by special treatment of the substrate

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CPC
H05K3/381

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/381by special treatment of the substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring structure, method for manufacturing same, and semiconductor...
- Patent number 12,114,437
- Issue date Oct 8, 2024
- Resonac Corporation
- Masaya Toba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate manufacturing method
- Patent number 12,108,540
- Issue date Oct 1, 2024
- AMOSENSE CO., LTD.
- Kyung Whan Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing wiring substrate
- Patent number 11,997,787
- Issue date May 28, 2024
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for high-frequency printed wiring board
- Patent number RE49929
- Issue date Apr 16, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
Information Patent Grant
Laminate
- Patent number 11,946,143
- Issue date Apr 2, 2024
- Arisawa Mfg. Co., Ltd.
- Kenji Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of directly patterning stretchable substrate and stretchable...
- Patent number 11,839,033
- Issue date Dec 5, 2023
- Korea University Research and Business Foundation
- Soong Ju Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,729,912
- Issue date Aug 15, 2023
- Ibiden Co., Ltd.
- Kosuke Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit electrode array and method of manufacturing the same
- Patent number 11,627,664
- Issue date Apr 11, 2023
- Cortigent, Inc.
- Robert Jay Greenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,589,457
- Issue date Feb 21, 2023
- Kyocera Corporation
- Seiichirou Itou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate and electronic component-embedded module
- Patent number 11,553,592
- Issue date Jan 10, 2023
- Murata Manufacturing Co., Ltd.
- Ryota Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing metal-clad laminate and uses of the same
- Patent number 11,529,797
- Issue date Dec 20, 2022
- Taiwan Union Technology Corporation
- Wen-Ren Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wiring board
- Patent number 11,528,810
- Issue date Dec 13, 2022
- Shinko Electric Industries Co., Ltd.
- Yoko Nakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and equipment for the treatment of panels
- Patent number 11,483,933
- Issue date Oct 25, 2022
- WISE S.R.L.
- Massimo Fiorani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 11,430,725
- Issue date Aug 30, 2022
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 11,375,615
- Issue date Jun 28, 2022
- Sumitomo Electric Industries, Ltd.
- Yuichiro Yamanaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 11,324,107
- Issue date May 3, 2022
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure applicable to manufacturing circuit board
- Patent number 11,322,377
- Issue date May 3, 2022
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with a substrate provided with plasma treatment
- Patent number 11,291,122
- Issue date Mar 29, 2022
- Intel Corporation
- Darko Grujicic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate and manufacturing method therefor
- Patent number 11,291,113
- Issue date Mar 29, 2022
- AMOSENSE CO. LTD.
- Ji-Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate and electronic component-embedded module
- Patent number 11,246,215
- Issue date Feb 8, 2022
- Murata Manufacturing Co., Ltd.
- Ryota Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and process for preparing the same
- Patent number 11,191,158
- Issue date Nov 30, 2021
- SHENGYI TECHNOLOGY CO., LTD.
- Shanyin Yan
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Double-sided circuit board and method for preparing the same
- Patent number 11,134,574
- Issue date Sep 28, 2021
- Taiwan Green Point Enterprises Co., Ltd.
- I-Lin Tseng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the wiring substrate
- Patent number 11,109,491
- Issue date Aug 31, 2021
- Seiko Epson Corporation
- Yutaka Yamazaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a polymer printed circuit board
- Patent number 11,102,891
- Issue date Aug 24, 2021
- BGT MATERIALS LIMITED
- Kuo-Hsin Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board manufacturing method and wiring board
- Patent number 11,026,335
- Issue date Jun 1, 2021
- Nichia Corporation
- Rie Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-clad laminate sheet manufacturing method, and metal-clad lami...
- Patent number 10,987,911
- Issue date Apr 27, 2021
- Kuraray Co., Ltd.
- Takahiro Nakashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Carbon-based direct plating process
- Patent number 10,986,738
- Issue date Apr 20, 2021
- MacDermid Enthone Inc.
- Roger Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 10,978,383
- Issue date Apr 13, 2021
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for printed circuit board
- Patent number 10,893,613
- Issue date Jan 12, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong-Guk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier and Method for Manufacturing the Same Using a Des...
- Publication number 20250024611
- Publication date Jan 16, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Nina WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20240397635
- Publication date Nov 28, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20240284593
- Publication date Aug 22, 2024
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20240155760
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20240098884
- Publication date Mar 21, 2024
- LG Innotek Co., Ltd.
- Do Hyuk YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20240090139
- Publication date Mar 14, 2024
- LX Semicon Co., Ltd.
- Jun Ho LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD
- Publication number 20240063104
- Publication date Feb 22, 2024
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND DISPLAY DEVICE
- Publication number 20240023248
- Publication date Jan 18, 2024
- KYOCERA CORPORATION
- Nobuyuki HASEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20230209725
- Publication date Jun 29, 2023
- Showa Denko Materials Co., Ltd.
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20230199945
- Publication date Jun 22, 2023
- LG ENERGY SOLUTION, LTD.
- Ga Young WOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230069980
- Publication date Mar 9, 2023
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRO...
- Publication number 20230034784
- Publication date Feb 2, 2023
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF DIRECTLY PATTERNING STRETCHABLE SUBSTRATE AND STRETCHABLE...
- Publication number 20220386477
- Publication date Dec 1, 2022
- Korea University Research and Business Foundation
- Soong Ju OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20220225503
- Publication date Jul 14, 2022
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT-EMBEDDED MODULE
- Publication number 20220117084
- Publication date Apr 14, 2022
- MURATA MANUFACTURING CO., LTD.
- Ryota ASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220046795
- Publication date Feb 10, 2022
- IBIDEN CO., LTD.
- Kosuke IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20220046806
- Publication date Feb 10, 2022
- IBIDEN CO., LTD.
- Satoru KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE
- Publication number 20210348276
- Publication date Nov 11, 2021
- ARISAWA MFG. CO., LTD.
- Kenji Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING PRINTED WIRING BOARD
- Publication number 20210289637
- Publication date Sep 16, 2021
- C. Uyemura & Co., Ltd.
- Yoshikazu SAIJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT-EMBEDDED MODULE
- Publication number 20210259105
- Publication date Aug 19, 2021
- MURATA MANUFACTURING CO., LTD.
- Ryota ASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20210243902
- Publication date Aug 5, 2021
- Shinko Electric Industries Co., Ltd.
- Yoko Nakabayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carbon-Based Direct Plating Process
- Publication number 20210204412
- Publication date Jul 1, 2021
- MacDermid Enthone Inc.
- Roger Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING BOARD
- Publication number 20210127486
- Publication date Apr 29, 2021
- KYOCERA CORPORATION
- Seiichirou ITOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKING STRUCTURE APPLICABLE TO MANUFACTURING CIRCUIT BOARD
- Publication number 20200411349
- Publication date Dec 31, 2020
- Unimicron Technology Corp.
- Po-Hsuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20200315003
- Publication date Oct 1, 2020
- AMOSENSE CO., LTD.
- Ji-Hyung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPRINTED METALLIZATION ON POLYMERIC SUBSTRATES
- Publication number 20200260590
- Publication date Aug 13, 2020
- The University of Hong Kong
- Wendi LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND EQUIPMENT FOR THE TREATMENT OF PANELS
- Publication number 20200245467
- Publication date Jul 30, 2020
- WISE S.R.L.
- Massimo FIORANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS WITH A SUBSTRATE PROVIDED WITH PLASMA TREATMENT
- Publication number 20200245472
- Publication date Jul 30, 2020
- Intel Corporation
- Darko GRUJICIC
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Regeneration of Etch Solutions Containing Trivalent Manganese in Ac...
- Publication number 20200189929
- Publication date Jun 18, 2020
- MACDERMID ACUMEN, INC.
- Roderick D. Herdman
- C01 - INORGANIC CHEMISTRY
Information Patent Application
WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
- Publication number 20200077526
- Publication date Mar 5, 2020
- Nichia Corporation.
- Rie MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by special treatment of the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring structure, method for manufacturing same, and semiconductor...

