Patent Application
20110043565
1. Field of the Invention
The present invention relates to a liquid discharge head and a method for manufacturing the liquid discharge head, and more particularly to an ink jet head and a method for manufacturing the ink jet head.
2. Description of the Related Art
As recording technology progresses, liquid discharge recording apparatuses, typified by ink jet recording apparatuses, are required to enhance the speed and picture quality of recording. To meet this requirement, liquid discharge heads (hereinafter also referred to as “heads”) mounted in liquid discharge recording apparatuses need to include densely-formed liquid discharge ports and corresponding elements that generate energy for discharging ink. Accordingly, power line through which power is supplied to the elements is required to have a low resistance to equally and stably supply power to each element.
U.S. Pat. No. 7,255,426 discusses a head configuration in which power line is formed of chemically stable, highly corrosion-resistant, low-resistance precious metal, such as gold, by electrolytic plating, and thus has low resistance. The head includes not only the power line, through which power is supplied to elements generating energy for discharging ink, but also terminals that establish electrical connections with external units. Those terminals, like the power line, may be formed of precious metal, such as gold, by electrolytic plating. On the power line, a member made of resin, such as polyimide and polyetheramide, is provided to form the walls of a flow path communicating with discharge ports through which liquid is discharged.
However, the power line made of precious metal, which is unreactive, chemically stable metal, has poor adhesion to the resin member. Furthermore, the resin member is likely to swell due to ink or other liquid, and is also susceptible to stress caused by heating. This may cause separation between the power line and the resin member. Separation of the resin member from the power line might result in ink corrosion and electrolysis of the power line. To improve adhesion between the power line and the resin member, an adhesion layer made of metal may be provided between the power line and the resin member by electrolytic plating, for example. However, if the terminals have an adhesion layer on their surface, joining of the terminals to external terminals cannot be ensured. It is, therefore, necessary to cover the terminals with a resist or other coating to prevent formation of an adhesion layer thereon.
Moreover, the power line and the terminals formed by electrolytic plating using precious metal have very rough surfaces. Those rough surfaces make complete removal of a resist difficult, which may cause residues of the resist to be left on the surfaces of the power line and terminals. With such resist residues, it is not possible to ensure adhesion between the power line and the resin member and the joining of the terminals to external terminals. Hence, removal of the resist residues is required, resulting in complicated processing.
The present invention is directed to a highly reliable ink jet head in which adhesion between power line and a member made of resin and joining of terminals to external terminals are ensured. The present invention is also directed to a method for easily and precisely manufacturing the ink jet head without placing any load on the manufacturing process.
According to an aspect of the present invention, there is provided a method for manufacturing a liquid discharge head including: an element substrate in which an element configured to generate energy required to discharge liquid from a discharge port, power line electrically connected to the element, and a terminal electrically connected to the power line and configured to electrically connect to an external unit are provided on a substrate; and a member made of resin having a wall of a liquid flow path communicating with the discharge port. The flow path is formed by the element substrate and the member that are in contact with each other with the wall facing inwardly.
A surface layer of the power line is in contact with the member. The method includes: preparing the element substrate including materials of the power line and the terminal, the power line materials including a first precious metal layer made of precious metal on the substrate, a first nickel layer made of nickel on the first precious metal layer, and a third precious metal layer made of precious metal on the first nickel layer, the terminal including a second precious metal layer made of precious metal on the substrate, a second nickel layer made of nickel on the second precious metal layer, and a fourth precious metal layer made of precious metal on the second nickel layer; and heating the first nickel layer and the third precious metal layer of the power line materials to form the surface layer made of an alloy of precious metal and nickel.
According to an exemplary embodiment of the present invention, a highly reliable ink jet head is provided in which adhesion between power line and a member made of resin and joining of a terminal to an external terminal are ensured.
Further features and aspects of the present invention will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings.
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the invention and, together with the description, serve to explain the principles of the invention.
Various exemplary embodiments, features, and aspects of the invention will be described in detail below with reference to the drawings.
