Claims
- 1. A magnetic disc comprising a glass substrate on which an undercoat film, a magnetic film and a protective film are successively formed, the substrate having protrusions on the surface on which the films are formed, the protrusions having a height of 50 to 1000 .ANG., a width of 0.01 to 1 .mu.m, a density of 10 to 1000 per 100 .mu.m.sup.2 and an area ratio of 0.1 to 50%, and its surface roughness complying with the ratio R.sub.p /R.sub.max wherein R.sub.p represents a peak height from a mean line which equally divides the area of the surface profile and R.sub.max represents a maximum height (peak-to-valley) of the surface profile and R.sub.p /R.sub.max is greater than or equal to 60%.
- 2. A substrate for a magnetic disc comprising a glass substrate having protrusions on its surface, the protrusions having a height of 50 to 1000 .ANG., and a height deviation of less than or equal to .+-.50 .ANG., a width of 0.01 to 1 .mu.m, a density of 10 to 1000 per 100 .mu.m.sup.2 and an area ratio of 0.1 to 50%, and its surface roughness complying with the ratio R.sub.p /R.sub.max wherein R.sub.p represents a peak height from a mean line which equally divides the area of the surface profile and R.sub.max represents a maximum height peak-to-valley of the surface profile wherein R.sub.p /R.sub.max is greater than or equal to 60%.
- 3. A substrate as claimed in claim 2, which is prepared by subjecting the glass substrate to a chemical etching treatment using an aqueous solution containing hydrofluoric acid at a concentration of 0.15 to 0.9 N and potassium fluoride at a concentration of 2 to 6 N. wherein the temperature of the solution is 5.degree. to 20.degree. C.
- 4. A substrate as claimed in claim 3, which is washed with water after the chemical etching treatment, the temperature of the water being at 15.degree. C. or less.
- 5. A substrate as claimed in claim 2, which is prepared by subjecting the glass substrate to a chemical etching treatment using an aqueous solution containing hydrofluoric acid whose concentration is 0.15 to 0.9 N and potassium fluoride whose concentration is 2 to 6 N, the solution being at a temperature of 5.degree. to 20.degree. C. and then washing with water at a temperature of 15.degree. C. or less.
Priority Claims (1)
Number |
Date |
Country |
Kind |
4-234695 |
Sep 1992 |
JPX |
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Parent Case Info
This application is a continuation of application Ser. No. 08/111,223 filed on Aug. 23, 1993 now abandoned.
US Referenced Citations (11)
Foreign Referenced Citations (3)
Number |
Date |
Country |
60-136035 |
Jul 1985 |
JPX |
63-160010 |
Jul 1988 |
JPX |
1-37722 |
Aug 1989 |
JPX |
Continuations (1)
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Number |
Date |
Country |
Parent |
111223 |
Aug 1993 |
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