Claims
- 1. A cooling element for cooling a component in a chassis of a digital data processor apparatus, the cooling element comprising a fan disposed over the component, the fan being angled to integrate airflow in the chassis.
- 2. The cooling element of claim 1, wherein the chassis has a front portion, a middle portion, and a rear portion, and the fan is angled toward the rear portion of the chassis.
- 3. The cooling element of claim 1, wherein the fan is angled toward a side portion of the chassis.
- 4. The cooling element of claim 1, mounted on a heat sink to which the component is attached.
- 5. The cooling element of claim 3, wherein the heat sink at least one thermally conductive heat dissipation member disposed on a mounting plate.
- 6. The cooling element of claim 5, wherein the at least one conductive member comprises a plurality of spaced apart fins.
- 7. The cooling element of claim 5, wherein the at least one conductive member comprises a plurality of spaced apart posts.
- 8. A cooling element for use in a digital data processor apparatus, the cooling element comprising:
a mounting plate for coupling to a component; a fan disposed on the mounting plate, the fan being disposed at an angle to integrate a flow of air in the data processor apparatus.
- 9. The cooling element of claim 8, wherein the component is disposed within a chassis having a front portion, a middle portion, and a rear portion, the fan being angled toward the rear portion of the chassis.
- 10. The cooling element of claim 8, further comprising at least one thermally conductive heat dissipation member disposed on the mounting plate.
- 11. The cooling element of claim 10, wherein the at least one conductive member comprises a plurality of spaced apart fins.
- 12. The cooling element of claim 10, wherein the at least one conductive member comprises a plurality of spaced apart posts.
- 13. In a digital data processing apparatus of the type having
a component disposed in a chassis, a cooling element disposed in the chassis for facilitating a flow of air through the chassis, the improvement wherein
the cooling element is angled to integrate airflow toward the component with airflow in the chassis.
- 14. In a digital data processing apparatus of claim 13, the improvement wherein the chassis has a front portion, a middle portion, and a rear portion, the cooling element includes a fan angled toward the rear portion of the chassis.
- 15. In a digital data processing apparatus of claim 13, the improvement the cooling element includes a fan angled toward the side portion of the chassis.
- 16. In a digital data processing apparatus of claim 13, the improvement wherein the cooling element includes a fan having a support that positions the fan in a tilted plane.
- 17. In a digital data processing apparatus of claim 13, the improvement wherein the cooling element includes at least one thermally conductive heat dissipation member.
- 18. In a digital data processing apparatus of claim 17, the improvement wherein the at least one conductive member comprises a plurality of spaced apart fins.
- 19. In a digital data processing apparatus of claim 17, the improvement wherein the at least one conductive member comprises a plurality of spaced apart posts.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority from earlier filed U.S. provisional patent application Serial No. 60/216,055, filed Jul. 5, 2000, which is incorporated herein by reference.
[0002] This application is related to the following co-pending, commonly assigned applications, the teachings of all of which are incorporated herein by reference: U.S. Serial No. 60/215,952, filed Jul. 5, 2000, entitled “Server Architecture and Methods for Digital Data Processing,” U.S. Serial No. 60/215,975, filed Jul. 5, 2000, entitled “Low Profile, High Density Storage Array,” U.S. Serial No. 60/215,997, filed Jul. 5, 2000, entitled “Ventilating Slide Rail Mount,” U.S. Serial No. 60/215,996, filed Jul. 5, 2000, entitled “Power Supply for Low Profile Equipment Housing,” U.S. Serial No. 60/215,995, filed Jul. 5, 2000, entitled “Circuit Board Riser,” U.S. Serial No. 60/244,354, filed Oct. 30, 2000, entitled “Ventilating Slide Rail Mount,” and U.S. Serial No. 60/244,361, filed Oct. 30, 2000, entitled “Low Profile, High Density Storage Array.”
Provisional Applications (1)
|
Number |
Date |
Country |
|
60216055 |
Jul 2000 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09899762 |
Jul 2001 |
US |
Child |
10308915 |
Dec 2002 |
US |