Medical instrument with sensor for use in a system and method for electromagnetic navigation

Information

  • Patent Grant
  • 10426555
  • Patent Number
    10,426,555
  • Date Filed
    Thursday, May 5, 2016
    8 years ago
  • Date Issued
    Tuesday, October 1, 2019
    5 years ago
Abstract
A medical instrument includes a printed sensor, a surface, at least one non-conductive material, and at least one pair of contacts. The sensor has at least one coil formed on a conductive material. The surface is suitable for receiving the printed sensor and can be placed in an EM field. The at least one non-conductive material covers the at least one coil of the sensor. The medical instrument contains multiple conductive and nonconductive layers. The at least one pair of contacts are electrically connected to the at least one coil and connectable to the conductive layer, the conductive layer coupled to a measurement device, which senses an induced electrical signal based on a magnetic flux change of the EM field. The location of the medical instrument in a coordinate system of the EM filed is identified based on the induced electrical signal in the sensor.
Description
BACKGROUND

Technical Field


The present disclosure relates to a medical instrument including a sensor, and a system in which the location of the sensor can be detected and tracked. More particularly, the present disclosure relates to systems and methods that identify a location of a medical instrument having the sensor in an electromagnetic field.


Discussion of Related Art


Electromagnetic navigation (EMN) has helped expand the possibilities of treatment to internal organs and diagnosis of diseases. EMN relies on non-invasive imaging technologies, such as computed tomography (CT) scanning, magnetic resonance imaging (MRI), or fluoroscopic technologies. These images may be registered to a location of a patient within a generated magnetic field, and as a result the location of a sensor placed in that field can be identified with reference to the images. As a result, EMN in combination with these non-invasive imaging technologies is used to identify a location of a target and to help clinicians navigate inside of the patient's body to the target.


In one particular example of currently marketed systems in the area of locating the position of medical instruments in a patient's airway, a sensor is placed at the end of a probe referred to as a locatable guide and passed through an extended working channel (EWC) or catheter, and the combination is inserted into the working channel of a bronchoscope. The EWC and probe with sensor is then navigated to the target within the patient. Once the target is reached, the locatable guide (i.e., sensor and probe) can be removed and one or more instruments, including biopsy needles, biopsy brushes, ablation catheters, and the like can be passed through the working channel and EWC to obtain samples and/or treat the target. At this point, however, because the locatable guide with its sensor have been removed, the exact location of a distal end of the EWC, and by extension any instrument which might be passed there through is not precisely known.


Images generated by the non-invasive imaging technologies described above do not provide the resolution of live video imaging. To achieve live video, a clinician may utilize the features of an endoscope. However, an endoscope is limited by its size and as a result cannot be navigated to the pleura boundaries of the lungs and other very narrow passageways as is possible with tools typically utilized in EMN. An alternative is a visualization instrument that is inserted through the EWC and working channel of the endoscope, which can be sized to reach areas such as the pleura boundaries.


As with the locatable guide, however, once the visualization instrument is removed the location of the distal end of the EWC is unclear. One technique that is used is the placement of one or more markers into the tissue near the target and the use of fluoroscopy to confirm location of the EWC and the markers, and any subsequent instruments passed through the EWC. Due to the small diameter of the EWC, simultaneous insertion of more than one instrument may be impractical. Thus, repeated insertions and removals of instruments for visualization, diagnosis, and surgeries are necessitated. Such repeated insertions and removals lengthen diagnostic or surgical time and efforts, and increase costs on patients correspondingly. Thus, it is desirous to make a fewer insertion and/or removal of instruments to shorten times necessary for diagnosis and surgeries while at the same time increasing the certainty of the location of the EWC and instruments passed through the EWC, including imaging modalities.


SUMMARY

As used herein, the term “distal” refers to the portion that is being described which is further from a user, while the term “proximal” refers to the portion that is being described which is closer to a user. Further, to the extent consistent, any of the aspects and features detailed herein may be used in conjunction with any or all of the other aspects and features detailed herein.


Provided in accordance with the present disclosure is a medical instrument having a distal portion and a proximal portion, the medical instrument comprising a sensor printed on a distal portion of the medical instrument and having at least one coil formed of a conductive material, at least one non-conductive material covering the at least one coil of the at least one sensor, a conductive layer printed circumferentially around the proximal portion of the medical instrument, a nonconductive layer printed on top of the conductive layer, and at least one pair of contacts electrically connected to the at least one coil and coupled to the conductive layer, the conductive layer connectable to a measurement device configured to sense an induced electrical signal based on a magnetic flux change of the electromagnetic field, wherein a location of the medical instrument in a coordinate system of the electromagnetic field is identified based on the induced electrical signal in the sensor.


According to aspects of the disclosure, the medical instrument comprises a base non-conductive layer on the distal portion of the medical instrument on which the conductive material is printed. The sensor may include multiple layers of the conductive material and the non-conductive material printed or fabricated on the distal portion of the medical instrument. Each conductive layer may have a different configuration, including a different pitch angle and/or the number of loops of the conductive material.


According to further aspects of the disclosure, the proximal portion of the medical instrument includes a plurality of conductive layers and non-conductive layers printed on the proximal portion of the medical instrument. Each conductive layer is coupled to one of the conductive materials of the sensor. The conductive material may further be connected to the conductive layer through vias. The conductive material may further form a helical shape which may be formed in a counter-clockwise or clockwise direction. In embodiments, the outer surface of the medical instrument is made of ETFE, PTFE, polyimide, or non-conductive polymer. The conductive materials may be copper, silver, gold, conductive alloys, or a conductive polymer. The medical instrument may be an extended working channel, an imaging instrument, a biopsy forceps, a biopsy brush, a biopsy needle, or a microwave ablation probe.





BRIEF DESCRIPTION OF THE DRAWINGS

Objects and features of the presently disclosed systems and methods will become apparent to those of ordinary skill in the art when descriptions of various embodiments are read with reference to the accompanying drawings, of which:



FIG. 1 is a perspective view of a system for identifying a location of a medical instrument in accordance with an embodiment of the present disclosure;



FIG. 2A is a profile view of a catheter guide assembly and medical instrument in accordance with an embodiment of the present disclosure;



FIG. 2B is an enlarged view of the indicated area of detail of FIG. 2A;



FIG. 3A depicts a sensor as a coil wound and printed at the distal portion of a medical instrument in accordance with an embodiment of the present disclosure;



FIGS. 3B-3E are perspective views of a plurality of medical instruments in accordance with an embodiment of the present disclosure;



FIG. 4 is an expanded view of a distal portion of a medical instrument around which a circuit is printed in accordance with an embodiment of the present disclosure;



FIG. 5 is an illustrative design of a sensor including two-coils in a multi-layer circuit in accordance with an embodiment of the present disclosure;



FIG. 6A is an illustrative design of two sensors in a first layer of a multi-layer circuit in accordance with an embodiment of the present disclosure;



FIG. 6B is an illustrative design of a sensor in a second layer of a multi-layer circuit in accordance with an embodiment of the present disclosure;



FIG. 6C is an illustrative design of a proximal portion of a medical instrument around which a series of conductive and nonconductive layers are printed;



FIG. 7 is an illustration of a printer that prints a sensor on a surface of a medical instrument in accordance with an embodiment of the present disclosure; and



FIG. 8 is a flowchart of a method for printing a sensor on a medical instrument in accordance with an embodiment of the present disclosure.





