Cold plates

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CPC
H05K7/20509

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20509Cold plates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for assembling a liquid cooling assembly of a family of liqu...
- Patent number 12,219,733
- Issue date Feb 4, 2025
- OVH
- Hadrien Bauduin
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Housing comprising a composite wall integrating at least one coolin...
- Patent number 12,207,442
- Issue date Jan 21, 2025
- SAFRAN ELECTRONICS & DEFENSE
- Muriel Sabah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and communication device
- Patent number 12,207,447
- Issue date Jan 21, 2025
- Huawei Technologies Co., Ltd.
- Yuping Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rack form-factor reservoir for datacenter cooling systems
- Patent number 12,200,909
- Issue date Jan 14, 2025
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cavities for center-pinned actuator cooling systems
- Patent number 12,193,192
- Issue date Jan 7, 2025
- Frore Systems Inc.
- Suryaprakash Ganti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics systems comprising a two-phase cold plate housing...
- Patent number 12,185,511
- Issue date Dec 31, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electrical circuit device, electrical drive device and motor vehicle
- Patent number 12,185,504
- Issue date Dec 31, 2024
- Audi AG
- Daniel Ruppert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bus bar heat dissipation structure and inverter device
- Patent number 12,185,508
- Issue date Dec 31, 2024
- Meidensha Corporation
- Shota Suzuki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Cooling device for cooling by means of a cooling fluid
- Patent number 12,185,503
- Issue date Dec 31, 2024
- Osram GmbH
- Werner Stolzenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive thermal-control system of an electronic speaker device and...
- Patent number 12,176,260
- Issue date Dec 24, 2024
- Google LLC
- Ihab A. Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage system
- Patent number 12,166,320
- Issue date Dec 10, 2024
- Kioxia Corporation
- Kazuyuki Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of 3D-printing a circuit board on a heat sink a...
- Patent number 12,156,344
- Issue date Nov 26, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Centrally anchored MEMS-based active cooling systems
- Patent number 12,137,540
- Issue date Nov 5, 2024
- Frore Systems Inc.
- Ananth Saran Yalamarthy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cold plate architecture for liquid cooling of devices
- Patent number 12,133,357
- Issue date Oct 29, 2024
- Intel Corporation
- Jin Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 12,131,977
- Issue date Oct 29, 2024
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
Heatsink clamp for multiple electronic components
- Patent number 12,127,378
- Issue date Oct 22, 2024
- Nidec Motor Corporation
- James L. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-capacity memory air cooling device
- Patent number 12,124,302
- Issue date Oct 22, 2024
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Jeffrey S Holland
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Outlet quality factor stabilization for datacenter cooling systems
- Patent number 12,127,381
- Issue date Oct 22, 2024
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink with increased air flow
- Patent number 12,114,467
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Magnus Kallmark
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Antenna assembly for a vehicle
- Patent number 12,113,267
- Issue date Oct 8, 2024
- Airgain, Inc.
- Larry Greenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning heat fins for thermal management
- Patent number 12,108,577
- Issue date Oct 1, 2024
- SanDisk Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Variable topography heat sink fins
- Patent number 12,101,913
- Issue date Sep 24, 2024
- Dell Products L.P.
- Timothy M. Lambert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Intelligent pod-based cooling loop with dry cooler for mobile datac...
- Patent number 12,101,907
- Issue date Sep 24, 2024
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cold plate and system for cooling electronic devices
- Patent number 12,096,595
- Issue date Sep 17, 2024
- ICEOTOPE GROUP LIMITED
- Alexander Cushen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Security camera with angled cable attachment for increased downward...
- Patent number 12,085,841
- Issue date Sep 10, 2024
- Google LLC
- Chi-Ming Lin
- G08 - SIGNALLING
Information Patent Grant
Server and cooling system for enhanced immersion cooling
- Patent number 12,089,366
- Issue date Sep 10, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive thermal-control structure for speakers and associated appar...
- Patent number 12,082,377
- Issue date Sep 3, 2024
- Google LLC
- Emil Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fractal heat transfer device
- Patent number 12,078,432
- Issue date Sep 3, 2024
- FRACTAL HEATSINK TECHNOLOGIES LLC
- Alexander Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fanless computer case
- Patent number 12,075,600
- Issue date Aug 27, 2024
- Anthony Lane Snyder
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat sink integrated insulating circuit board
- Patent number 12,068,219
- Issue date Aug 20, 2024
- Mitsubishi Materials Corporation
