Liquid discharge nozzle for semiconductor substrate processing apparatus

Information

  • Patent Grant
  • D929534
  • Patent Number
    D929,534
  • Date Filed
    Wednesday, October 23, 2019
    5 years ago
  • Date Issued
    Tuesday, August 31, 2021
    3 years ago
  • US Classifications
    Field of Search
    • US
    • D23 213
    • D23 214
    • D23 215
    • D23 223
    • D23 224
    • D23 226
    • D23 229
    • D23 230
    • D23 249
    • D23 259
    • D23 262
    • D15 135
    • CPC
    • A61H9/0021
    • A61H33/00
    • B05B1/00
    • B05B1/14
    • B05B1/185
    • B05B1/08
    • B05B1/02
    • B05B1/26
    • B05B12/002
    • B05B1/18
    • B05B9/01
  • International Classifications
    • 2301
    • Term of Grant
      15Years
      Disclaimer
      This patent is subject to a terminal disclaimer.
Abstract
Description


FIG. 1 a front, top perspective view of a liquid discharge nozzle for semiconductor substrate processing apparatus;



FIG. 2 is a front elevational view thereof;



FIG. 3 is a rear elevational view thereof;



FIG. 4 is a left-side elevational view thereof;



FIG. 5 is a right-side elevational view thereof;



FIG. 6 is a top plan view thereof; and,



FIG. 7 is a bottom plan view thereof.


Claims
  • The ornamental design for a liquid discharge nozzle for semiconductor substrate processing apparatus, as shown and described herein.
Priority Claims (1)
Number Date Country Kind
2019-009324 Apr 2019 JP national
US Referenced Citations (8)
Number Name Date Kind
D341418 Akimoto Nov 1993 S
D636845 Suzuki Apr 2011 S
D637267 Suzuki May 2011 S
D823906 Kaminski Jul 2018 S
D824966 Kaminski Aug 2018 S
D903836 Pak Dec 2020 S
D906485 Fowler Dec 2020 S
D907744 Roehl Jan 2021 S
Non-Patent Literature Citations (1)
Entry
Liquid Paste Filling Machine Filling Nozzle Head, Dec. 10, 2020, Amazon.com, May 5, 2021.URL: https://www.amazon.com/WINUS-Filling-Nozzle-1000ml-Machine/dp/B08G8KPF43 (Year: 2020).