DETAILED DESCRIPTION

The present disclosure is related to medical instruments, systems and methods for identifying a location of medical instruments in an electromagnetic field by using a sensor. The sensors may be printed directly on or separately fabricated and then affixed to the medical instruments, including imaging instruments. Since the sensor may be inserted inside of patient's body with medical instruments, the location of the medical instruments is identified in real-time. Further, the sensor may provide and trace an exact direction and location of the medical instrument with other imaging modalities. Due to the small size of the sensor, medical instruments may incorporate the sensor inside or outside of the medical instruments, to facilitate continuous navigation. Although the present disclosure will be described in terms of specific illustrative embodiments, it will be readily apparent to those skilled in this art that various modifications, rearrangements, and substitutions may be made without departing from the spirit of the present disclosure. The scope of the present disclosure is defined by the claims appended to this disclosure.



FIG. 1 illustrates one illustrative embodiment of a system and method for identifying a location of medical instruments in an electromagnetic field. In particular, an electromagnetic navigation (EMN) system 100, which is configured to utilize CT, MRI, or fluoroscopic images, is shown. One such EMN system may be the ELECTROMAGNETIC NAVIGATION BRONCHOSCOPY® system currently sold by Covidien LP. The EMN system 100 includes a catheter guide assembly 110, a bronchoscope 115, a computing device 120, a monitoring device 130, an EM board 140, a tracking device 160, and reference sensors 170. The bronchoscope 115 is operatively coupled to the computing device 120 and the monitoring device 130 via a wired connection (as shown in FIG. 1) or wireless connection (not shown).



FIG. 2A illustrates an embodiment of the catheter guide assembly 110 of FIG. 1. The catheter guide assembly 110 includes a control handle 210, which enables advancement and steering of the distal end 250 of the catheter guide assembly 110. The catheter guide assembly 110 includes a locatable guide catheter (LG) 220 inserted in the EWC 230 and an electromagnetic (EM) sensor 260, as shown in FIG. 2B. A locking mechanism 225 secures the EWC 230 and the LG 220 to one another. Catheter guide assemblies usable with the instant disclosure may be currently marketed and sold by Covidien LP under the name SUPERDIMENSION® Procedure Kits and EDGE™ Procedure Kits. For a more detailed description of the catheter guide assemblies, reference is made to commonly-owned U.S. patent application Ser. No. 13/836,203 filed on Mar. 15, 2013, by Ladtkow et al. and U.S. Pat. No. 7,233,820, the entire contents of which are incorporated in this disclosure by reference. As will be described in greater detail below, the EM sensor 260 on the distal portion of the LG 220 senses the electromagnetic field, and is used to identify the location of the LG 220 in the electromagnetic field. In embodiments, the EM sensor 260 can be directly integrated into the distal end of the EWC 230.


In use, the bronchoscope 115 is inserted into the mouth or through an incision of a patient 150 to capture images of the internal organ. In the EMN system 100, inserted into the bronchoscope 115 is a catheter guide assembly 110 for achieving an access to the internal organ of the patient 150. The catheter guide assembly 110 may include an extended working channel (EWC) 230 into which a locatable guide catheter (LG) 220 with the EM sensor 260 at the distal portion is inserted. The EWC 230, the LG 220, and the EM sensor 260 are used to navigate through the internal organ as described in greater detail below.


In an alternative embodiment, instead of a bronchoscope 115 inserted via a natural orifice the catheter guide assembly 110 is inserted into the patient 150 via an incision. The catheter guide assembly 110 including the EWC 230 may be inserted through the incision to navigate a luminal network other than the airways of a lung, such as the cardiac luminal network.


The computing device 120, such as, a laptop, desktop, tablet, or other similar computing device, includes a display 122, one or more processors 124, memory 126, a network card 128, and an input device 129. The EMN system 100 may also include multiple computing devices, wherein the separate computing devices are employed for planning, treatment, visualization, and other aspects of assisting clinicians in a manner suitable for medical operations. The display 122 may be touch-sensitive and/or voice-activated, enabling the display 122 to serve as both input and output devices. The display 122 may display two dimensional (2D) images or a three dimensional (3D) model of an internal organ, such as the lung, prostate, kidney, colon, liver, etc., to locate and identify a portion of the internal organ that displays symptoms of diseases.


The display 122 may further display options to select, add, and remove a target to be treated and settable items for the visualization of the internal organ. In an aspect, the display 122 may also display the location of the catheter guide assembly 110 in the electromagnetic field based on the 2D images or 3D model of the internal organ.


The one or more processors 124 execute computer-executable instructions. The processors 124 may perform image-processing functions so that the 3D model of the internal organ can be displayed on the display 122. In embodiments, the computing device 120 may further include a separate graphic accelerator (not shown) that performs only the image-processing functions so that the one or more processors 124 may be available for other programs. The memory 126 stores data and programs. For example, data may be image data for the 3D model or any other related data such as patients' medical records, prescriptions and/or history of the patient's diseases.


One type of programs stored in the memory 126 is a 3D model and pathway planning software module (planning software). An example of the 3D model generation and pathway planning software may be the ILOGIC® planning suite currently sold by Covidien LP. When image data of a patient, which is typically in digital imaging and communications in medicine (DICOM) format, from for example a CT image data set (or an image data set by other imaging modality) is imported into the planning software, a 3D model of the internal organ is generated. In an aspect, imaging may be done by CT imaging, magnetic resonance imaging (MRI), functional MRI, X-ray, and/or any other imaging modalities. To generate the 3D model, the planning software employs segmentation, surface rendering, and/or volume rendering. The planning software then allows for the 3D model to be sliced or manipulated into a number of different views including axial, coronal, and sagittal views that are commonly used to review the original image data. These different views allow the user to review all of the image data and identify potential targets in the images.


Once a target is identified, the software enters into a pathway planning module. The pathway planning module develops a pathway plan to achieve access to the targets and the pathway plan pin-points the location and identifies the coordinates of the target such that they can be arrived at using the EMN system 100, and particularly the catheter guide assembly 110 together with the EWC 230, the LG 220, and the EM sensor 260. The pathway planning module guides a clinician through a series of steps to develop a pathway plan for export and later use during navigation to the target in the patient 150. The term, clinician, may include doctor, surgeon, nurse, medical assistant, or any user of the pathway planning module involved in planning, performing, monitoring and/or supervising a medical procedure.


