Patent Application
20180213650
The present disclosure relates to display technology, and more particularly to a manufacturing method of flexible substrates and flexible panels by a screen printing machine.
Organic light emitting diodes (OLEDs) are characterized by attributes, such as self-light-emitting, wide viewing angle, high contrast, low power consumption, and quick response time. Thus, the OLEDs have been widely adopted in the display technology, and also our normal life.
With the rapid development of OLEDs, regardless of the dimension of the panels or the display performance, the flexible and transformable devices have been greatly enhanced. The main manufacturing method of OLED component relates to coating Polyimide on a whole surface of the glass substrate to form a flexible substrate, and the electronic components, and the optical components are packaged on the flexible substrate. Afterward, a laser cutting machine is adopted to cutting the glass substrate and the flexible substrate to be the panels. In the end, the laser stripping machine (LLO) is adopted to stripe the flexible OLED components from the glass substrate so as to form the flexible OLED components. The coating cost of the above manufacturing process is high, and the manufacturing process is very complicated. In addition, the cost of adopting the laser cutting machine is also pretty high, which increases the manufacturing cost.
The present disclosure relates to a manufacturing method of flexible substrates and flexible panels by a screen printing machine, which resolves the above-mentioned issues of the conventional manufacturing process of flexible OLED components.
In one aspect, a manufacturing method of flexible substrates via a screen printing machine, the screen printing machine comprises a stencil having at least one opening, a back-ink blade above the stencil, a scraper, and adhesive material, a bottom side of the stencil is configured with a substrate arranged; the manufacturing method includes moving the back-ink blade and the scraper, the scraper is above the back-ink blade, and the back-ink blade is configured to coat the adhesive material on the opening; moving the back-ink blade and the scraper along an opposite direction, the scraper is lowered down to a position below the back-ink blade, the scraper prints the adhesive material from the opening to the substrate so as to form a flexible substrate thin-film corresponding to the opening area on the substrate; and applying a baking process on the flexible substrate thin-film to obtain a cured flexible substrate, wherein a temperature of the baking process is in a range from 350 to 500 Celsius degrees, a time period of the backing process is in a range from 2 to 4 hours, and a thickness of the flexible substrate is in a range from 20 to 400 micrometers.
In one aspect, a manufacturing method of flexible substrates via a screen printing machine , the screen printing machine comprises a stencil having at least one opening, a back-ink blade above the stencil, a scraper, and adhesive material, a bottom side of the stencil is configured with a substrate arranged; moving the back-ink blade and the scraper, the scraper is above the back-ink blade, and the back-ink blade is configured to coat the adhesive material on the opening; the manufacturing method includes moving the back-ink blade and the scraper along an opposite direction, the scraper is lowered down to a position below the back-ink blade, the scraper prints the adhesive material from the opening to the substrate so as to form a flexible substrate thin-film corresponding to the opening area on the substrate; and applying a baking process on the flexible substrate thin-film to obtain a cured flexible substrate.
Wherein a temperature of the baking process is in a range from 350 to 500 Celsius degrees, and a time period of the backing process is in a range from 2 to 4 hours.
Wherein the temperature of the baking process is in a range from 400 to 450 Celsius degrees, and the time period of the backing process is in a range from 2.5 to 3.5 hours.
Wherein the adhesive material is one of polyethylene (PE), polypropylene (PP), polystyrene (PS), polyethylene terephthalate (PET), polyethylene naphthalate (PEN (PM)) and polyimide (PI).
Wherein the adhesive material is the PI.
Wherein a thickness of the flexible substrate is in a range from 20 to 400 micrometers.
Wherein the thickness of the flexible substrate is in a range from 50 to 100 micrometers.
Wherein a dimension of the opening area is in a range from 6 to 10000 centimeters.
Wherein a gap between the two adjacent opening areas is in a range from 5 to 100 millimeters.
In another aspect, a manufacturing method of flexible substrates via a screen printing machine includes: manufacturing a flexible substrate by the above method; arranging a thin film transistor (TFT), a lighting component, and a package thin film on the flexible substrate in sequence; and stripping the flexible substrate and the substrate via a laser stripping process.
Wherein a temperature of the baking process is in a range from 350 to 500 Celsius degrees, and a time period of the backing process is in a range from 2 to 4 hours.
Wherein the temperature of the baking process is in a range from 400 to 450 Celsius degrees, and the time period of the backing process is in a range from 2.5 to 3.5 hours.
Wherein the adhesive material is one of polyethylene (PE), polypropylene (PP), polystyrene (PS), polyethylene terephthalate (PET), polyethylene naphthalate (PEN (PM)) and polyimide (PI).
Wherein the adhesive material is the PI.
Wherein a thickness of the flexible substrate is in a range from 20 to 400 micrometers.
Wherein the thickness of the flexible substrate is in a range from 50 to 100 micrometers.
Wherein a dimension of the opening area is in a range from 6 to 10000 centimeters.
Wherein a gap between the two adjacent opening areas is in a range from 5 to 100 millimeters.
In view of the above, the screen printing machine forms the flexible substrate thin-film corresponding to the opening of the screen printing machine to so as to obtain the flexible substrate having a predetermined dimension, which simplifies the manufacturing process and saves the manufacturing cost.
Embodiments of the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. Apparently, the accompanying drawings are only some embodiments of the claimed invention. Those of ordinary skill can derive other drawings from these drawings without creative efforts.
Embodiments of the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown.
