Claims
- 1. Automatic test equipment adapted for testing a plurality of device-sunder-test (DUTs), said automatic test equipment including:
a mainframe computer; and a test head coupled to said mainframe computer, said test head including a low-profile tester interface, said low-profile tester interface including a first interface board, a device board for engaging contact points on the DUTs, and having a topside, a hard stop mounted to said first interface board and defining a reference plane, said hard stop adapted to engage said device board topside to vertically fix said device board positionally with respect to said first interface board; and a compliant interconnect array adapted for compression between said first interface board and said device board, said array including a plurality of elastomeric connectors, each of said connectors comprising a thin layer of foam material, and a plurality of formed contact pins embedded in spaced-apart relationship in said foam material, each of said contact pins including a substantially straight body of a first thickness and having respective ends bounded by integrally formed and oppositely projecting horizontal tabs, said tabs having respective contact engagement surfaces and formed with a dimple disposed on said contact engagement surface.
- 2. Automatic test equipment according to claim 1 wherein:
said engagement surfaces are formed with chamfered edges.
- 3. An elastomeric connector for use in an ATE interface, said elastomeric connector comprising:
a thin layer of foam material; and a plurality of formed contact pins embedded in spaced-apart relationship in said foam material, each of said contact pins including a substantially straight body of a first thickness and having respective ends bounded by integrally formed and oppositely projecting horizontal tabs, said tabs having respective contact engagement surfaces and formed with a dimple disposed on said contact engagement surface.
- 4. An elastomeric connector according to claim 3 wherein:
said engagement surfaces are formed with chamfered edges.
- 5. A compliant interconnect array for maintaining electrical connection between opposing arrays of contacts on a prober interface board and a probecard, respectively, said compliant interconnect ring including:
a retainer formed with a plurality of spaced-apart windows; and a plurality of elastomeric connectors, each of said connectors complementally formed to mount within a corresponding window and comprising a thin layer of foam material; and a plurality of formed contact pins embedded in spaced-apart relationship in said foam material, each of said contact pins including a substantially straight body of a first thickness and having respective ends bounded by integrally formed and oppositely projecting horizontal tabs, said tabs having respective contact engagement surfaces and formed with a dimple disposed on said contact engagement surface.
- 6. A compliant interconnect array according to claim 5 wherein:
said engagement surfaces are formed with chamfered edges.
Parent Case Info
[0001] This is a Continuation-In-Part of U.S. patent application Ser. No. 09/571,563, filed May 15, 2000, now pending.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09571563 |
May 2000 |
US |
Child |
09834143 |
Apr 2001 |
US |