Patent Application
20210347093
The present invention relates to a master, a method of manufacturing the master, and a method of manufacturing a transferred object.
In recent years, development of an imprinting technology which is one of microfabrication technologies is being advanced. The imprinting technology is a technology of pressing a master having a micro concave-convex structure formed in a surface against a transferred material, and then curing the transferred material to transfer the concave-convex structure in the surface of the master to the transferred material.
A known example of such an imprinting technology is the roll-to-roll imprinting technology of continuously pressing a roll-shaped master against a transferred material to continuously transfer the concave-convex structure in the surface of the master to the transferred material. In the continuous transfer through use of such a roll-shaped master, however, the transferred material may start curing unintendedly before transfer to cause a failure in transferring the concave-convex structure.
Specifically, in a case where the transferred material is a light-curing resin, unintended curing of the transferred material is caused by unintended light emission to the transferred material through a base material of the master. For example, guided light or transmitted light passed through the base material of the master may be emitted to the transferred material in an unintended region to cure the transferred material in the unintended region.
For example, Patent Literature 1 below discloses a technology of providing a metallic UV absorption layer on a micro structure layer formed in a base material in a roll-shaped mold for imprinting, and restraining guided light or transmitted light passing through the base material to restrain occurrence of a transfer failure.
Patent Literature 1: JP 2013-45792A
On the other hand, as a method of manufacturing a transferred object at lower cost and with high efficiency, cleaning a master after transfer to remove a transferred material adhering to the surface of the master, thereby enabling the master to be used repeatedly is being studied. However, Patent Literature 1 does not sufficiently study repeated use of the roll-shaped mold which is the master. Therefore, a master suitable for repeated use through cleaning has been demanded.
The present invention was therefore made in view of the above circumstances, and an object of the present invention is to provide a novel and improved master that enables a transferred object in which a transfer failure is restrained to be manufactured with higher efficiency, a method of manufacturing the master, and a method of manufacturing a transferred object through use of the master.
In order to achieve the above-mentioned object, there is provided a master including a base material, a pattern layer provided on one surface of the base material, a micro concave-convex structure being formed in the pattern layer, and an absorption layer provided to be sandwiched between the base material and the pattern layer, and having a light absorption coefficient larger than a light absorption coefficient of the pattern layer.
The absorption layer may be formed of a non-metallic material.
The pattern layer may be formed of a transparent material.
The pattern layer may be formed of SiO2, and the absorption layer may be formed of Si.
The base material may be formed of a ceramic material or a glass material.
The micro concave-convex structure may be a moth-eye structure.
The one surface of the base material may have a surface roughness of less than or equal to 1/100 of a concavity-convexity height difference of the micro concave-convex structure.
The pattern layer may have a film thickness larger than a concavity-convexity height difference of the micro concave-convex structure.
In a case where the absorption layer is formed of Si, the absorption layer may have a film thickness of more than or equal to 5 nm.
The base material may have a cylindrical shape.
The one surface of the base material may be an outer peripheral surface of the cylindrical shape, and the pattern layer may be provided along the outer peripheral surface.
In addition, in order to achieve the above-mentioned object, there is provided a method of manufacturing a master, including forming an absorption layer on one surface of a base material, and forming a pattern layer on the absorption layer, the pattern layer having a light absorption coefficient smaller than a light absorption coefficient of the absorption layer, a micro concave-convex structure being formed in the pattern layer.
In addition, in order to achieve the above-mentioned object, there is provided a method of manufacturing a transferred object, including applying a light-curing resin onto the pattern layer of the master to form a resin layer, curing the resin layer, and then separating the resin layer to transfer the micro concave-convex structure to the resin layer and form the transferred object, and cleaning the master after the resin layer is separated to remove the light-curing resin remaining on the master, in which the master after cleaning is repeatedly used to manufacture a plurality of the transferred objects.
The above-described configuration can provide a master that restrains occurrence of propagating light transmitted or guided through the inside of the master, and even when cleaned repeatedly, does not reduce the effect of restraining occurrence of propagating light.