As shown in
The screen printing machine adopts screen printing technology, and is one of the printing machine. The screen printing machine has good adapting ability toward the material and the shape of the substrates, and also toward large-scale substrates. The screen printing machine may print texts or images, and is a collected term with respect to the devices or machines for generating the prints. The screen printing machine is one of the represented printing machine among the stencil printing machines. In addition to silk, the screen printing machine may also print the Nylon wire, copper wire, steel wire, and stainless steel wire. Further, the screen printing machine may further include flat screen printing machine, curved screen printing machine, rotary screen printing machine, and so on. In the present embodiment, the screen printing machine adopts stainless steel wire plane.
In step S11, moving the back-ink blade 120 and the scraper 130, the scraper 130 is above the back-ink blade 120, and the back-ink blade 120 is configured to coat adhesive material on the opening 112.
As shown in
The stencil 110 of the screen printing machine 100 includes an opening area 112 and a closed area 114. The opening area 112 and the closed area 114 are spaced apart and are configured as a stencil having a flat surface. The dimension of the stencil is in a range from 300*300 mm to 2000*3000 mm Further, the dimension of the stencil is in a range from 650*650 mm to 1000*1000 mm In addition, the dimension of the stencil 110 is greater than the dimension of the substrate 150. The closed area 114 is configured to print photo-sensitive paste on the corresponding stencil. The photo-sensitive paste is cross-linked and cured by the action of a sensitizer under the irradiation of ultraviolet rays to close the closed region 114. The opening area 112 has not been printed with the photo-sensitive paste, and swollen and dissolved when contacting with water. After being developed, a predetermined pattern the same with the flexible substrate may be obtained.
The adhesive material 140 may be one of polyethylene (PE), polypropylene (PP), polystyrene (PS), polyethylene terephthalate (PET), polyethylene naphthalate (PEN (PM)) and polyimide (PI). Among the above materials, polyimide (PI) is one of the most excellent organic polymer materials with high temperature resistance up to 400 Celsius degrees, and a long-term-use temperature may be in a range from −200 to 300 Celsius degrees. In addition, the PI is also characterized by attributes such as no obvious melting point, with excellent mechanical properties, high insulation properties, and thus is the most commonly used material for flexible substrates.
In step S12, moving the back-ink blade 120 and the scraper 130 along a second direction opposite to the first direction. The scraper 130 is lowered down to a position below the back-ink blade 120. The scraper 130 prints the adhesive material from the opening to the substrate 150 so as to form a flexible substrate thin-film corresponding to the opening area 112 on the substrate.
As shown in
In step S13, applying a baking process on the flexible substrate thin-film to obtain a cured flexible substrate.
In view of the above, the screen printing machine forms the flexible substrate thin-film corresponding to the opening of the screen printing machine to so as to obtain the flexible substrate having a predetermined dimension, which simplifies the manufacturing process and saves the manufacturing cost.
Specifically, a temperature of the baking process is in a range from 350 to 500 Celsius degrees, and a time period of the backing process is in a range from 2 to 4 hours. In addition, the temperature of the baking process is in a range from 400 to 450 Celsius degrees, and the time period of the backing process is in a range from 2.5 to 3.5 hours. After the baking process, the thickness of the flexible substrate is in a range from 20 to 400 micrometers. Further, after the baking process, the thickness of the flexible substrate is in a range from 50 to 100 micrometers
A dimension of the opening area 112 is in a range from 6 to 10000 centimeters. Further, the dimension of the opening area 112 is in a range from 50 to 2500 centimeters. Further, when the dimension of the opening area 112 is 100 centimeters and when the shape of the opening area 112 is a rectangle or a square, a length or a width of the rectangle or the square is in range from 1 to 50 inch. Preferably, the length or the width of the rectangle or the square is in range from 4 to 10 inches. Preferably, the length or the width of the rectangle or the square is 6 inches, wherein a gap between the two adjacent opening areas 112 is in a range from 5 to 100 millimeters. Preferably, the gap between the two adjacent opening areas 112 in a range from 10 to 40 millimeters. Preferably, the gap between the two adjacent opening areas 112 in 30 millimeters.
As shown in
The steps S21-S23 are substantially similar to the steps S11-S13. In the embodiment, the electronic components and the lighting components are arranged on the flexible substrate, which are described in steps S24 and S25.
In step S24, a thin film transistor (TFT), a lighting component, and a package thin film are arranged on the flexible substrate in sequence.
The step S24 is similar to the conventional process of forming the TFT, the lighting component, and the package thin film, and thus the descriptions thereof are omitted hereinafter.
In step S25, adopting a laser stripping process to strip the flexible substrate from the substrate.
In view of the above, the screen printing machine forms the flexible substrate thin-film corresponding to the opening of the screen printing machine. In addition, the TFT, the lighting component, and the package thin film are arranged on the flexible substrate. As such, the step of cutting the whole glass together with the flexible substrate by a laser cutting machine may be omitted. Thus, the manufacturing process is simplified, and the manufacturing cost is reduced.
The flexible panel 20 is formed by the above method. The flexible substrate 20 includes a flexible substrate 10 and a TFT 21, a lighting component 22, and a package thin film 23, wherein the flexible substrate 10 may be made by the above manufacturing method.
In view of the above, the screen printing machine forms the flexible substrate thin-film corresponding to the opening of the screen printing machine to so as to obtain the flexible substrate having a predetermined dimension, which simplifies the manufacturing process and saves the manufacturing cost.
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2016112074819 | Dec 2016 | CN | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2017/071070 | 1/13/2017 | WO | 00 |
