of a gap between the circumferential region 21a2 and the case member 30 can be suitably suppressed or prevented. Therefore, even if the wiring board 40C is thick, it is possible to easily ensure the dust prevention measures of the light source parts 10. Also, in the light source device 3C of the second embodiment, the plurality of light source parts 10 are connected to one of the external connection connectors 42 of the wiring board 40C which is disposed outside the circumferential region 21a2. Thus, a predetermined device (for example, a power source or a control device) can be easily connected to the plurality of light source parts 10 by simply connecting the predetermined device to one of the external connection connectors 42 on the wiring board 40C.
Furthermore, in the light source device 3C of the second embodiment, the through hole 43 which passes through the wiring board 40C in the plate thickness direction is formed in a portion of the wiring board 40C which is located outside the circumferential region 21a2. For this reason, air can pass through the through hole 43 of the wiring board 40C in the plate thickness direction of the wiring board 40C (that is, the direction which is orthogonal to that of the placement surface 21a). Thus, even if a portion of the wiring board 40C which is located outside the circumferential region 21a2 and the plurality of heat radiation fins 231 of the rear-surface heat radiation part 23 which protrudes outside the circumferential region 21a2 overlap in the orthogonal direction which is orthogonal to that of the placement surface 21a (the Z-axis direction), the wiring board 40C can be prevented from impeding a flow of air in the plurality of heat radiation fins 231. Therefore, it is possible to suppress a decrease in the heat radiation efficiency of the light source parts 10 due to the wiring board 40C.
In addition, in the light source device 3C of the second embodiment, the wiring board 40C is a rigid wiring board and does not bend like a flexible wiring board. For this reason, the positioning of the wiring board 40C relative to the connector 13 of the light source parts 10 can be easily performed, as compared to when the wiring board 40C is a flexible wiring board. This effect is particularly effective when there are a plurality of connectors 13 of the light source parts 10 which are connected to the wiring board 40C.
In the second embodiment, the external connection connector 42 may be provided in a portion of the wiring board 40C which protrudes from the circumferential region 21a2 toward the other side in the first direction (the side in the X-axis rearward direction). Moreover, the external connection connector 42 may be provided, for example, at a portion of the wiring board 40C which protrudes in the second direction (the Y-axis direction) from the circumferential region 21a2. In this case, it is preferable that the external connection connector 42 and the heat radiation fins 222 of the extended heat radiation parts 22 do not overlap in the direction which is orthogonal to that of the placement surface 21a (Z-axis direction).
In the second embodiment, the through hole 43 may be formed, for example, in a portion of the wiring board 40C which protrudes from the circumferential region 21a2 to the other side in the first direction (the side in the X-axis rearward direction). Furthermore, the through hole 43 may be formed, for example, in a portion of the wiring board 40C which protrudes in the second direction (the Y-axis direction) from the circumferential region 21a2. In this case, the through hole 43 may be located so that the through hole 43 and the heat radiation fins 222 of the extended heat radiation parts 22 overlap in the direction which is orthogonal to that of the placement surface 21a (Z-axis direction). In the configuration in this way, the wiring board 40 can be prevented from impeding a flow of air in the heat radiation fins 222 of the extended heat radiation parts 22, thereby suppressing a decrease in the heat radiation efficiency of the light source parts 10 based on the wiring board 40C.
In the second embodiment, the wiring board 40C is not limited to a rigid wiring board and may be, for example, a flexible wiring board which is capable of being curved and deformed.
The through hole 43 in the second embodiment may be applied to, for example, the wiring board 40 in the first embodiment.
Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment and can be modified appropriately without departing from the spirit thereof.
In the present invention, the wiring board 40 which extends in the first direction from the light source parts 10 may be curved to extend above the placement surface 21a (in the Z-axis forward direction), for example, outside the placement surface 21a (outside the case member 30). In this case, since the wiring board 40 and the heat radiation fins 231 which protrudes from the end of the base part 21 do not overlap in the first direction, the wiring board 40 can be prevented from obstructing a flow of air in the heat radiation fins 231. Therefore, it is possible to improve the heat radiation efficiency of the light source parts 10.
While preferred embodiments of the invention have been described and illustrated above, it should be understood that these are exemplary of the invention and are not to be considered as limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the spirit or scope of the present invention. Accordingly, the invention is not to be considered as being limited by the foregoing description, and is only limited by the scope of the appended claims.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2022/037218 | Oct 2022 | WO |
| Child | 19169483 | US |