Claims
- 1. A system for electrically coupling a magnetoresistive memory circuit component to a host component, the system comprising:at least one apparatus configured to keep a temperature of the magnetoresistive memory circuit component below about 200° C., while aligning at least one interface feature of the magnetoresistive memory circuit component with at least one interface feature of the host component, and electrically coupling said at least one interface feature of the magnetoresistive memory circuit component with said at least one interface feature of the host component using a z-axis conductive material.
- 2. The system as recited in claim 1, wherein said at least one apparatus is configured to keep said temperature of the magnetoresistive memory circuit component below about 180° C.
- 3. The system as recited in claim 1, wherein the magnetoresistive memory circuit component is selected from a group of component types comprising a die, a chip, a module, and a circuit board.
- 4. The system as recited in claim 1, wherein the host component is selected from a group of component types comprising a die, a chip, a module, a package, and a circuit board.
- 5. The system as recited in claim 1, wherein said at least one interface feature of the magnetoresistive memory circuit component is selected from a group of interface features comprising pads, wires, bumps, contacts, and electrodes.
- 6. The system as recited in claim 1, wherein said at least one interface feature of the host component is selected from a group of interface features comprising pads, wires, bumps, contacts, and electrodes.
- 7. The system as recited in claim 1, wherein the magnetoresistive memory circuit component includes a magnetoresistive random access memory (MRAM) circuit.
RELATED APPLICATIONS
This is a continuation of U.S. patent application Ser. No. 10/053,385, filed Nov. 13, 2001.
US Referenced Citations (4)
Continuations (1)
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Number |
Date |
Country |
Parent |
10/053385 |
Nov 2001 |
US |
Child |
10/361097 |
|
US |