Ceramic substrate manufacturing method

Panel molded electronic assemblies with multi-surface conductive co...

Wiring substrate and method of manufacturing wiring substrate

Substrate for high-frequency printed wiring board

Laminate

Method of directly patterning stretchable substrate and stretchable...

Wiring substrate and method for manufacturing wiring substrate

Flexible circuit electrode array and method of manufacturing the same

Wiring substrate

Ceramic substrate and electronic component-embedded module

Method of manufacturing metal-clad laminate and uses of the same

Wiring board

Method and equipment for the treatment of panels

Wiring board and method of manufacturing the same

Substrate for printed circuit board, printed circuit board, and met...

Panel molded electronic assemblies with multi-surface conductive co...

Stacking structure applicable to manufacturing circuit board

Apparatus with a substrate provided with plasma treatment

Ceramic substrate and manufacturing method therefor

Ceramic substrate and electronic component-embedded module

Circuit board and process for preparing the same

Double-sided circuit board and method for preparing the same

Wiring substrate and method of manufacturing the wiring substrate

Method of manufacturing a polymer printed circuit board

Wiring board manufacturing method and wiring board

Metal-clad laminate sheet manufacturing method, and metal-clad lami...

Carbon-based direct plating process

Wiring board and method of manufacturing the same

Manufacturing method for printed circuit board

Patents Applicationslast 30 patents

Component Carrier and Method for Manufacturing the Same Using a Des...

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

CIRCUIT BOARD

WIRING BOARD AND DISPLAY DEVICE

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

METHOD FOR MANUFACTURING WIRING SUBSTRATE

COPPER-CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRO...

METHOD OF DIRECTLY PATTERNING STRETCHABLE SUBSTRATE AND STRETCHABLE...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE

CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT-EMBEDDED MODULE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

LAMINATE

METHOD FOR PRODUCING PRINTED WIRING BOARD

CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT-EMBEDDED MODULE

WIRING BOARD

Carbon-Based Direct Plating Process

WIRING BOARD

STACKING STRUCTURE APPLICABLE TO MANUFACTURING CIRCUIT BOARD

CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREFOR

IMPRINTED METALLIZATION ON POLYMERIC SUBSTRATES

METHOD AND EQUIPMENT FOR THE TREATMENT OF PANELS

APPARATUS WITH A SUBSTRATE PROVIDED WITH PLASMA TREATMENT

Regeneration of Etch Solutions Containing Trivalent Manganese in Ac...

WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD