Claims
- 1. A process for decreasing defects, caused by emanating subsurface gasses, in a subsequent coating applied over a machined surface of a molded thermoset fiber reinforced plastic part, said process comprising:
- heating said molded thermoset fiber reinforced plastic part to a temperature of from about 49.degree. C. to 204.degree. C.;
- applying a coating of a liquid thermosettable composition to the machined surface of said part while said part is at a temperature from about 49.degree. C. to 204.degree. C.; and
- curing said liquid thermosettable composition to form a thermoset barrier for said gasses,
- wherein said liquid thermosettable composition consists essentially of
- a) an unsaturated polyester resin and/or a vinyl ester resin; at least one crosslinking ethylenically unsaturated monomer; and an initiator, optionally with an accelerator or mixture of accelerators; or
- b) a reaction product of at least one polyisocyanate with at least one member selected from the group consisting of polyols, polyamines, polymercaptans, and polycarboxylic acids; or
- c) the reaction product of b) and a crosslinker having functionality greater than 2 selected from species reactive with isocyanate; or
- d) combinations of a) and b); or
- e) a saturated polyester, polyether, or acrylic resin containing two or more hydroxyl and/or carboxyl groups per molecule along with an alkylated urea-formaldehyde resin, melamine-formaldehyde resin, or benzoguanamine-formaldehyde resin, and
- optional components selected from the group consisting of fillers, conductive pigments, antioxidants, pigments, moisture scavengers, low profile additives, and diluents.
- 2. A process according to claim 1, wherein said heating is to a temperature of from about 77.degree. C. to about 177.degree. C.
- 3. A process according to claim 2, wherein said liquid thermosettable composition includes sufficient conductive pigments such that the cured composition is electrically conductive.
- 4. A process according to claim 2, wherein said heating is to from about 93.degree. C. to about 177.degree. C.
- 5. A process according to claim 2, wherein said heating is to a temperature of from about 121.degree. C. to about 149.degree. C.
- 6. A process according to claim 4, wherein said liquid thermoset composition comprises a polyisocyanate and a polyol.
- 7. A process according to claim 6, said liquid thermosettable composition further including unsaturated polyester resins and ethylenically unsaturated monomers.
- 8. A process according to claim 4, wherein said liquid thermosettable composition comprises vinyl ester resins and ethylenically unsaturated monomers.
- 9. A process according to claim 4, wherein said liquid thermosettable composition comprises (a) oligomers having two or more hydroxyl and/or carboxyl groups per molecule and (b) alkylated urea-formaldehyde, melamine formaldehyde, or benzoquanamine-formaldehyde resins wherein said oligomers comprise polyesters and/or polyethers of molecular weights from about 200 to about 8,000, or acrylic resins of which 80 wt. % have molecular weights from about 200 to 10,000 or combinations thereof.
- 10. A process according to claim 4, wherein said liquid thermosettable composition comprises (a) oligomers having two or more carboxyl groups per molecule, said oligomers comprising polyesters and/or polyethers of molecular weights from about 200 to 8,000, or acrylic resins of which 80 wt. % or more have molecular weights from about 200 to 10,000, or combinations thereof; and (b) triglycidyl isocyanurate.
- 11. A process for decreasing pops and/or craters in a paint applied over a molded fiber reinforced thermoset plastic part having at least one machined surface, said process comprising:
- preheating said machined surface of said molded thermoset part to a temperature from about 49.degree. C. to 204.degree. C.;
- applying in an environment other than a closed mold a sealer coating of a liquid thermosettable composition to said machined surface while said surface is at a temperature from about 49.degree. C. to 204.degree. C.;
- curing said sealer coating; and
- applying at least one further coat of material and curing said further coat of material by application of heat,
- wherein said liquid thermosettable composition consists essentially of
- a) an unsaturated polyester resin and/or a vinyl ester resin along with at least one crosslinking ethylenically unsaturated monomer and an initiator, optionally with an accelerator or mixture of accelerators; or
- b) a reaction product of at least one polyisocyanate with at least one member selected from the group consisting of polyols, polyamines, polymercaptans, and polycarboxylic acids; or
- c) the reaction product of b) and a crosslinker having functionality greater than 2 selected from species reactive with isocyanate; or
- d) combinations of a) and b); or
- e) a saturated polyester, polyether, or acrylic resin containing two or more hydroxyl and/or carboxyl groups per molecule along with an alkylated urea-formaldehyde resin, melamine-formaldehyde resin, or benzoguanamine-formaldehyde resin, and
- optional components selected from the group consisting of fillers, conductive pigments, antioxidants, pigments, moisture scavengers, low profile additives, and diluents.
- 12. A process according to claim 11, wherein said preheating is to a temperature of from about 77.degree. C. to about 177.degree. C.
- 13. A process according to claim 12, wherein said liquid thermosettable composition includes sufficient conductive pigments such that the cured composition is electrically conductive.
- 14. A process according to claim 12, wherein said preheating is from about 93.degree. C. to about 177.degree. C.
- 15. A process according to claim 12, wherein said preheating is to a temperature of from about 121.degree. C. to about 149.degree. C.
- 16. A process according to claim 14, wherein said liquid thermosettable composition comprises a polyisocyanate and a polyol.
- 17. A process according to claim 16, wherein said liquid thermosettable composition further comprises an unsaturated polyester resin and an ethylenically unsaturated monomer.
- 18. A process according to claim 14, wherein said liquid thermosettable composition comprises a vinyl ester resin and an ethylenically unsaturated monomer.
- 19. A process according to claim 14, wherein said liquid thermosettable composition comprises (a) oligomers having two or more hydroxyl and/or carboxyl groups per molecule and (b) alkylated urea-formaldehyde, melamine formaldehyde, or benzoquanamine-formaldehyde resins wherein said oligomers comprise polyesters and/or polyethers of molecular weights from about 200 to about 8,000, or acrylic resins of which 80 weight percent have molecular weights from about 200 to 10,000 or combinations thereof.
- 20. A process according to claim 14, wherein said liquid thermosettable composition comprises (a) an oligomer having two or more carboxyl groups per molecule, said oligomer comprising polyester and/or polyether of molecular weight from about 200 to 8,000, or acrylic resin of which 80 weight percent or more has a molecular weight from about 200 to 10,000, or combinations thereof; and (b) triglycidyl isocyanurate.
Parent Case Info
This application is a file wrapper continuation, of application Ser. No. 08/081,767, filed on Jun. 23, 1993, by C. Kausch et al., for LIQUID THERMOSET SEALERS AND SEALING PROCESS FOR MOLDED PLASTICS, now abandoned.
US Referenced Citations (41)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0 299 420 |
Jan 1989 |
EPX |
3916948A1 |
Dec 1989 |
DEX |
63-182078A |
Jul 1988 |
JPX |
2 042 930 |
Oct 1989 |
GBX |
Continuations (1)
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Number |
Date |
Country |
Parent |
81767 |
Jun 1993 |
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