According to the present invention as described above, a transferred object in which a transfer failure is restrained can be manufactured with higher efficiency.
Hereinafter, referring to the appended drawings, preferred embodiments of the present invention will be described in detail. It should be noted that, in this specification and the appended drawings, structural elements that have substantially the same function and structure are denoted with the same reference numerals, and repeated explanation thereof is omitted.
Note that in the respective drawings which will be referred to in the following description, some structural elements may be exaggerated in size for ease of description. Therefore, relative sizes of structural elements depicted in the respective drawings do not necessarily express actual size relationship between structural elements faithfully.
First, a configuration of a master according to an embodiment of the present invention will be described with reference to
A master 1 according to the present embodiment is a master to be used for roll-to-roll imprinting, for example. The master 1 enables a micro concave-convex structure 30 formed in a pattern layer 12 provided on the outer peripheral surface to be transferred to a transferred material by pressing the pattern layer 12 against the transferred material while rotating.
By cleaning the master 1 after transferring the micro concave-convex structure 30 to the transferred material using the master 1, the master 1 can be used again to transfer the micro concave-convex structure 30 to a transferred material. This is because part of the transferred object separated from the transferred material or a parting agent or the like for improving detachability between the master 1 and the transferred material is adhering to the pattern layer 12 of the master 1 after the transfer. By removing these adhering substances through cleaning, the master 1 will be able to transfer the micro concave-convex structure 30 to a transferred material again with high accuracy. The master 1 can be cleaned by, for example, immersing the master 1 in a cleaning solution in which a strong acid, a strong base, an oxidizing agent, or the like is used. For example, the master 1 can be cleaned by immersing the master 1 in a piranha solution obtained by blending sulfuric acid and a hydrogen peroxide solution.
More specifically, the master 1 includes a base material 11, an absorption layer 20, and the pattern layer 12 in which the micro concave-convex structure 30 has been formed, as illustrated in
The base material 11 is a hollow, cylindrical member having a cavity inside, for example. However, the base material 11 may be a solid, columnar member having no cavity inside. Since the base material 11 has such a shape, the master 1 can be used for the roll-to-roll imprinting.
Specifically, the base material 11 may have a cylindrical shape having a height (a length in the axial direction) of more than or equal to 100 mm, a diameter of the circle at the bottom or top (an outer diameter in the radial direction orthogonal to the axial direction) of more than or equal to 50 mm and less than or equal to 300 mm, and a thickness in the radial direction of more than or equal to 2 mm and less than or equal to 50 mm.
However, the base material 11 is not limited in shape or size to the above examples. For example, the base material 11 may have a planar shape.
On one surface of the base material 11 (in a case where the base material 11 has a cylindrical shape, the outer peripheral surface of the base material 11), the pattern layer 12 in which the micro concave-convex structure 30 is formed is provided as will be described later. Thus, in order to achieve better formability of the concave-convex structure of the micro concave-convex structure 30, the surface roughness (an arithmetic mean roughness Ra) of one surface (that is, the outer peripheral surface) of the base material 11 preferably is less than or equal to 1/100 of the concavity-convexity height difference of the micro concave-convex structure 30, and more preferably is less than or equal to 1/10000. It is more favorable as the surface roughness of the one surface (that is, the outer peripheral surface) of the base material 11 is smaller, whilst from the perspective of process limitation on the base material 11, the lower limit may be set at 1/10000 of the concavity-convexity height difference of the micro concave-convex structure 30.
The base material 11 preferably is formed of a material not to be dissolved or corroded in the cleaning step performed after transfer. For example, the base material 11 preferably is formed of any type of ceramic material or glass material such as heat-resistant glass including fused silica glass, synthetic silica glass, and Tempax (registered trademark), highly transparent crown glass, or tempered glass. Furthermore, AlN, C, SiC, Si, or the like can also be used as the material of the base material 11. On the other hand, various metals, various organic resins, or the like are not preferable for the material of the base material 11 as they have low corrosion resistance or solvent resistance to the cleaning step.