Details of these processes and the pathway planning module can be found in U.S. patent application Ser. No. 13/838,805 filed by Covidien LP on Jun. 21, 2013, and entitled “Pathway Planning System and Method,” the entire contents of which are incorporated in this disclosure by reference. Such pathway planning modules permit clinicians to view individual slices of the CT image data set and to identify one or more targets. These targets may be, for example, lesions or the location of a nerve which affects the actions of tissue where the disease has rendered the internal organ's function compromised.


The memory 126 may store navigation and procedure software which interfaces with the EMN system 100 to provide guidance to the clinician and provide a representation of the planned pathway on the 3D model and 2D images derived from the 3D model. An example of such navigation software is the ILOGIC® navigation and procedure suite sold by Covidien LP. In practice, the location of the patient 150 in the EM field generated by the EM field generating device 145 must be registered to the 3D model and the 2D images derived from the 3D model. Such registration may be manual or automatic and is described in detail and commonly assigned U.S. Provisional Patent Application 62/020,240 entitled “System and method for navigating within the lung.”


As shown in FIG. 1, the EM board 140 is configured to provide a flat surface for the patient to lie down and includes an EM field generating device 145. When the patient 150 lies down on the EM board 140, the EM field generating device 145 generates an EM field sufficient to surround a portion of the patient 150. The EM sensor 260 at the end of the LG 220 is used to determine the location of the distal end of the LG 220 and therewith the EWC 230 within the patient. In an aspect, a separate EM sensor may be located at the distal end of the EWC 230 and therewith the exact location of the EWC 230 in the EM field generated by the EM field generating device 145 can be identified within the patient 150.


In yet another aspect, the EM board 140 may be configured to be operatively coupled with the reference sensors 170 which are located on the chest of the patient 150. The reference sensors 170 move up following the chest while the patient 150 is inhaling and move down following the chest while the patient 150 is exhaling. The movement of the chest of the patient 150 in the EM field is captured by the reference sensors 170 and transmitted to the tracking device 160 so that the breathing pattern of the patient 150 may be recognized. The tracking device 160 also receives the output of the EM sensor 260, combines both outputs, and compensates the breathing pattern for the location of the EM sensor 260. In this way, the location identified by the EM sensor 260 may be compensated for such that the compensated location of the EM sensor 260 may be synchronized with the 3D model of the internal organ. As noted above, however, the use of an LG 230 with an EM sensor 260 at its distal end 250 can result in challenges surrounding instrument swaps, loss of location information, and a general prolongation of the time needed for a procedure. To alleviate these issues, FIG. 3A depicts an electromagnetic sensor 310 in the shape of a coil. The sensor 310 may be printed directly on the distal portion of a medical instrument 300. The printed electromagnetic sensor (PES) 310 may form a helical shape, as depicted or in another configuration as required by the application. The instrument 300 may be the EWC 230, a catheter, a biopsy instrument, an ablation instrument, a monopolar or bipolar electrosurgical instrument, an imaging instrument, a marking instrument, or a needle, in short any instrument capable of being inserted into the luminal network (e.g., the airways or vasculature of a patient). In one embodiment the instrument 300 is sized to pass through the EWC 230. Alternatively, the instrument 300 may be the EWC 230, as described in more detail below. Other exemplary instruments are shown in FIGS. 3B-3E, depicting biopsy forceps 370, a biopsy brush 375, a biopsy needle 380, and a microwave ablation probe 385, each having an EM sensor 310 applied by the methods of the present disclosure.


As will be described in greater detail below, the distal portion of the instrument 300 may be made of or covered by Ethylene tetrafluoroethylene (ETFE), Polytetrafluoroethylene (PTFE), polyimide, or another suitable material to form a non-conductive base for the sensor 310. If the distal portion of the instrument 300 is not covered or made of a non-conductive material, a non-conductive material must be applied to the distal portion first to form an insulating base for the sensor 310.


With respect to the sensor 310 depicted in FIG. 3A, the coil of sensor 310 is in the shape of a helix. The dimensions of the helix (i.e., the length L, the distance d between two adjacent loops, and a diameter D of the helix, as shown in FIG. 3A) may be chosen to create an optimum sensor 310. A pitch angle α may be used to define the helix and be calculated by:






α
=



tan

-
1




(

d

π





D


)


.






The pitch angle α indicates the density of loops of the printed helix along the longitudinal axis of the instrument 300.


In embodiments, the sensor 310 may include multiple layers. Specifically, after a conductive material is applied to the instrument 300 to form a first coil of sensor 310, a non-conductive material may be applied over the first coil, and the second coil formed of a conductive material may be applied over both the non-conductive material and the first coil on the instrument 300. This may continue until a desired number of coils are fabricated or printed on the instrument 300. Each coil may have a different configuration, e.g., a different orientation, a different length L, and a different distance d between two adjacent loops of a helix from that of the other coils. Alternatively, each of the multiple coils of the sensor 310 may be applied to different locations of the instrument 300. In embodiments, each coil may be substantially orthogonal to each other.


In an aspect of the present disclosure, the rotational direction of the helix of one coil may be different from that of another coil. That is, one helix may have the counter clockwise orientation and another one may have the clockwise orientation. In another aspect, the conductive material may be copper, silver, gold, conductive alloys, or conductive polymer, and the non-conductive material may be ETFE, PTFE, non-conductive polymer, or polyimide.


According to a further aspect of the present disclosure, each of the end portions of the helix 310 may have a larger area for electrical contacts 320 and 330 than other areas of conductive material in the helix. Wires are connected to each of the contacts 320 and 330. These wires may extend the length of the catheter assembly 100 and be connected to the tracking device 160. As described in more detail below, in another embodiment, the wires are integrated into the instrument 300 by printing conductive material directly on to the instrument 300 to couple the sensor 310 to the tracking device 160. Thus, when the instrument 300 is located within an electromagnetic field, electrical signal (e.g., voltage) may be induced in the sensor 310 while the instrument 300 is moving inside the electromagnetic field. The induced electrical signal is transmitted to the tracking device 160, which calculates a location of the instrument 300 with respect to a coordinate system of the electromagnetic field. This calculated location may be registered to the 3D model so that a computing device may display the location in the 3D model on a display. In this way, the clinician may identify the relative location of the instrument 300 in the 3D model and 2D images of the navigation and procedure software as described above.


The induced voltage is derived from the Maxwell's equations and is calculated by the following equation:








ɛ
ind

=


-
N




Δ





Φ


Δ





t




,





where εind is the induced voltage, N is the number of loops in the helix, ΔΦ is the change of magnetic flux of the electromagnetic field, and Δt is the change in time. The magnetic flux Φ is a product of the magnitude of the magnetic field and an area. In the same way, the change of magnetic flux, ΔΦ, is a product of the change of the magnitude of the magnetic field and the area of the one loop in the helix. Thus, the more loops in the helix, the larger the magnitude of the induced voltage is. And the faster the change of the magnetic flux, the higher the magnitude of the induced voltage is. The negative sign indicates that the induced voltage is created to oppose the change of the magnetic flux.


