Patent Application
20160169964
This disclosure relates generally to test probes and other devices used for testing circuit boards and devices thereon.
Today's probing applications require connecting test probes to very small devices on circuit boards for testing. These connections from a probe to a device under test (DUT) are usually established by way of very fine wire (e.g., 0.004-0.008″). A typical probe assembly typically includes a compensation box mounted to an oscilloscope, a coaxial cable of some length (e.g., 36-47″), and a test probe having a probe tip.
When the probe tip is connected to the DUT, any movement or force from either the circuit board assembly or the probe assembly (including the cable) will transfer to the fine wire connection between the DUT and the probe tip, undesirably and disadvantageously causing a break in the electrical path. Prior attempted solutions include taping or gluing probe tips to the circuit board assembly nearest to the DUT, thus eliminating any cable pull on the wires. However, this has been a significant concern to users, who would prefer to have some sort of solution for mechanical strain relief near the probe tip.
Accordingly, a need remains for improved test probe assemblies.
Embodiments of the disclosed technology generally pertain to magnetic anchor base assemblies configured to couple with one or more test probes to provide protection thereto from unintentional bumps or other movements that could otherwise cause a disruption or break to the electrical connection that has been established between the test probe(s) and a device under test (DUT).
Embodiments of the disclosed technology generally pertain to various systems and methods for providing protection, e.g., from bumps or other inadvertent movements that could cause a disruption or even full break to an electrical connection, to a test probe (including the test probe tip) positioned at or near one or more connection points to a device under test (DUT).
Certain embodiments of the disclosed technology include a flex circuit and flex connector that are small, lightweight, flexible, and provide a flat surface for easy attachment (e.g., VHB tape or glue) to a printed circuit board (PCB).
Each test probe 110, 120, 130, and 140 also includes a flex connector 114, 124, 134, and 144, respectively, that is configured to physically couple with and electrically connect to a flex circuit (not shown) that is configured to be integrated with or otherwise be electrically coupled with a DUT (not shown), thus providing the electrical coupling between the DUT and the test device.
In the example 100, a magnetic anchor base assembly 150 includes a magnetic coupling component 155 that is configured to securably couple each of the test probes 110, 120, 130, and 140 therewith by way of metal bands 118, 128, 138, and 148, respectively. Each of the metal bands 118, 128, 138, and 148 may be permanently or temporarily integrated with, attached to, or otherwise coupled with the test probes 110, 120, 130, and 140, respectively. Providing such an anchor point at this transition may advantageously eliminate any potential pull issue with regard to either the flex circuits or cables 116, 126, 136, and 146.
In certain embodiments, the magnetic anchor base assembly 150 is a heavy metal base that may incorporate several strong Neodymium magnets. The bottom of the anchor base assembly 150 may include a non-conductive, high friction (e.g., sticky) sheet that provides additional shear resistance for mounting the anchor base assembly 150 near the DUT.
The magnetic coupling component 155 of the magnetic anchor base assembly 150 may be separated for additional attachment options using the magnetics. For example, the magnetic coupling component 155 may be placed on virtually any ferrous metal surface (e.g., tables or fixtures) thus providing a user with the ability to position any or all of the test probes 110, 120, 130, and 140 in multiple distinct orientations.
In certain embodiments, one or more metal bands (e.g., the metal bands 118, 128, 138, and 148 of
Having described and illustrated the principles of the invention with reference to illustrated embodiments, it will be recognized that the illustrated embodiments may be modified in arrangement and detail without departing from such principles, and may be combined in any desired manner. And although the foregoing discussion has focused on particular embodiments, other configurations are contemplated.
In particular, even though expressions such as “according to an embodiment of the invention” or the like are used herein, these phrases are meant to generally reference embodiment possibilities, and are not intended to limit the invention to particular embodiment configurations. As used herein, these terms may reference the same or different embodiments that are combinable into other embodiments.
Consequently, in view of the wide variety of permutations to the embodiments that are described herein, this detailed description and accompanying material is intended to be illustrative only, and should not be taken as limiting the scope of the invention. What is claimed as the invention, therefore, is all such modifications as may come within the scope and spirit of the following claims and equivalents thereto.
