Load-lock chamber

Information

  • Patent Grant
  • D556157
  • Patent Number
    D556,157
  • Date Filed
    Monday, November 22, 2004
    19 years ago
  • Date Issued
    Tuesday, November 27, 2007
    16 years ago
Abstract
Description

The present article relates to a load-lock chamber for a multi-chamber type semiconductor substrate processing apparatus for a film forming process and other processes for semiconductor substrates, and others to be processed. The load-lock chamber is, as shown in a reference drawing illustrating a state of usage of the load-lock chamber, connected to a transfer-chamber wherein load-in and load-out of substrates to be processed are carried out without exposing the transfer-chamber to air.



FIG. 1 is a top view of the load-lock chamber,



FIG. 2 is a front elevational view thereof;



FIG. 3 is a back elevational view thereof;



FIG. 4 is a bottom view thereof;



FIG. 5 is a right side view thereof;



FIG. 6 is a left side view thereof;



FIG. 7 is a sectional view taken along line 7-7 in FIG. 1;



FIG. 8 is a perspective view thereof; and,



FIG. 9 is a reference figure showing a bottom perspective view thereof.


The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.


Claims
  • The ornamental design for a load-lock chamber, as shown and described.
Priority Claims (1)
Number Date Country Kind
2004-015723 May 2004 JP national
US Referenced Citations (9)
Number Name Date Kind
6045620 Tepman et al. Apr 2000 A
6270582 Rivkin et al. Aug 2001 B1
6382902 Sugimura May 2002 B1
20050005847 Hiroki Jan 2005 A1
20050095088 Kurita et al. May 2005 A1
20050193948 Oohirabaru et al. Sep 2005 A1
20050205012 Jang Sep 2005 A1
20050247265 Devine et al. Nov 2005 A1
20060021575 Ishizawa et al. Feb 2006 A1