Since the instrument 300 is typically moved slowly and with some caution inside of the body or in a luminal network of an internal organ and the size of the loops in the helix is to be minimal, the number of loops in the helix may be sufficiently large to compensate the slow movements and the size of the loops in order to have a recognizable induced electrical signal. Thus, when a sensitivity level of the induced electrical signal and a magnitude level of the electromagnetic field are determined, the number of loops in the coil sensor 310 may be determined by the following:






N
=

-




ɛ
ind


Δ





t

ΔΦ

.






The sensor 310 may sense different EM fields generated by the EM field generating device 145, in one embodiment employing three coils in the sensor 310 three separate fields are sensed. The strength of the EM field decreases proportionally with the reciprocal of the square of the distance from the source (e.g., the EM field generating device 145). Thus, the magnitude of the voltage induced by an EM field includes information defining the distance of the sensor 310 from the EM field generating device 145. By determining the distance information based on the induced electrical signal, a location of the sensor 310 can be identified with respect to the location of the EM field generating device 145.


In an aspect, where the EM field generating device 145 generates three EM fields, which may have three different directivity patterns such as x-, y-, and z-axes, respectively, induced electrical signal may have different patterns when the instrument 300 having the sensor 310 moves in any direction within the coordinate system of the EM fields. For example, when the instrument 300 moves in the x-axis direction, strengths of EM fields having y- and z-axes directivity patterns will display larger differences as compared to the sensed changes in strength of the EM field having x-axis directivity. Thus, the location of the instrument 300 may be identified by checking patterns of induced voltage sensed by the sensor 310.


In accordance with the present disclosure, sensor 310 may be printed directly onto the instrument 300. That is, during the manufacture of the instrument 300, one of the processing steps is to apply one or more conductive inks or other materials to the instrument 300. This printing may be performed by a number of processes including ink jet printing, flexographic printing, vapor deposition, etching, and others known to those of skill in the art without departing from the scope of the present disclosure.



FIG. 4 shows sensors 410, 420 printed on a surface of an instrument 450, such as a medical instrument. The sensor 400 may have a thickness of about 0.01 to 0.05 millimeter (mm) so that the sensor can be printed on an instrument without appreciably increasing its dimensions. In accordance with one embodiment, a conductive material 415 is printed directly onto the instrument 300, to form a coil 410 or 420 and a second non-conductive film 430 covers the conductive material. Thus, the coil 410 or 420 is protected by the non-conductive film 430.


As described above, in one aspect of the present disclosure, each coil may have a different rotational orientation. The first coil 410 may have the clockwise rotational orientation and the second coil 420 may have the counter clockwise rotational orientation. Nevertheless, when the sensor 400 is printed directly on the instrument 450 so that two coils are facing each other across the longitudinal axis of the tube, the first and second coils 410 and 420 may have the same rotational orientation.



FIG. 5 shows a double layered circuit sensor 500 in accordance with embodiments of the present disclosure. Although not depicted, it is imagined that the double layered circuit sensor 500 is printed directly on an instrument. The double layered circuit sensor 500 includes a first coil 510, a second coil 520, a third coil 530, and a fourth coil 540. The top layer includes the first and second coils 510 and 520 and the bottom layer includes the third and fourth coils 530 and 540. The double layered circuit sensor 500 further includes first and second contacts 550 and 560, and first, second, third, and fourth vias 512, 514, 522, and 524.


In one non-limiting example of the present disclosure the conductive material of each loop of any of the coils 510-540 may be approximately 9 microns thick. The thickness of the conductive material may vary based on the specifications of the circuit sensor 500, and can be larger or smaller than 9 microns for a particular application without departing from the scope of the present disclosure. In accordance with one embodiment of the present disclosure, each loop of the coils 510-540 of the top and bottom layers, respectively may be separated from each other by approximately 0.009 inches. The length and the width of the outermost loop of each coil may be approximately 0.146 inches and approximately 0.085 inches, respectively. The width of the conductive material may be approximately 0.001 inch or from about 0.025 to 0.5 mm. The vias may have a diameter of approximately 0.002 inches. The thickness of the circuit sensor 500 may be approximately 0.005 inches or from about 0.01 to 0.15 mm. The length and the width of the circuit sensor 500 may be approximately 0.180 and approximately 0.188 inches, respectively. The gap between closest loops of the same coil may be typically about 0.0005 inch.


As depicted in FIG. 5, the first contact 550 is connected to one end of the first coil 510 and the first via 512 is connected to the other end of the first coil 510. The first via 512 connects the first coil 510 of the top layer to one end of the fourth coil 540 of the bottom layer. The other end of the fourth coil 540 is connected to one end of the second coil 520 of the top layer through the fourth via 524. The other end of the second coil 520 is connected to one end of the third coil 530 of the bottom layer through the third via 522. The other end of the third coil 530 is connected to the contact 560 on the top layer through the second via 514. In this way, the four coils 510, 520, 530, and 540 are all connected to the first and second contacts 550 and 560, forming one sensor with the four coils connected electrically in series. Since the four coils are all connected to each other, and the number of loops in one sensor is the sum of the loops of the four coils 510, 520, 530, and 540, the result is an increase in sensitivity of the electromagnetic field.


According to a further aspect of the disclosure, the first and second coils 510 and 520 may have different rotational orientations and, likewise, the third and fourth coils 530 and 540 may have different rotational orientations. That is, if the first coil 510 has the counter clockwise orientation, the second coil 520 has the clockwise orientation. In the same way, if the third coil 530 has the counter clockwise orientation, the fourth coil 540 has the clockwise orientation. In another aspect, the first and fourth coils 510 and 540 may have the same rotational orientation and the second and third coils 520 and 530 may have the same rotational orientation.


As shown in FIG. 5, the first and second contacts 550 and 560 are made larger than the width of each loop of the coils. Generally, each coil of the circuit sensor 500 is coated by a non-conductive material. In an aspect, the first and second contacts 550 and 560 may not be covered by the non-conductive material so that the multi-layered circuit sensor 500 may be easily connected to wires which transmit the induced electrical signal (e.g., voltage and/or current) to an external apparatus, such as the tracking device 160 for incorporation into and use with the navigation and procedure software described above.



FIGS. 6A-6C show an exemplary embodiment of a multi-layered circuit sensor printed directly on an instrument or EWC 600. FIGS. 6A and 6B show a first and second layered printed circuit sensor 601, 602. Each layer can contain one or more printed sensors. FIG. 6C shows the different layers of the EWC 600. As depicted in FIG. 6A, the first layer contains first and second sensors 610, 620 and the second layer (shown in FIG. 6B) contains a third sensor 630. Although shown separately, it is imagined that the second layer (shown in FIG. 6B) is printed on top of the first layer (shown in FIG. 6A). For convenience purpose only, loops of each coil are illustrated in FIGS. 6A and 6B in a simplified schematic fashion to only a couple of loops, however, each loop in FIG. 6 may represent more than one loop, and the number of loops may be more in line with those of coils 510-540 of FIG. 5. The sensors 610, 620, 630 are printed on a distal portion of EWC 600. FIG. 6C shows different conductive and nonconductive layers printed on a proximal portion of EWC 600. The conductive and nonconductive layers are coupled to the ends of first, second, and third sensors 610, 620, 630 by the terminals or vias 612, 614, 622, 624, 632, 634 and electrically couple the sensors to the tracking device 160.