- Toyo Ohashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS OF 3D-PRINTING A CIRCUIT BOARD ON A HEAT SINK A...
- Publication number 20250056732
- Publication date Feb 13, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
CONNECTOR
- Publication number 20250048597
- Publication date Feb 6, 2025
- YAZAKI CORPORATION
- Hideki HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250048584
- Publication date Feb 6, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Hirokazu TAKABAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CENTRALLY ANCHORED MEMS-BASED ACTIVE COOLING SYSTEMS
- Publication number 20250031350
- Publication date Jan 23, 2025
- Frore Systems Inc.
- Ananth Saran Yalamarthy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COOLER FOR POWER ELECTRONICS
- Publication number 20250016966
- Publication date Jan 9, 2025
- Atieva, Inc.
- Barnaby James Gerard Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-CAPACITY MEMORY AIR COOLING DEVICE
- Publication number 20250013275
- Publication date Jan 9, 2025
- LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Jeffrey S Holland
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Antenna Assembly For A Vehicle
- Publication number 20240429589
- Publication date Dec 26, 2024
- Airgain, Inc.
- Larry Greenstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRACTAL HEAT TRANSFER DEVICE
- Publication number 20240426563
- Publication date Dec 26, 2024
- Fractal Heatsink Technologies LLC
- Alexander Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE
- Publication number 20240422949
- Publication date Dec 19, 2024
- Delta Electronics, Inc.
- Po-Chen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CONNECTOR
- Publication number 20240422948
- Publication date Dec 19, 2024
- Delta Electronics, Inc.
- Jing-Xian Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CONTROLLING HEAT TRANSFER BETWEEN COMPONENTS
- Publication number 20240414886
- Publication date Dec 12, 2024
- BATTELLE SAVANNAH RIVER ALLIANCE, LLC
- JOHN T. BOBBITT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL REGULATION DEVICE AND ASSOCIATED PIECE OF ELECTRONIC EQUIPMENT
- Publication number 20240407138
- Publication date Dec 5, 2024
- SAGEMCOM BROADBAND SAS
- Nathan JEANROT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPAR...
- Publication number 20240397669
- Publication date Nov 28, 2024
- Google LLC
- Emil Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRICAL JUNCTION BOX AND WIRE HARNESS
- Publication number 20240389278
- Publication date Nov 21, 2024
- YAZAKI CORPORATION
- Kazuki Shirosaka
- B60 - VEHICLES IN GENERAL
Information Patent Application
Thermal Management and Control System
- Publication number 20240381579
- Publication date Nov 14, 2024
- Scott Agnew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS
- Publication number 20240379328
- Publication date Nov 14, 2024
- Timothy M. Ziemba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING MODULE WITH LEAK DETECTOR AND RELATED SYSTEMS
- Publication number 20240361090
- Publication date Oct 31, 2024
- COOLIT SYSTEMS, INC.
- Mike Holden
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL MANAGEMENT SYSTEM
- Publication number 20240357770
- Publication date Oct 24, 2024
- Transportation IP Holdings, LLC
- Brett Heher
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
THERMAL MANAGEMENT SYSTEM INCLUDING AN OVERMOLDED LAYER AND A CONDU...
- Publication number 20240349465
- Publication date Oct 17, 2024
- Lunar Energy, Inc.
- Steven Nicholas Grolle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE FOR OPTOELECTRONIC MODULE AND ELECTRONIC...
- Publication number 20240319456
- Publication date Sep 26, 2024
- Ruijie Networks Co., Ltd.
- Xiaolong LV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC CONNECTOR ATTACHMENT AND HEAT SINKING
- Publication number 20240305852
- Publication date Sep 12, 2024
- Dish Network L.L.C.
- Steven Nedved
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DISPLAY DEVICE
- Publication number 20240292572
- Publication date Aug 29, 2024
- LG Display Co., Ltd.
- Eunjeong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Multilayer Module Having Low Inductance and Fast Switchi...
- Publication number 20240292575
- Publication date Aug 29, 2024
- Wolfspeed, Inc.
- Daniel Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS BAR HEAT DISSIPATION STRUCTURE AND INVERTER DEVICE
- Publication number 20240276684
- Publication date Aug 15, 2024
- MEIDENSHA CORPORATION
- Shota SUZUKI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS
- Publication number 20240266252
- Publication date Aug 8, 2024
- Semiconductor Components Industries, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal-Control System Of A Mesh Network Device and Associated Mesh...
- Publication number 20240251498
- Publication date Jul 25, 2024
- Google LLC
- Ihab A. Ali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOL...
- Publication number 20240251528
- Publication date Jul 25, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Ernesto Ferrer Medina
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ULTRAVIOLET IRRADIATION APPARATUS AND ULTRAVIOLET IRRADIATION METHOD
- Publication number 20240238462
- Publication date Jul 18, 2024
- Asahi Kasei Kabushiki Kaisha
- Atsushi KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF HARDWARE COMPONENTS
- Publication number 20240237294
- Publication date Jul 11, 2024
- Dell Products L.P.
- ERIC MICHAEL TUNKS
- G06 - COMPUTING CALCULATING COUNTING

