Claims
- 1. Shadow mask material consisting of carbon equal to or less than 0.0008 wt %, silicon equal to or less than 0.03 wt %, manganese from 0.1 to 0.5 wt %, phosphorus equal to or less than 0.02 wt %, sulfur equal to or less than 0.02 wt %, aluminum from 0.01 to 0.07 wt %, nitrogen equal to or less than 0.0030 wt % and boron satisfying an inequality of boron 5 ppm≦B−11/14×N≦30 ppm and the residue including iron and unavoidable impurities, wherein a hot rolling furnish is higher than point Ar3, and said steel sheet is hot rolled at a coiling temperature of from 540 to 680° C. and cold rolled after pickling, and then said steel sheet is annealed in a continuous annealing step, wherein the annealing is conducted at a sheet temperature equal to or greater than 750° C., a soaking period is from 60 to 120 seconds, hydrogen is present in the annealing gas in an amount of from 0 to 75% and the residue is nitrogen and a dew point is from −30° C. to 70° C., so as to control the amount of carbon to not more than 0.0008 wt %.
- 2. Shadow mask made of the material as claimed in claim 1.
- 3. A picture tube with said shadow mask as claimed in claim 2.
- 4. Shadow mask material consisting of iron and unavoidable impurities, carbon equal to or less than 0.0008 wt %, silicon equal to or less than 0.03 wt %, manganese from 0.1 to 0.5 wt %, phosphorus equal to or less than 0.02 wt %, sulfur equal to or less than 0.02 wt %, aluminum from 0.01 to 0.07 wt %, nitrogen equal to or less than 0.0030 wt %, and boron satisfying the inequality of 5 ppm≦B−11/14×N≦30 ppm.
- 5. A shadow mask made of the material as claimed in claim 4.
- 6. A picture tube with said shadow mask as claimed in claim 5.
- 7. The shadow mask material according to claim 1 wherein the amount of boron is from 0.0013 to 0.0053 weight %.
- 8. The shadow mask material according to claim 4 wherein the amount of boron is from 0.0013 to 0.0053 weight %.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-066542 |
Mar 1999 |
JP |
|
REFERENCE TO RELATED APPLICATIONS
The present application is the national stage under 35 U.S.C. §371 of international application PCT/JP00/01402, filed Mar. 8, 2000 which designated the United States, and which application was not published in the English language.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP00/01402 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO00/55383 |
9/21/2000 |
WO |
A |
US Referenced Citations (5)
Number |
Name |
Date |
Kind |
5002619 |
Tsuda et al. |
Mar 1991 |
A |
5209900 |
Nakamura et al. |
May 1993 |
A |
5532088 |
Teshima et al. |
Jul 1996 |
A |
5643697 |
Baudry et al. |
Jul 1997 |
A |
6258496 |
Makita et al. |
Jul 2001 |
B1 |
Non-Patent Literature Citations (3)
Entry |
Patent Abstracts of Japan, Publication No.: 02-254139, Oct. 12, 1990. |
Patent Abstracts of Japan, Publication No.: 08-269627, Oct. 15, 1996. |
Patent Abstracts of Japan, Publication No.: 01-136933, May 30, 1989. |