As previously mentioned, sensors 610, 620, 630 are printed in layers. In particular, the first layer, containing the first and second sensors 610, 620, is printed directly on a nonconductive layer of the EWC 600. A second nonconductive layer is then printed on top of the first and second sensors 610, 620. The second layer, containing the third sensor 630, is then printed on top of the second nonconductive layer. This process may continue until a desired number of sensors are printed on the EWC 600. In one aspect, the final layer is a nonconductive layer. In yet another aspect, the conductive material may be copper, silver, gold, conductive alloys, or conductive polymer, and the non-conductive material may be Kapton, ETFE, PTFE, non-conductive polymer, or polyimide. Each sensor may have a different configuration or orientation, e.g., a different length L and a different distance d between two adjacent loops of a helix from that of the other coils.


As depicted in FIGS. 6A and 6B, each sensor 610, 620, 630 contains a via 612, 614, 622, 624, 632, 634 connected to the terminals of each sensor 610, 620, 630. In particular, sensor 610 contains first and second vias 612, 614, sensor 620 contains third and fourth vias 622, 624, and sensor 630 contains vias 632, 634. In embodiments, each via is electrically coupled to a different conductive layer on the proximal portion of the EWC 600, as shown in more detail in FIG. 6C.



FIG. 6C depicts an embodiment of an EWC 600 and the various layers of conductive and nonconductive material printed directly onto the instrument. FIG. 6C is not drawn to scale and is meant for illustrative purposes only. Each layer of conductive and nonconductive material may range in thickness from 9 microns to 0.05 millimeters (mm).


EWC 600 comprises a hollow tube consisting of an inner Teflon liner, e.g. PTFE. The Teflon liner provides lubricity for easy sliding of tools down the center of the EWC 600. In one embodiment, the first, second, and third sensors 610, 620, 630 are printed directly on the Teflon layer. Above the Teflon layer is a wire braid layer (not shown). The wire braid helps provide structural integrity and torquability to allow for easy maneuverability of the EWC 600. The final layer is a thermal plastic layer which, through a heat process, bonds all three layers together to provide durability.


As described above, the first, second, and third sensors 610, 620, 630 are printed on the distal portion of EWC 600 on the Teflon layer. On the proximal portion of the EWC 600, nonconductive layers 640 and conductive layers 613, 615, 623, 625, 633, 635 are printed directly on the Teflon layer in layers in alternating fashion. In other words, a base nonconductive layer 640 is printed on top of the Teflon layer followed by a conductive layer 613 printed on top of the base nonconductive layer. Another nonconductive layer is then printed on top of conductive layer 613 and another conductive layer 615 is printed on top of the nonconductive layer. This process is then repeated until a desired number of nonconductive and conductive layers are achieved. In embodiments, the final layer is a nonconductive layer. The wire braid and thermal plastic layer are then placed on top of the final nonconductive layer. The embodiment shown in FIG. 6C illustrates a total of six conductive layers 613, 615, 623, 625, 633, 635 and seven nonconductive layers 640. In aspects, the conductive material may be copper, silver, gold, conductive alloys, or conductive polymer, and the non-conductive material may be Kapton, ETFE, PTFE, non-conductive polymer, or polyimide.


The conductive layers function as wires and form a return path for sensors 610, 620, 630, connecting the sensors to tracking device 160. For example, in one embodiment, the conductive layer 613 is coupled to via 612, conductive layer 615 is connected to via 614, conductive layer 623 is connected to via 622, conductive layer 625 is connected to via 624, conductive layer 633 is connected to via 632, and conductive layer 635 is connected to via 634.


Since the sensors 610, 620, 630 are very thin, the sensors 610, 620, 630 have a high resistance, however, a low resistance is desired for the return path. In one embodiment, each conductive layer 613, 615, 623, 625, 633, 635 is printed 360 degrees around the EWC 600 and along the length of EWC 600 back to the proximal end in order to reduce the resistance on the return path.


The measured resistivity of the sensors 610, 620, 630 and the conductive layers 613, 615, 623, 625, 633, 635 is a function of a number of factors including the length, width, and thickness of the conductive material as well as the resistive properties of the conductive material used. In one experiment, a sensor made up of 200 turns of a conductive material having a resistance of 1.68×10−5 Ωmm and printed around the distal end of EWC 600, having a length of 1256 mm, a width of 0.47 mm, and a thickness of 0.01 mm measured a total resistance of 179.58Ω. Likewise, a sensor made up of 300 turns, having a length of 1884 mm, and a thickness of 0.015 mm measured a total resistance of 269.37Ω. In experiments, a return path made up of the same conductive material printed along the length of an EWC 600 having a length of 1020 mm and circumference of 6.28 mm measured a resistance of 10.92Ω. The low resistivity of the conductive return paths helps to lower the amount of noise in the signal from the sensors 610, 620, 630 back to the tracking device 160.


As described above, one methodology for applying sensors to instruments is via printing directly on the instruments. FIG. 7 shows a printing apparatus 700 that prints conductive and non-conductive materials directly to the desired locations of the instruments. The printing apparatus 700 includes a reservoir 710, a printing nozzle 720, and an actuating arm 730. The reservoir 710 includes a first tank 740, which contains a conductive material, and a second tank 750, which contains a non-conductive material. The printing apparatus 700 can print a circuit on any instruments 760, which can be locked into the distal end of the actuating arm 730. In an aspect, the printing apparatus may print a sensor over a polymer.


A controller of the printing apparatus 700, which is not shown in FIG. 7, controls an actuating motor, which is not shown in FIG. 7, to move the actuating arm 730. The actuating motor is fixedly connected to the proximal end of the actuating arm 730. The actuating motor can index forward and backward and rotate the actuating arm 730. In an aspect, the actuating motor may move the reservoir 710 while printing. In another aspect, the actuating motor may move the reservoir 710 and the actuating arm 730 simultaneously. For example, the actuating motor may index forward or backward the reservoir 710 while rotating the actuating arm 730. Still further, the reservoir 710 and instrument 760 may be held motionless while the printing nozzle 720, which is fluidly connected to the reservoir 710, moves about the instrument 760. Further, combinations of these techniques may be employed by those of skill in the art without departing from the scope of the present disclosure.