The pattern layer 12 is provided on one surface of the base material 11, and is a layer in which the micro concave-convex structure 30 is formed. The pattern layer 12 in which the micro concave-convex structure 30 is formed preferably has a film thickness larger than the concavity-convexity height difference of the micro concave-convex structure 30. For example, in a case where the concavity-convexity height difference of the micro concave-convex structure 30 is 300 nm to 500 nm, the film thickness of the pattern layer 12 may be 500 nm to 700 nm.
The pattern layer 12 preferably is formed of, for example, a glass material such as fused silica glass or synthetic silica glass consisting mainly of SiO2. The glass material consisting mainly of SiO2 is particularly preferable for the material of the pattern layer 12 as it is easily microfabricated through etching, and has high corrosion resistance. On the other hand, a metallic material such as Al or W is not preferable for the material of the pattern layer 12 as it has low corrosion resistance to the cleaning step.
In the case where the pattern layer 12 is formed of a glass material consisting mainly of SiO2, the pattern layer 12 has high light transparency to light near the visible light band, and is transparent. In such a case, the pattern layer 12 may produce propagating light by transmitting or guiding light (for example, ultraviolet rays) emitted for curing the transferred material during transfer. Accordingly, the pattern layer 12 may cause the propagating light to be emitted to the transferred material in an unintended region to cure the transferred material in the unintended region before transfer. The master 1 according to the present embodiment enables propagating light transmitted or guided through the pattern layer 12 to be absorbed by the absorption layer 20 which will be described later. Accordingly, the master 1 according to the present embodiment can restrain the transferred material from being unintentionally cured before transfer, and therefore can restrain occurrence of a transfer failure.
The micro concave-convex structure 30 formed in the pattern layer 12 is a structure in which a plurality of concavities or convexities are arrayed regularly or irregularly. Specifically, an average size of the planar shapes of the plurality of concavities or convexities may be less than or equal to the wavelength of light belonging to the visible light band. The micro concave-convex structure 30 may be a structure in which the plurality of concavities or convexities are arranged regularly or irregularly in such a manner that an average interval between the plurality of concavities or convexities is less than or equal to the wavelength of light belonging to the visible light band.
For example, the average size of the planar shapes of the plurality of concavities or convexities and the average interval therebetween may be less than 1 μm, and preferably may be more than or equal to 100 nm and less than or equal to 350 nm. In a case where the average size of the planar shapes of the plurality of concavities or convexities and the average interval therebetween fall within the above range, the micro concave-convex structure 30 can function as what is called a moth-eye structure that restrains reflection of light belonging to the visible light band. On the other hand, in a case where the average size of the planar shapes of the plurality of concavities or convexities and the average interval therebetween are less than 100 nm, it may be difficult to form the micro concave-convex structure 30. Alternatively, in a case where the average size of the planar shapes of the plurality of concavities or convexities and the average interval therebetween exceed 350 nm, diffraction of visible light may occur to degrade the function as the moth-eye structure.
Herein, the planar shapes of the concavities or convexities may be any of a substantially circular shape, an elliptical shape, and a polygonal shape. In addition, the arrangement of the concavities or convexities in the micro concave-convex structure 30 may be any of a close-packed arrangement, rectangular lattice arrangement, hexagonal lattice arrangement, and staggered lattice arrangement. The arrangement may be selected as appropriate in accordance with the function to be exerted by a transferred object obtained by transferring the micro concave-convex structure 30.
The absorption layer 20 is provided so as to be sandwiched between the base material 11 and the pattern layer 12. That is, the absorption layer 20 is arranged on the outer peripheral side of the base material 11 and on the inner peripheral side of the pattern layer 12, and is laminated between the base material 11 and the pattern layer 12. Materials of the absorption layer 20 and the pattern layer 12 are selected such that the absorption layer 20 has a light absorption coefficient larger than the light absorption coefficient of the pattern layer 12. Accordingly, the absorption layer 20 can absorb light transmitted or guided through the pattern layer 12 of light emitted to cure the transferred material.
