The present invention relates to the field of liquid crystal display, in particular to a liquid crystal display (LCD) and a broken line repairing method.
In the process of producing a TFT-LCD panel, a broken data line appears in the panel because of production. After the panel is electrified, an obvious bright line (or dark line) appears on the panel. The defect cannot be accepted by consumers; i. e. the panel cannot be sold directly. However, if the panel is discarded directly, much waste is caused. Usually, if few broken lines appear, a method shown in
The aim of the present invention is to provide an LCD and a broken line repairing method with a simplified structure and low cost.
The aim of the present invention is achieved by the following technical schemes.
An LCD comprises multiple data lines, a data driven chip connected to the data lines, and a sequence control circuit connected to the data driven chip. The LCD is provided with at least one broken data line; the broken data line is provided with connection points on the end away from the data driven chip; and each connection point is connected and conducted to a vacant channel of the data driven chip.
Preferably, the broken data line is connected to the nearest data driven chip provided with a vacant channel. Connection to the nearest data driven chip can shorten the length of the data line as much as possible, reduce the RC loading of the line, and ensure that the vacant channel has sufficient driving power to drive the broken data line.
Preferably, the sequence control circuit includes a memory device; the memory device stores position information of the broken data line and the vacant channel of the corresponding driven chip. This is one specific embodiment for repairing the broken line.
A broken line repairing method for the LCD, when the broken data line of the LCD is detected, the method for repairing the data line includes the following steps:
A: Look for the broken data line.
B: Select the vacant channel of the data driven chip; connect the end of the broken data line away from the data driven chip to the vacant channel of the data driven chip.
C: Simultaneously transmit data information of the broken data line to the corresponding vacant channel to be output.
Preferably, in step B, connect the broken data line to the nearest data driven chip with a vacant channel in accordance with the position of the broken data line. Connection to the nearest data driven chip can shorten the length of the data line as much as possible, reduce the RC loading of the line, and ensure that the vacant channel has sufficient driving power to drive the broken data line.
Preferably, the sequence control circuit stores position information of the broken data line and the vacant channel of the corresponding driven chip; in step C, the sequence control circuit simultaneously transmits data information of the broken data line to the corresponding vacant channel to be output in accordance with the stored position information. By using the sequence control circuit to control, no additional control circuit is required; and this embodiment is simple.
Preferably, the sequence control circuit includes EEPROM; position information of the broken data line and the corresponding vacant channel is stored in EEPROM; in step C, the sequence control circuit transmits data information of the broken data line to the corresponding vacant channel to be output in accordance with position information stored in EEPROM. This is one specific embodiment; no additional memory device is required.
Preferably, data information of the broken data line is also stored in EEPROM; in step C, the sequence control circuit reads the position information and the corresponding data information stored in EEPROM to simultaneously transmit the data information of the broken data line to the corresponding vacant channel to be output. This is another specific embodiment.
Preferably, position information of the broken data line and the vacant channel of the corresponding driven chip is downloaded to EEPROM in advance by a computer.
The present invention transmits data information of the broken data line to the corresponding vacant channel to be output by connecting the end of the broken data line away from the data driven chip to the vacant channel of the data driven chip, so that the data lines on both sides of the breakpoint can be driven. In the method, the distance between the data driven chip and the broken data line is short; the vacant channel of the data driven chip has sufficient driving power to drive the broken data line; no additional OP buffer is required; no reserved repairing line is required on PCBA; and one broken line only has one welding point, which decreases the production procedure, increases the yield rate of TFT-LCD, and reduces the material and production cost.
Wherein: 1. array substrate, 2. welding spot.
T-con: sequence control circuit
OP Buffer
SD: data driven chip
GD: grid driven chip
LC: liquid crystal pixel electrode
The present invention is further described by figures and the preferred embodiments as follows.
As shown in
The array substrate 1 at least has one broken data line; the broken data line has connection points (welding spot 2 caused by welding) on the end away from the data driven chip; and each connection point is connected and conducted to a vacant channel of the data driven chip. Generally, the data driven chip with a vacant channel is located on both ends of the array substrate 1 as shown in SD1 and SD4. If the broken line appears on the left end, the welding spot 2 is connected to SD4. If the broken line appears on the right end, the welding spot 2 is connected to SD1. Connection of the welding spot 2 to the nearest data driven chip can shorten the length of the data line as much as possible, reduce the RC loading of the line, and ensure that the vacant channel has sufficient driving power to drive the broken data line.
The broken line repairing method for LCD includes the following steps:
A: Look for the broken data line; and use detection equipment to position the broken data line.
B: Select the vacant channel of the data driven chip; connect the end of the broken data line away from the data driven chip to the vacant channel of the data driven chip; and connect the vacant channel to the end of the broken data line away from the data driven chip for welding in the way of laser line welding.
C: Simultaneously transmit data information (i. e. a voltage signal) of the broken data line to the corresponding vacant channel to be output.
Position information of the broken data line and the corresponding vacant channel can be stored in EEPROM of the sequence control circuit. When the display is electrified, the sequence control circuit automatically reads the position information in EEPROM and then simultaneously transmits the data information of the broken data line to the corresponding vacant channel and the original channel of the broken data line to be output. The corresponding data information of the broken data line can be copied to be stored in EEPROM together with the corresponding data information of all original channels.
As shown in
In the broken line repairing method, the distance between the data driven chip and the broken data line is short; the vacant channel of the data driven chip has sufficient driving power to drive the broken data line; no additional OP damper is required; no reserved repairing line is required on PCBA; and one broken line only has one connection point for welding, which decreases the production procedure, increases the yield rate of TFT-LCD, and reduces the material and production cost.
The present invention is described in detail in accordance with the above contents with the specific preferred embodiments. However, this invention is not limited to the specific embodiments. For the ordinary technical personnel of the technical field of the present invention, on the premise of keeping the concept of the present invention, the technical personnel can also make simple deductions or replacements, and all of which should be considered to belong to the protection scope of the present invention.
Number | Date | Country | Kind |
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2011103961613 | Dec 2011 | CN | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/CN11/83612 | 12/7/2011 | WO | 00 | 12/19/2011 |