BRIEF DESCRIPTION OF THE DRAWINGS
The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention. Moreover, in the figures, like referenced numerals designate corresponding parts throughout the different views.
FIG. 1 is a partial schematic diagram illustrating a foldable cellular phone with a built-in magnetic sensor according to an embodiment (closed state).
FIG. 2 is a partial schematic diagram illustrating a foldable cellular phone with a built-in magnetic sensor according to the embodiment (opened state).
FIG. 3 is a partial top plan view illustrating a magnetic sensor according to the embodiment.
FIG. 4 is a partial and cross sectional view illustrating the magnetic sensor taken along a line 4-4 of FIG. 3.
FIG. 5A is a partial enlarged top plan view illustrating the magnetic sensor before cutting a conductor.
FIG. 5B is a partial enlarged top plan view illustrating the magnetic sensor after cutting the conductor.
FIG. 6 is a partial enlarged top plan view illustrating the magnetic sensor with a structure different from that shown in FIGS. 5A and 5B according to the embodiment.
FIG. 7 is a partial enlarged top plan view illustrating the magnetic sensor with a structure different from that shown in FIGS. 5A, 5B, and 6 according to the embodiment.
FIG. 8 is a partial enlarged cross-sectional view illustrating the magnetic sensor taken along Line 8-S shown in FIG. 7.
FIG. 9 is a partial enlarged top plan view illustrating the magnetic sensor with a structure different from that shown in FIGS. 5A, 5B, 6, and 7 according to the embodiment.
FIG. 10 is a diagram illustrating a circuit configuration of the magnetic sensor shown in FIG. 3.
FIG. 11 is a partial sectional view illustrating the magnetic sensor with a type different from that shown in FIG. 4.
FIG. 12 is a graph illustrating a hysteresis characteristic of a fixed resistance element, which prepares the magnetic sensor shown in FIG. 11.
FIG. 13 is a graph illustrating a relationship of a coupling magnetic field between a film thickness of a non-magnetic layer, a fixed layer of a magnetoresistance effect element, and a free layer.
FIG. 14 is a graph illustrating a relationship between an element width of the magnetoresistance effect element and a coercive force Hc of the free layer.
FIG. 15 is a graph illustrating the hysteresis characteristic of the magnetoresistance effect element shown in FIG. 4 and FIG. 11.
FIG. 16 is a process view illustrating a method of manufacturing the magnetic sensor according to an exemplary embodiment (partial top plan view).
FIG. 17 is a process diagram illustrating processes performed after the processes illustrated in FIG. 16 (partial top plan view).
FIG. 18 is a process diagram illustrating processes performed after the processes illustrated in FIG. 17 (partial top plan view).
FIG. 19 is a process diagram illustrating processes performed after the processes illustrated in FIG. 18 (partial top plan view).