The absorption layer 20 can be formed of a non-metallic material that has a light absorption coefficient larger than that of the pattern layer 12 and is not transparent. Specifically, the absorption layer 20 preferably is formed of Si. Alternatively, the absorption layer 20 may be formed of an inorganic oxynitride such as SiOx (neither having been fully oxidized nor being transparent), SiNx, C, SiC, TiN, WN, or AlN.
The absorption layer 20 may be exposed to a strong acid or strong base cleaning solution penetrated through the pattern layer 12 in the cleaning step after transfer, and therefore preferably is formed of a material having high corrosion resistance described above. On the other hand, in a case where the absorption layer 20 is formed of a metallic material or the like, the absorption layer 20 may be etched by the cleaning solution penetrated through the pattern layer 12 in the cleaning step after transfer to separate the base material 11 and the pattern layer 12. It is therefore not preferable to form the absorption layer 20 of a metallic material or the like.
Furthermore, heat is applied to the master 1 in many cases in the transfer step of manufacturing a transferred object and the cleaning step of reproducing the master 1. Thus, in order to restrain cracks from occurring between the absorption layer 20 and the pattern layer 12 or between the absorption layer 20 and the base material 11, the absorption layer 20 preferably is formed of a material having a coefficient of linear expansion (also called a coefficient of thermal expansion) close to those of the pattern layer 12 and the base material 11. For example, in a case where the base material 11 and the pattern layer 12 are formed using SiO2 as a main constituent, the absorption layer 20 preferably is formed of Si having a coefficient of linear expansion close to that of SiO2.
As to the film thickness of the absorption layer 20, a suitable film thickness can be selected as appropriate in accordance with the material that forms the absorption layer 20 such that the absorption layer 20 can have a sufficient light absorption property. Note that in the case where the absorption layer 20 is formed of Si, Si may be naturally oxidized to be SiOx if the film thickness of Si is excessively thin. Therefore, the lower limit of the film thickness of the absorption layer 20 formed of Si may be set at 5 nm. As the film thickness of the absorption layer 20 is thicker, the light absorption property of the absorption layer 20 is improved. However, in a case where the film thickness of the absorption layer 20 is excessively thick, a longer time is required to form the absorption layer 20, and the absorption layer 20 is more likely to be separated, which increases the difficulty of manufacturing the master 1. Therefore, the upper limit of the film thickness of the absorption layer 20 may be set at 10000 nm, for example.
Note that the transferred object manufactured using the master 1 described above can be used for various applications. For example, the transferred object manufactured using the master 1 can be used as an optical member such as a light guide panel, a light diffuser panel, a microlens array, a Fresnel lens array, diffraction grating, or an anti-reflection film.
Next, superiority of the arrangement of the absorption layer 20 in the master 1 according to the present embodiment will be described with reference to
In the master 2A according to Comparative Example 1, the absorption layer 20 is provided on the surface of the micro concave-convex structure 30 on the outer peripheral surface of the base material 11, as illustrated in
In addition, in the master 2A according to Comparative Example 1, the absorption layer 20 is exposed at the surface of the master 2A, and is therefore exposed to the cleaning solution when cleaning the master 2A. Thus, the absorption layer 20 may be etched and removed as the cleaning solution enters between the absorption layer 20 and the base material 11 when cleaning the master 2A. Therefore, the master 2A according to Comparative Example 1 is less durable in the cleaning step after transfer, and is not suitable for repeated use through cleaning.
In the master 2B according to Comparative Example 2, the absorption layer 20 is provided on the inner peripheral surface of the base material 11, as illustrated in
In addition, in the master 2B according to Comparative Example 2, the absorption layer 20 is exposed at the surface of the master 2B similarly to the master 2A according to Comparative Example 1, and is therefore exposed to the cleaning solution when cleaning the master 2B. Thus, the absorption layer 20 may be etched and removed as the cleaning solution enters between the absorption layer 20 and the base material 11 when cleaning the master 2B. Therefore, the master 2B according to Comparative Example 2 is less durable in the cleaning step after transfer, and is not suitable for repeated use through cleaning.