In one embodiment, with the proximal end of an instrument 760 locked into the distal end of the actuating arm 730, the printing nozzle 720 may start printing the conductive material contained in the first tank 740 while the actuating arm 730 is moved forward and rotated by the actuating motor. Velocities of indexing and rotating are controlled to print a helix-type sensor 770 on the instrument 760. When the velocity of indexing is faster than the velocity of rotating, the helix-type sensor 770 will have a large pitch angle or have loose loops in the helix. On the other hand, when the velocity of indexing (indexing velocity) is slower than the velocity of rotating (angular velocity), the helix-type sensor 770 will have a small pitch angle or have dense loops in the helix. Relationship between the pitch angle and velocities is shown below as follows:







α
=


tan

-
1




(


v
i


D






v
θ



)



,





where α is the pitch angle, νi is the indexing velocity, νθ is the angular velocity of rotation in radian, and D is the cross-sectional diameter of the instrument 760. Thus, the controller may control the indexing velocity νi and the angular velocity νθ so that the printed circuit 770 can have a pitch angle suitable for its purpose.


In an aspect, the printing may be started from the distal end of the instrument 760 or the proximal end of the instrument 760. In a case when the printing is started from the distal end of the instrument 760, the actuating arm 730 indexes the instrument 760 forward so that the printing nozzle 720 can print the conductive material toward the proximal end of the instrument 760. In another case when the printing is started from the proximal end of the toll 760, the actuating arm 730 indexes the instrument 760 backward so that the printing nozzle 720 can print the conductive material toward the distal end of the instrument 760. In another aspect, the actuating arm 730 may change the direction of rotation so that the helix-type sensor 770 can have the counter clockwise or clockwise helix.


The printing nozzle 720 may print more conductive material in the beginning and end of the printing so that each end of the helix-type sensor 770 has a larger area for contact to an external apparatus. In another aspect, after one layer of the helix-type sensor 770 is printed, the actuating arm 730 may perform a reverse indexing and rotating motion, meaning that indexing backward is performed when indexing forward is performed while the helix-type sensor 770 is printed and that counter clockwise rotation is performed when clockwise rotation is performed while the helix-type sensor 770 is printed. At the same time, the printing nozzle 720 may print the non-conductive material over the printed conductive material. In this way, the printed conductive material may be wholly covered by the non-conductive material. The printing nozzle 720 may be controlled to print the non-conductive material over a larger area than an area of the printed conductive material. This may give more certainty that the printed conductive material is completely covered by the non-conductive material.


After completion of printing the non-conductive material, the printing nozzle 720 may print the conductive material over the instrument 760 again. In an aspect, a new indexing velocity νi′ and a new angular velocity νθ′ different from the original indexing velocity νi and the angular velocity νθ may be selected so that new helix-type sensor may have different configuration from that of the original helix-type sensor. By repeating these steps, the instrument 760 may have several helix-type sensors.


In yet another aspect, the actuating arm 730 may control indexing forward and backward and rotation motions so that sensor may have different configurations. For example, the sensor may have a series of incomplete circles. This pattern can be obtained by rotating the actuating arm without indexing forward and by indexing forward it without rotation before completing a whole circle. The scope of the present disclosure may extend to similar or different configurations which may be readily appreciated by a person having ordinary skill in the art.



FIG. 8 shows a method 800 of printing a sensor on a surface using a printer. The sensor may be one layered or multiple layered. The method 800 starts from setting a counter N as zero in step 810. In step 820, the printer prints the conductive material for contact to an external apparatus. The contact area may be a larger than an area for printed conductive material of the sensor. In step 830, the printer prints a conductive material on the tube. While printing, in step 840, an indexing arm of the printer, which holds the tube, indexes forward or backward, and rotates the tube. Here, an indexing velocity and an angular velocity of the indexing arm may be controlled to make a specific pattern of the sensor as described above in FIG. 7.


In step 850, the printer prints the conductive material for another contact. The contacts printed in steps 810 and 850 are to be used to connect to wires which lead to and connect with an external apparatus such as the tracking device 160 of FIG. 1. The tracking device can process the sensed results to identify the location of the sensor in an electromagnetic field, as described above.


In step 860, the printer prints a non-conductive material to form a non-conductive film over the printed conductive material. While printing the non-conductive material, in step 870, the actuating arm of the printer indexes forward or backward and rotates in a direction reverse from the direction of printing the conductive material. In this way, the printed conductive material is insulated from or protected from other environments. This step concludes the printing of the sensor.


In step 880, the counter N is incremented by one. In step 890, the counter N is compared with a predetermined number of layers. If the counter N is less than the predetermined number of layers, the method 800 repeats steps 820 through 890. If the counter N is not less than the predetermined number of layers, the method is ended.


In an aspect, when the predetermined number of layers is greater than 1, a sensor printed in each layer may have different configuration, such as a helix pattern as shown in FIG. 7 and a pitch angle. Alternatively, the sensors in a multiple layers may be all connected so that the sensors only have two contacts rather than a sensor in each layer has two contacts separate from two contacts of another sensor.


Although embodiments have been described in detail with reference to the accompanying drawings for the purpose of illustration and description, it is to be understood that the inventive processes and apparatus are not to be construed as limited. It will be apparent to those of ordinary skill in the art that various modifications to the foregoing embodiments may be made without departing from the scope of the disclosure.

