Claims
- 1. A flexible wiring member for use in electronic apparatus, comprising in combination,a body element, said body element being of a material with randomly intertwined and fused filaments, with spacing between said fused filaments for permeation by a coolant, said body element further having first and second broad surfaces separated by a thickness dimension, and, at least one conductor element positioned on and separated from said first broad surface of said body element by an insulating layer element.
- 2. The wiring member of claim 1 wherein said body element is of metal foam.
- 3. The wiring member of claim 1 including at least two parallel conductor elements with electrical characteristic impedance positioning.
- 4. The wiring member of claim 3 wherein said body element is of metal foam.
- 5. In an electronic apparatus, a cabling member, said cabling member having at least one conductor member supported by a tape shaped body of a material having randomly intertwined and fused filaments with spacing for permeation by coolant.
- 6. The electronic apparatus cabling member of claim 5 wherein said at least one conductor member is separated from said tape shaped body material by an insulating member.
- 7. The electronic apparatus cabling member of claim 6 wherein said tape shaped body material is metal foam.
- 8. In the packaging of electronic apparatus the improvement comprising the supporting of at least one conductor member with a tape shaped body made of a material having randomly intertwined and fused filaments with spacing for permeation by coolant.
- 9. The improvement of claim 8 wherein said material of said tape shaped body is metal foam.
- 10. The improvement of claim 8 wherein said at least one conductor member is at least two conductor members having electrical characteristic impedance positioning.
- 11. The improvement of claim 10 wherein said material of said tape shaped body is metal foam.
Parent Case Info
This application is a division of appn. Ser. No. 08/772,665 Filed Dec. 23, 1996, now U.S. Pat. No. 5,847,926 and a C-I-P of appn. Ser. No. 07/909,925 Filed Jul. 7, 1992, now abandoned.
US Referenced Citations (11)
Foreign Referenced Citations (1)
Number |
Date |
Country |
48488 |
Mar 1982 |
EP |
Non-Patent Literature Citations (2)
Entry |
HITechmetal Engineering—FOAMETAL-, Tech. Brochure-6 Pages Published by HITec Metal Group, Cleveland, Ohio. |
IBM TDB Vol 22 No. 11 Apr. 1980 p. 5905. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
07/909925 |
Jul 1992 |
US |
Child |
08/772665 |
|
US |