On the other hand, in the master 1 according to the present embodiment, the absorption layer 20 is sandwiched between the base material 11 and the pattern layer 12, and arranged inside the master 1 as illustrated in
Next, a method of manufacturing the master 1 and a transferred object according to the present embodiment will be described with reference to
As illustrated in
Next, dusts 40 and the like adhering to the outer peripheral surface and the like of the base material 11 are removed by cleaning (S110). For example, cleaning of the base material 11 can be executed by combining ultrasonic cleaning through use of pure water or a neutral detergent, rinsing with pure water, and drying with warm pure water.
Thereafter, the absorption layer 20 is deposited on the outer peripheral surface of the base material 11 after cleaning (S120). Specifically, the absorption layer 20 can be formed by depositing Si on the outer peripheral surface of the base material 11 to a film thickness of 25 nm to 50 nm using sputtering.
Next, the pattern layer 12 is deposited on the absorption layer 20 (S130). Specifically, the pattern layer 12 can be formed by depositing SiO2 on the absorption layer 20 to a film thickness of 300 nm to 500 nm using oxygen reactive sputtering.
Next, a resist layer 31 is deposited on the pattern layer 12 (S140). Specifically, the resist layer 31 can be formed using an inorganic resist or organic resist. A latent image can be formed on the inorganic resist or organic resist by exposure to laser light or the like. For example, in a case of using an inorganic resist composed of a metal oxide containing one or more types of transition metals such as tungsten (W) or molybdenum (Mo), the resist layer 31 can be formed by depositing the inorganic resist on the pattern layer 12 using sputtering or the like. In a case of using an organic resist such as a novolac-type resist or chemically-amplified resist, the resist layer 31 can be formed by depositing the organic resist on the pattern layer 12 using spin coating or the like.
Next, as illustrated in
Next, the resist layer 31 is developed to form a pattern corresponding to the latent image 31A on the resist layer 31 (S160). For example, in a case where the resist layer 31 is formed of an inorganic resist, the resist layer 31 can be developed with an alkaline solution such as a tetramethyl ammonium hydroxide (TMAH) aqueous solution. In a case where the resist layer 31 is formed of an organic resist, the resist layer 31 can be developed with various organic solvents such as ester or alcohol.
Thereafter, the pattern layer 12 is etched using, as a mask, the resist layer 31 on which the pattern corresponding to the micro concave-convex structure 30 has been formed to form the micro concave-convex structure 30 in the pattern layer 12 (S170). The pattern layer 12 can be etched using dry etching by means of fluorocarbon gas or wet etching by means of hydrofluoric acid or the like. Note that ashing treatment may be performed after etching the pattern layer 12 in order to remove the remaining resist layer 31.
The master 1 can be manufactured through the above steps. Next, steps of manufacturing a transferred object using the master 1 will be described.
As illustrated in
A residue 51 of the light-curing resin composition or the like is adhering to the pattern layer 12 of the master 1 after the transferred material layer 50 is separated. Thus, for reutilization of the master 1 after the transfer, cleaning for removing the residue 51 or the like adhering to the pattern layer 12 is performed (S190). Specifically, the master 1 can be cleaned by immersing the master 1 after the transfer into a mixed solution of concentrated sulfuric acid and a hydrogen peroxide solution for several hours, and then performing pure water rinsing, ultrasonic cleaning, and warm pure water drying. The cleaned master 1 is used again for UV imprinting in step S180.
As described above, according to the present embodiment, a plurality of the transferred objects can be manufactured by cleaning and repeatedly using the master 1. Therefore, a transferred object in which a transfer failure is restrained can be manufactured with higher efficiency.
Hereinafter, the master according to the present embodiment will be described further specifically with reference to examples and comparative examples. Note that the examples described below are condition examples for presenting the practicability and effects of the master according to the present embodiment and the method of manufacturing the master, and the present invention is not limited to the following examples.