Claims
  • 1. A medical instrument, comprising: a base non-conductive layer on a distal portion of the medical instrument;a sensor printed on the base non-conductive layer, the sensor including a first conductive coil, a second conductive coil, and a non-conductive layer disposed between the first conductive coil and the second conductive coil;a proximal conductive layer printed circumferentially around a proximal portion of the medical instrument;a proximal non-conductive layer printed on the proximal conductive layer; andat least one pair of contacts electrically connected to at least one of the first conductive coil or the second conductive coil of the sensor and coupled to the proximal conductive layer, the proximal conductive layer connectable to a measurement device configured to sense an induced electrical signal in the sensor based on a magnetic flux change of an electromagnetic field,wherein a location of the medical instrument in a coordinate system of the electromagnetic field is identified based on the induced electrical signal in the sensor.
  • 2. The medical instrument according to claim 1, wherein each of the first conductive coil and the second conductive coil includes a conductive layer formed of a conductive material, the conductive layer of the first conductive coil having a different configuration from a configuration of the conductive layer of the second conductive coil.
  • 3. The medical instrument according to claim 2, wherein the different configuration includes a pitch angle and a number of loops of the conductive material.
  • 4. The medical instrument according to claim 1, wherein the proximal portion of the medical instrument includes a plurality of proximal conductive layers and proximal non-conductive layers printed on the proximal portion of the medical instrument.
  • 5. The medical instrument according to claim 4, wherein each proximal conductive layer of the plurality of proximal conductive layers is coupled to at least one of the first conductive coil or the second conductive coil of the sensor.
  • 6. The medical instrument according to claim 1, wherein at least one of the first conductive coil or the second conductive coil of the sensor is connected to the proximal conductive layer through vias.
  • 7. The medical instrument according to claim 1, wherein at least one of the first conductive coil or the second conductive coil of the sensor forms a helical shape.
  • 8. The medical instrument according to claim 7, wherein the helical shape is counter clockwise.
  • 9. The medical instrument according to claim 7, wherein the helical shape is clockwise.
  • 10. The medical instrument according to claim 1, wherein an outer surface of the medical instrument is made of ETFE, PTFE, polyimide, or non-conductive polymer.
  • 11. The medical instrument according to claim 1, wherein at least one of the first conductive coil or the second conductive coil of the sensor includes copper, silver, gold, conductive alloys, or conductive polymer.
  • 12. The medical instrument according to claim 1, wherein the medical instrument is an extended working channel, an imaging instrument, a biopsy forceps, a biopsy brush, a biopsy needle, or a microwave ablation probe.
  • 13. A sensor, comprising: a first conductive coil positioned at a distal portion of a medical instrument;a non-conductive layer positioned on at least a portion of the first conductive coil at the distal portion of the medical instrument; anda second conductive coil positioned on at least a portion of the non-conductive layer at the distal portion of the medical instrument,wherein the first conductive coil is spaced apart from the second conductive coil along a direction orthogonal to a surface of the non-conductive layer facing the first conductive coil.
  • 14. The sensor according to claim 13, wherein the first conductive coil overlaps the second conductive coil along the direction orthogonal to the surface of the non-conductive layer facing the first conductive coil.
  • 15. The sensor according to claim 13, wherein the first conductive coil is positioned on a non-conductive base layer of the medical instrument.
  • 16. A medical instrument, comprising: a sensor positioned at a distal portion of the medical instrument, the sensor comprising: a first conductive coil positioned at the distal portion of the medical instrument;a non-conductive layer positioned on at least a portion of the first conductive coil; anda second conductive coil positioned on at least a portion of the non-conductive layer; anda tracking device configured to sense an induced electrical signal in the sensor based on a variation of an electromagnetic field,wherein a location of the sensor in a coordinate system of the electromagnetic field is configured to be determined by the tracking device based on the induced electrical signal in the sensor.
  • 17. The medical instrument according to claim 16, wherein the first conductive coil overlaps the second conductive coil along a direction orthogonal to a surface of the non-conductive layer facing the first conductive coil.
  • 18. The medical instrument according to claim 16, wherein the first conductive coil is positioned on a non-conductive base layer of the medical instrument.
  • 19. The medical instrument according to claim 16, wherein the first conductive coil includes copper, silver, gold, a conductive alloy, or a conductive polymer.
  • 20. The medical instrument according to claim 16, wherein the medical instrument is an extended working channel, an imaging instrument, a biopsy forceps, a biopsy brush, a biopsy needle, or a microwave ablation probe.
CROSS REFERENCE TO RELATED APPLICATION

The present application claims the benefit of and priority to U.S. Provisional Application Ser. No. 62/170,383, filed on Jun. 3, 2015, the entire contents of which are incorporated herein by reference.