Cold plates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for assembling a liquid cooling assembly of a family of liqu...

Housing comprising a composite wall integrating at least one coolin...

Heat sink and communication device

Rack form-factor reservoir for datacenter cooling systems

Cavities for center-pinned actuator cooling systems

Power electronics systems comprising a two-phase cold plate housing...

Electrical circuit device, electrical drive device and motor vehicle

Bus bar heat dissipation structure and inverter device

Cooling device for cooling by means of a cooling fluid

Passive thermal-control system of an electronic speaker device and...

Storage system

Systems and methods of 3D-printing a circuit board on a heat sink a...

Centrally anchored MEMS-based active cooling systems

Cold plate architecture for liquid cooling of devices

Electronic systems with inverted circuit board with heat sink to ch...

Heatsink clamp for multiple electronic components

High-capacity memory air cooling device

Outlet quality factor stabilization for datacenter cooling systems

Heatsink with increased air flow

Antenna assembly for a vehicle

Self-aligning heat fins for thermal management

Variable topography heat sink fins

Intelligent pod-based cooling loop with dry cooler for mobile datac...

Cold plate and system for cooling electronic devices

Security camera with angled cable attachment for increased downward...

Server and cooling system for enhanced immersion cooling

Passive thermal-control structure for speakers and associated appar...

Fractal heat transfer device

Fanless computer case

Heat sink integrated insulating circuit board

Patents Applicationslast 30 patents

SYSTEMS AND METHODS OF 3D-PRINTING A CIRCUIT BOARD ON A HEAT SINK A...

CONNECTOR

ELECTRONIC DEVICE

CENTRALLY ANCHORED MEMS-BASED ACTIVE COOLING SYSTEMS

COOLER FOR POWER ELECTRONICS

HIGH-CAPACITY MEMORY AIR COOLING DEVICE

Antenna Assembly For A Vehicle

FRACTAL HEAT TRANSFER DEVICE

HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE

ELECTRIC CONNECTOR

SYSTEMS AND METHODS FOR CONTROLLING HEAT TRANSFER BETWEEN COMPONENTS

THERMAL REGULATION DEVICE AND ASSOCIATED PIECE OF ELECTRONIC EQUIPMENT

PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPAR...

ELECTRICAL JUNCTION BOX AND WIRE HARNESS

Thermal Management and Control System

PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS

COOLING MODULE WITH LEAK DETECTOR AND RELATED SYSTEMS

THERMAL MANAGEMENT SYSTEM

THERMAL MANAGEMENT SYSTEM INCLUDING AN OVERMOLDED LAYER AND A CONDU...

HEAT SPREADER FOR MODIFIED EDGE COOLING

HEAT DISSIPATION STRUCTURE FOR OPTOELECTRONIC MODULE AND ELECTRONIC...

MAGNETIC CONNECTOR ATTACHMENT AND HEAT SINKING

DISPLAY DEVICE

High Power Multilayer Module Having Low Inductance and Fast Switchi...

BUS BAR HEAT DISSIPATION STRUCTURE AND INVERTER DEVICE

SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS

Thermal-Control System Of A Mesh Network Device and Associated Mesh...

CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOL...

ULTRAVIOLET IRRADIATION APPARATUS AND ULTRAVIOLET IRRADIATION METHOD

SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF HARDWARE COMPONENTS