A master according to Example 1 is a master in which an absorption layer is formed between a base material and a pattern layer (see
Next, a tungsten oxide was deposited on the pattern layer to a film thickness of 55 nm using sputtering to form a resist layer. Next, thermal lithography was performed using laser light having a wavelength of 405 nm output from a semiconductor laser light source to form a latent image on the resist layer.
Thereafter, the resist layer on which the latent image had been formed was developed at 27° C. for 900 seconds using a 2.38% by mass aqueous solution of tetramethylammonium hydroxide (TMAH) (made by TOKYO OHKA KOGYO CO., LTD.) to form a pattern corresponding to the latent image on the resist layer. Next, using the resist layer on which the pattern had been formed as a mask, reactive ion etching (RIE) was performed for 30 minutes at a gas pressure of 0.5 Pa and input power of 150 W using CHF3 gas (30 sccm) to form a micro concave-convex structure in the pattern layer. The micro concave-convex structure formed in the pattern layer was an anti-reflection structure against light in the blue light band (that is, a moth-eye structure) in which the concavity-convexity pitch was 150 nm to 200 nm, and the concavity-convexity height difference was 120 nm.
The master according to Comparative Example 1 is a master in which an absorption layer is formed on the surface of a micro concave-convex structure formed in the outer peripheral surface of the base material (see FIG. 2A). The master according to Comparative Example 1 was manufactured through the following steps. A cylindrical base material made of quartz glass (having an outer diameter of 132 mm, an inner diameter of 123 mm, an axial length of 100 mm, and a radial thickness of 4.5 mm) was prepared, and the base material was cleaned.
Next, a tungsten oxide was deposited on the outer peripheral surface of the base material to a film thickness of 55 nm using sputtering to form a resist layer. Next, thermal lithography was performed using laser light having a wavelength of 405 nm output from a semiconductor laser light source to form a latent image on the resist layer.
Thereafter, the resist layer on which the latent image had been formed was developed at 27° C. for 900 seconds using a 2.38% by mass aqueous solution of tetramethylammonium hydroxide (TMAH) (made by TOKYO OHKA KOGYO CO., LTD.) to form a pattern corresponding to the latent image on the resist layer. Next, using the resist layer on which the pattern had been formed as a mask, reactive ion etching (RIE) was performed for 30 minutes at a gas pressure of 0.5 Pa and input power of 150 W using CHF3 gas (30 sccm) to form a micro concave-convex structure in the outer peripheral surface of the base material. The micro concave-convex structure formed in the outer peripheral surface of the base material was an anti-reflection structure against light in the blue light band (that is, a moth-eye structure) in which the concavity-convexity pitch was 150 nm to 200 nm, and the concavity-convexity height difference was 120 nm. Furthermore, SiOx was deposited on the surface of the micro concave-convex structure using sputtering to a film thickness of 35 nm to form an absorption layer.
The master according to Comparative example 3 is a master including a base material and a micro concave-convex structure formed in the outer peripheral surface of the base material, and having no absorption layer formed therein. The master according to Comparative Example 2 was manufactured by a similar method to that of Comparative example 1 except that an absorption layer was not formed.
Transferred objects were manufactured using the masters according to Example 1 and Comparative examples 1, 2, and a light reflectance of each of the transferred objects was measured. Specifically, the micro concave-convex structure was transferred to an ultraviolet-curing resin provided on a triacetylcellulose film base material using the roll-to-roll imprinting technology. Note that ultra-violet rays of 1000 mJ/cm2 were emitted for a minute with a metal halide lamp to cure the ultraviolet-curing resin. Thereafter, the light reflectance of each of the transferred objects obtained by transferring the micro concave-convex structure was measured.
Note that it was possible to manufacture evaluatable transferred objects with the masters according to Example 1 and Comparative Example 1, whilst with the master according to Comparative Example 2, propagating light transmitted or guided through the base material produced many transfer failures in the transferred object, and it was not possible to manufacture an evaluatable transferred object.