The substrate 101 also includes electrode pads 120. The electrode pads 120 serve as terminals electrically connected to external terminals disposed, e.g., in the flexible printed circuit 73 to establish electrical connection with a recording apparatus. Some of the electrode pads 120 are electrically connected to the power line 130 to supply power for driving the heaters 113, while others are connected to a logic circuit (not shown) that inputs a signal for driving the heaters 113.
The head 82 configured as described above is capable of recording by discharging ink from the discharge ports 115 by the application of pressure generated by bubbling of the ink heated by the heaters 113.
Formed on the power line 130 of this element substrate is a member made of resin, such as a member 112 made, e.g., of hardened epoxy resin, that forms the walls of a flow path 114 communicating with the ink discharge ports 115. The element substrate is in contact with the resin member 112 with those walls of the member 112 facing inwardly, thereby forming the flow path 114. Also, in part of the resin member 112 that is in contact with the power line 130, a protective layer 111 made, e.g., of polyetheramide resin may be provided to achieve better adhesion and to prevent corrosion of the power line 130 due to ink or other material.
The power line 130 includes a first precious metal layer 109 and an adhesion layer 116. The first precious metal layer 109 contains precious metal, such as gold, platinum, and silver, as the major component, while the adhesion layer 116 is made of an alloy whose major components are precious metal and nickel. Considering that sufficient adhesion cannot be achieved between resin and precious metal, the adhesion layer 116 is provided to ensure adhesion between the first precious metal layer 109 and the adhesion layer 116 and adhesion between the adhesion layer 116 and the member 112. The nickel content in the surface portion of the adhesion layer 116 can be 1.4 wt % or more and 80.0 wt % or less. This level of nickel content ensures adhesion more reliably. The adhesion layer 116 composed of an alloy whose major components are precious metal and nickel can be formed as follows. Precious metal is deposited as a layer on a nickel layer, and then only the part of the resultant multilayer that is to serve as the power line 130 is locally heat-treated to interdiffuse the precious metal and the nickel, thereby forming the adhesion layer 116.
On the other hand, the electrode pads 120 each include a second precious metal layer 119, a nickel layer 123, and a third precious metal layer 128 stacked in that order perpendicularly to the surface of the substrate 101. The second precious metal layer 119 contains precious metal, such as gold, as a major component. The nickel layer 123 contains nickel metal as a major component. The major component of the third precious metal layer 128 is precious metal, such as gold. The adhesion layer 116 is not formed on the electrode pads 120 to enable the third precious metal layers 128 of the electrode pads 120 to be joined to terminals that provide electrical connection with the flexible printed circuit 73. This ensures the reliable joining of the electrode pads 120 to the terminals.
A diffusion prevention layer 106 made of refractory metal material is interposed between the first and second precious metal layers 109 and 119 containing precious metal, such as gold, as a major component and the underlying electrode layer 104 made of metal, such as Al. Also, since precious metal, such as gold, is deposited by electrolytic plating, a seed layer 107, whose major component is precious metal, such as gold, is provided under the first and second precious metal layers 109 and 119. The seed layer 107, which serves as an electrode in electrolytic plating process, may be formed such that the resistance thereof is low and variation in in-plane thickness over the substrate is small, specifically, such that the thickness thereof is several hundreds Å or more. The nickel layers 110 and 123 are also deposited by electrolytic plating with the seed layer 107 used as an electrode. The layers deposited by such electrolytic plating contain only trace amounts of impurities other than the deposited material, thus enabling the formation of the plating layers having a purity of at least 95% or higher.
The following describes a method for manufacturing the head according to the exemplary embodiment of the invention.
A thermal accumulation layer 102 made of silicon oxide is formed on a substrate 101 made of silicon. On the thermal accumulation layer 102, a resistive layer 103 made of TaSiN is formed using a vacuum film-formation technique. Subsequently, a precious metal layer containing aluminum as a major component is formed on the resistive layer 103. The precious metal layer is then subjected to a photolithographic process, thereby forming an electrode layer 104. Parts of the resistive layer 103 where the precious metal layer thereon has been removed can thus be used as heaters 113. Then, an insulating layer 105 made of silicon nitride is formed on the electrode layer 104 and the heaters 113. Next, through-holes are formed in the insulating layer 105 using, e.g., photolithographic and dry etching techniques in a substrate preparation step as illustrated in
Next, titanium-tungsten, which is refractory metal material, is deposited as a diffusion prevention layer 106 to a thickness of about 200 nm, for example, by a vacuum film-formation process. On the diffusion prevention layer 106, gold is deposited as a seed layer 107 used for plating to a thickness of about 500 nm, for example, by a vacuum film-formation process, as illustrated in
Subsequently, a photoresist is applied, by spin coating, to the surface of the gold layer serving as a conductor for plating. In this spin coating, the photoresist is applied so that the thickness thereof is sufficiently greater than that of the first precious metal layer 109 of the power line 130 and that of the second precious metal layer 119 of the electrode pads 120. In the present exemplary embodiment, since the first and second precious metal layers 109 and 119 are formed to have a thickness of 4 μm, the photoresist is applied under such conditions as to enable the photoresist thickness to be 8 μm. Next, the resist is exposed to light and developed using a photolithographic technique, thereby forming a resist mask 108 in such a manner that the seed layer 107 is exposed in each first opening 140 where the power line is to be formed and in each second opening 141 where an electrode pad is to be formed, as illustrated in
Thereafter, a current is passed through the gold of the seed layer 107 in an electrolytic bath containing, e.g., gold sulfite salt by electrolytic plating, thereby depositing first gold plating layers. Consequently, the first and second precious metal layers 109 and 119 are simultaneously formed in the first and second openings 140 and 141, respectively. The gold plating layers deposited using the electrolytic plating process contain only trace amounts of impurities other than the deposited gold, and thus have a purity of at least 95% or higher. The first gold plating layers can have a thickness of 3 μm or more and 20 μm or less. In the present exemplary embodiment, gold is deposited to a thickness of 4 μm. Since precious metals are relatively expensive, it is desired that the first gold plating layers be thin. However, with consideration given to the reliability of electrical connection and to the interconnection resistance, the thickness of the first gold plating layers is 4 μm.
A current is then passed through the seed layer 107 in an electrolytic bath containing sulfamic acid by electrolytic plating, thereby depositing a nickel layer on the surfaces of the first and second precious metal layers 109 and 119. Consequently, first and second nickel layers 110 and 123, containing nickel as a major component, are simultaneously formed on the first and second precious metal layers 109 and 119, respectively. The nickel layers can have a thickness of 0.1 μm or more and 2 μm or less. In the present exemplary embodiment, nickel is deposited to a thickness of 1 μm. This is because nickel has a higher resistance than gold; if the thickness of the nickel layers is greater than 2 μm, the reliability of electrical connection may decrease, and if the nickel layers are thinner than 0.1 μm, a sufficient amount of nickel cannot be diffused into gold layers during heat treatment. Then, a current is passed through the gold of the seed layer 107 in an electrolytic bath containing gold sulfite salt by electrolytic plating, thereby depositing a second gold plating layer on the surfaces of the nickel layers, as illustrated in
Subsequently, the element substrate is immersed in a resist remover solution to remove the resist mask 108, thereby exposing part of the seed layer 107. Then, the element substrate is immersed in an etchant containing, e.g., a nitrogen-based organic compound, iodine, and potassium iodide to remove the outermost layer of the second gold plating layers, and gold on the surface of the part of the seed layer 107 having no gold plating layer formed thereon. This process exposes part of the diffusion prevention layer 106 made of titanium-tungsten, which is a refractory metal material. At this time, the thickness of the second gold plating layers is 1.0 μm.
Thereafter, the element substrate is immersed in an etchant containing, e.g., hydrogen peroxide solution for a predetermined period of time to etch away the part of the diffusion prevention layer 106 having no plating layer formed thereon, as illustrated in
Then, only the power line 130 is irradiated with a laser beam 117 to heat the first nickel layer 110 and third precious metal layer 118 of the power line 130. The light source that produces the laser beam may be, for example, a He-Ne laser, a CO2 laser, an excimer laser, or a Nd:YAG laser. The present exemplary embodiment employs a KrF (krypton fluoride) excimer laser operating at a wavelength of 248 nm. The first nickel layer 110 and the third precious metal layer 118 are heated to a desired temperature by adjusting, for example, the energy, wavelength, and irradiation time of the laser beam. This temperature can be not more than the melting point of gold of the third precious metal layer 118 and the melting point of nickel of the first nickel layer 110, and also be sufficient to cause thermal diffusion of gold and nickel. To be specific, the temperature can be 200° C. or more and 600° C. or less.
Irradiation with a laser beam, which has a high energy density, enables local heating to high temperature to occur instantaneously. This allows only the power line 130 to be locally heated even if the distance between the power line 130 and each electrode pad 120 is as short as 50 μm or less. Accordingly, it is possible to diffuse nickel in the power line 130 without diffusing nickel in the electrode pads 120. It should be noted that if the distance between the power line 130 and the electrode pads 120 is too short, the electrode pads 120 may also be irradiated with a laser beam intended to locally heat the power line 130. Thus, the electrode pads 120 are preferably away from the power line 130 by a distance of 10 μm or more.
As a result of the heating, the gold of the third precious metal layer 118 and the nickel of the first nickel layer 110 in the power line 130 interdiffuse to form an adhesion layer 116 made of an alloy containing gold and nickel as major components, thereby forming an element substrate, as illustrated in
On the adhesion layer 116 thus treated, a protective layer 111 containing polyetheramide is formed to have a thickness of about 15 μm by spin coating. The presence of the protective layer 111 provides even better adhesion between the power line 130 and a member made of resin, and thus prevents corrosion of the power line 130 due to ink or other substance.
Next, a mold material corresponding to an ink flow path 114 is provided on the protective layer 111. Epoxy resin is then deposited on the mold material to a thickness of 15 μm by spin coating, and exposed to light and developed by a photolithographic technique. The mold material is then removed to form discharge ports 115, through which liquid is discharged, and a member 112 forming the ink flow path 114 communicating with the discharge ports 115, as illustrated in
The presence of the adhesion layer 116 on the power line 130 ensures adhesion between the power line 130 and the member made of resin including the member 112 and the protective layer 111. Increased adhesion to the resin member is achieved presumably because nickel is diffused into the second gold plating layers, and then the part of the nickel diffused into the surface portion is oxidized.
The nickel content in the surface layer of the power line 130 heated to about 250° C. with a laser beam was measured by electron spectroscopy for chemical analysis (ESCA). The detected nickel content was about 1.0 wt %. Furthermore, from the surface layer of the power line 130 heated to about 300° C., a nickel content of about 3% was detected.
Table 1 provides test results on adhesion between the adhesion layer 116 and the member made of resin. The presence of nickel in the surface portion of the adhesion layer 116 ensures adhesion. Particularly, when the nickel content in the surface portion is 1.4 wt % or more, adhesion is ensured more reliably. If the nickel layer is formed thick, and the power line is heated with a laser beam for a long period of time, the nickel content in the surface layer of the power line can be increased up to 80.0 wt %. Use of a laser beam allows local heating, and thus prevents the electrode pads from being heated without the need for forming a resist as a mask on the electrode pads.
In Table 1, “EX”, “SA”, “PO” represent excellent, satisfactory, and poor, respectively.
As described above, the adhesion layer 116 is provided as the layer adhering to the protective layer 111 of the resin member. The adhesion layer 116 is made of an alloy containing gold and nickel as major components and having a nickel content of 1.4 wt % or more and 80.0 wt % or less. The electrode pads 120 each include the fourth precious metal layer 128 made of gold as the surface layer thereof. This enables a highly reliable head to be provided in which adhesion between the member made of resin and the power line 130 and adhesion between external terminals and the electrode pads 120 for electrical connection are both ensured.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all modifications, equivalent structures, and functions.
This application claims priority from Japanese Patent Application No. 2009-189327 filed Aug. 18, 2009, which is hereby incorporated by reference herein in its entirety.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2009-189327 | Aug 2009 | JP | national |