As illustrated in
In order to evaluate the resistance to cleaning of the masters according to Example 1 and Comparative Example 1, oxygen plasma treatment was performed on the masters according to Example 1 and Comparative Example 1 for 15 minutes to measure the light transmittance of each master. The oxygen plasma treatment is an example of treatment of clarifying the master. A load imposed on the master by the oxygen plasma treatment is equivalent to a load imposed by the cleaning treatment through use of a mixed solution of concentrated sulfuric acid and a hydrogen peroxide solution. Thus, in the present measurement test, the oxygen plasma treatment was used instead of cleaning treatment.
As illustrated in
On the other hand, the master according to Example 1 is not varied in light transmittance before and after being subjected to the oxygen plasma treatment. It is therefore considered that in the master according to Example 1, even in the case of repeating the cleaning treatment after transfer, occurrence of propagating light can be restrained, and occurrence of a transfer failure of the micro concave-convex structure in the transferred object can be restrained.
Next, optical properties of the absorption layer for each material were evaluated. Specifically, after transfer through use of a cylindrical master, the master was cut into piece shapes to produce master pieces according to Test examples 1 to 5. Then, for the master pieces according to Test examples 1 to 5, spectrum of front transmittance and front reflectance were measured using the spectrophotometer V650 (made by JASCO Corporation). Furthermore, based on the measured front transmittance and front reflectance, loss transmittances of the master pieces according to Test examples 1 to 5 were calculated.
Loss transmittance (%)=100(%)−front reflectance (%)−front transmittance (%)
The loss transmittance is a value obtained by subtracting the front transmittance and front reflectance measured by the spectrophotometer from 100%, and is an index that evaluates transmission and absorption of the master pieces according to Test examples 1 to 5 excluding the influence of front reflectance. It is indicated that as the loss transmittance is higher, the light absorptivity of the master is higher, and less propagating light is transmitted or guided through the inside of the master.
The master piece according to Test example 1 is a master piece obtained by forming a moth-eye structure in one surface of a base material, and depositing tungsten (W) on the surface of the moth-eye structure to a film thickness of 10 nm as an absorption layer. That is, the master piece according to Test example 1 is a master piece having a structure similar to that of the master according to Comparative Example 1 described above (see
The master piece according to Test example 2 is a master piece obtained by forming silicon (Si) on one surface of a base material to a film thickness of 10 nm as an absorption layer, and forming a pattern layer made of SiO2 on the absorption layer (note that a moth-eye structure is not formed).
The master piece according to Test example 3 is a master piece obtained by forming a moth-eye structure in the pattern layer of the master piece according to Test example 2. That is, the master piece according to Test example 3 is a master piece having a structure similar to that of the master according to Example 1 described above (see
The master piece according to Test example 4 is a master piece obtained by depositing carbon (C) on one surface of a base material to a film thickness of 40 nm as an absorption layer, and forming a pattern layer made of SiO2 on the absorption layer (note that a moth-eye structure is not formed).
The master piece according to Test example 5 is a master piece obtained by depositing titanium nitride (TiN) on one surface of a base material to a film thickness of 40 nm as an absorption layer, and forming a pattern layer made of SiO2 on the absorption layer (note that a moth-eye structure is not formed).
Light in the ultraviolet region (ultraviolet rays) affects unintended curing of a transferred material made of an ultraviolet-curing resin. Therefore, the light absorptivities of the masters according to Test examples 1 to 5 described above were evaluated mainly using the wavelength (350 to 400 nm) in the ultraviolet region as a reference. As illustrated in
As described above, the master according to the present embodiment enables a transferred object in which occurrence of a transfer failure is restrained to be manufactured, and can be used repeatedly through cleaning to manufacture a transferred object in which occurrence of a transfer failure is restrained with high efficiency.
The preferred embodiment(s) of the present invention has/have been described above in detail with reference to the accompanying drawings, whilst the present invention is not limited to the above examples. A person skilled in the art may find various alterations and modifications within the scope of the appended claims, and it should be understood that they will naturally come under the technical scope of the present invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2018-198346 | Oct 2018 | JP | national |
| 2019-191159 | Oct 2019 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2019/041280 | 10/21/2019 | WO | 00 |