US Referenced Citations (757)
Number Name Date Kind
1576781 Phillips Mar 1926 A
1735726 Bornhardt Nov 1929 A
2407845 Nemeyer Sep 1946 A
2650588 Drew Sep 1953 A
2697433 Sehnder Dec 1954 A
3016899 Stenvall Jan 1962 A
3017887 Heyer Jan 1962 A
3061936 Dobbeleer Nov 1962 A
3073310 Mocarski Jan 1963 A
3109588 Polhemus et al. Nov 1963 A
3294083 Alderson Dec 1966 A
3367326 Frazier Feb 1968 A
3439256 Kahne et al. Apr 1969 A
3577160 White May 1971 A
3614950 Rabey Oct 1971 A
3644825 Davis, Jr. et al. Feb 1972 A
3674014 Tillander Jul 1972 A
3702935 Carey et al. Nov 1972 A
3704707 Halloran Dec 1972 A
3821469 Whetstone et al. Jun 1974 A
3868565 Kuipers Feb 1975 A
3941127 Froning Mar 1976 A
3983474 Kuipers Sep 1976 A
4017858 Kuipers Apr 1977 A
4037592 Kronner Jul 1977 A
4052620 Brunnett Oct 1977 A
4054881 Raab Oct 1977 A
4117337 Staats Sep 1978 A
4173228 Van Steenwyk et al. Nov 1979 A
4182312 Mushabac Jan 1980 A
4202349 Jones May 1980 A
4228799 Anichkov et al. Oct 1980 A
4256112 Kopf et al. Mar 1981 A
4262306 Renner Apr 1981 A
4287809 Egli et al. Sep 1981 A
4298874 Kuipers Nov 1981 A
4314251 Raab Feb 1982 A
4317078 Weed et al. Feb 1982 A
4319136 Jinkins Mar 1982 A
4328548 Crow et al. May 1982 A
4328813 Ray May 1982 A
4339953 Iwasaki Jul 1982 A
4341220 Perry Jul 1982 A
4346384 Raab Aug 1982 A
4358856 Stivender et al. Nov 1982 A
4368536 Pfeiler Jan 1983 A
4394831 Egli et al. Jul 1983 A
4396885 Constant Aug 1983 A
4396945 DiMatteo et al. Aug 1983 A
4403321 Kruger Sep 1983 A
4418422 Richter et al. Nov 1983 A
4419012 Stephenson et al. Dec 1983 A
4422041 Lienau Dec 1983 A
4431005 McCormick Feb 1984 A
4447224 DeCant, Jr. et al. May 1984 A
4485815 Amplatz et al. Dec 1984 A
4506676 Duska Mar 1985 A
4543959 Sepponen Oct 1985 A
4548208 Niemi Oct 1985 A
4571834 Fraser et al. Feb 1986 A
4572198 Codrington Feb 1986 A
4583538 Onik et al. Apr 1986 A
4584577 Temple Apr 1986 A
4586491 Carpenter May 1986 A
4607619 Seike et al. Aug 1986 A
4608977 Brown Sep 1986 A
4613866 Blood Sep 1986 A
4617925 Laitinen Oct 1986 A
4618978 Cosman Oct 1986 A
4621628 Brudermann Nov 1986 A
4625718 Olerud et al. Dec 1986 A
4638798 Shelden et al. Jan 1987 A
4642786 Hansen Feb 1987 A
4645343 Stockdale et al. Feb 1987 A
4649504 Krouglicof et al. Mar 1987 A
4651732 Frederick Mar 1987 A
4653509 Oloff et al. Mar 1987 A
4659971 Suzuki et al. Apr 1987 A
4660970 Ferrano Apr 1987 A
4669172 Petruzzi Jun 1987 A
4673352 Hansen Jun 1987 A
4688037 Krieg Aug 1987 A
4701049 Beckman et al. Oct 1987 A
4705395 Hageniers Nov 1987 A
4705401 Addleman et al. Nov 1987 A
4706665 Gouda Nov 1987 A
4709156 Murphy et al. Nov 1987 A
4710708 Rorden et al. Dec 1987 A
4719419 Dawley Jan 1988 A
4722056 Roberts et al. Jan 1988 A
4722336 Kim et al. Feb 1988 A
4723544 Moore et al. Feb 1988 A
4727565 Ericson Feb 1988 A
RE32619 Damadian Mar 1988 E
4733969 Case et al. Mar 1988 A
4737032 Addleman et al. Apr 1988 A
4737794 Jones Apr 1988 A
4737921 Goldwasser et al. Apr 1988 A
4742356 Kuipers May 1988 A
4742815 Ninan et al. May 1988 A
4743770 Lee May 1988 A
4743771 Sacks et al. May 1988 A
4745290 Frankel et al. May 1988 A
4750487 Zanetti Jun 1988 A
4753528 Hines et al. Jun 1988 A
4761072 Pryor Aug 1988 A
4764016 Johansson Aug 1988 A
4771787 Wurster et al. Sep 1988 A
4779212 Levy Oct 1988 A
4782239 Hirose et al. Nov 1988 A
4788481 Niwa Nov 1988 A
4791934 Brunnett Dec 1988 A
4793355 Crum et al. Dec 1988 A
4794262 Sato et al. Dec 1988 A
4797907 Anderton Jan 1989 A
4803976 Frigg et al. Feb 1989 A
4804261 Kirschen Feb 1989 A
4805615 Carol Feb 1989 A
4809679 Shimonaka et al. Mar 1989 A
4809694 Ferrara Mar 1989 A
4821200 Oberg Apr 1989 A
4821206 Arora Apr 1989 A
4821731 Martinelli et al. Apr 1989 A
4822163 Schmidt Apr 1989 A
4825091 Breyer et al. Apr 1989 A
4829373 Leberl et al. May 1989 A
4836778 Baumrind et al. Jun 1989 A
4838265 Cosman et al. Jun 1989 A
4841967 Chang et al. Jun 1989 A
4845771 Wislocki et al. Jul 1989 A
4849692 Blood Jul 1989 A
4860331 Williams et al. Aug 1989 A
4862893 Martinelli Sep 1989 A
4869247 Howard, III et al. Sep 1989 A
4875165 Fencil et al. Oct 1989 A
4875478 Chen Oct 1989 A
4884566 Mountz et al. Dec 1989 A
4889526 Rauscher et al. Dec 1989 A
4896673 Rose et al. Jan 1990 A
4905698 Strohl, Jr. et al. Mar 1990 A
4923459 Nambu May 1990 A
4931056 Ghajar et al. Jun 1990 A
4945305 Blood Jul 1990 A
4945914 Allen Aug 1990 A
4951653 Fry et al. Aug 1990 A
4951677 Crowley et al. Aug 1990 A
4955891 Carol Sep 1990 A
4961422 Marchosky et al. Oct 1990 A
4977655 Martinelli Dec 1990 A
4989608 Ratner Feb 1991 A
4991579 Allen Feb 1991 A
4994069 Ritchart et al. Feb 1991 A
5002058 Martinelli Mar 1991 A
5005592 Cartmell Apr 1991 A
5013317 Cole et al. May 1991 A
5016639 Allen May 1991 A
5017139 Mushabac May 1991 A
5027818 Bova et al. Jul 1991 A
5030196 Inoue Jul 1991 A
5030222 Calandruccio et al. Jul 1991 A
5031203 Trecha Jul 1991 A
5042486 Pfeiler et al. Aug 1991 A
5047036 Koutrouvelis Sep 1991 A
5050608 Watanabe et al. Sep 1991 A
5054492 Scribner et al. Oct 1991 A
5057095 Fabian Oct 1991 A
5059789 Salcudean Oct 1991 A
5078140 Kwoh Jan 1992 A
5079699 Tuy et al. Jan 1992 A
5086401 Glassman et al. Feb 1992 A
5094241 Allen Mar 1992 A
5097839 Allen Mar 1992 A
5098426 Sklar et al. Mar 1992 A
5099845 Besz et al. Mar 1992 A
5099846 Hardy Mar 1992 A
5104393 Isner et al. Apr 1992 A
5105829 Fabian et al. Apr 1992 A
5107839 Houdek et al. Apr 1992 A
5107843 Aamio et al. Apr 1992 A
5107862 Fabian et al. Apr 1992 A
5109194 Cantaloube Apr 1992 A
5119817 Allen Jun 1992 A
5142930 Allen et al. Sep 1992 A
5143076 Hardy et al. Sep 1992 A
5152288 Hoenig et al. Oct 1992 A
5160337 Cosman Nov 1992 A
5161536 Vilkomerson et al. Nov 1992 A
5178164 Allen Jan 1993 A
5178621 Cook et al. Jan 1993 A
5186174 Schlondorff et al. Feb 1993 A
5187475 Wagener et al. Feb 1993 A
5188126 Fabian et al. Feb 1993 A
5190059 Fabian et al. Mar 1993 A
5193106 DeSena Mar 1993 A
5197476 Nowacki et al. Mar 1993 A
5197965 Cherry et al. Mar 1993 A
5198768 Keren Mar 1993 A
5198877 Schulz Mar 1993 A
5207688 Carol May 1993 A
5211164 Allen May 1993 A
5211165 Dumoulin et al. May 1993 A
5211176 Ishiguro et al. May 1993 A
5212720 Landi et al. May 1993 A
5214615 Bauer May 1993 A
5219351 Teubner et al. Jun 1993 A
5222499 Allen et al. Jun 1993 A
5224049 Mushabac Jun 1993 A
5228442 Imran Jul 1993 A
5230338 Allen et al. Jul 1993 A
5230622 Brossoit Jul 1993 A
5230623 Guthrie et al. Jul 1993 A
5233990 Bamea Aug 1993 A
5237996 Waldman et al. Aug 1993 A
5249581 Horbal et al. Oct 1993 A
5251127 Raab Oct 1993 A
5251635 Dumoulin et al. Oct 1993 A
5253647 Takahashi et al. Oct 1993 A
5255680 Darrow et al. Oct 1993 A
5257636 White Nov 1993 A
5257998 Ota et al. Nov 1993 A
5261404 Mick et al. Nov 1993 A
5265610 Darrow et al. Nov 1993 A
5265611 Hoenig et al. Nov 1993 A
5269759 Hernandez et al. Dec 1993 A
5271400 Dumoulin et al. Dec 1993 A
5273025 Sakiyama et al. Dec 1993 A
5274551 Corby, Jr. Dec 1993 A
5279309 Taylor et al. Jan 1994 A
5285787 Machida Feb 1994 A
5291199 Overman et al. Mar 1994 A
5291889 Kenet et al. Mar 1994 A
5295483 Nowacki et al. Mar 1994 A
5297549 Beatty et al. Mar 1994 A
5299253 Wessels Mar 1994 A
5299254 Dancer et al. Mar 1994 A
5299288 Glassman et al. Mar 1994 A
5300080 Clayman et al. Apr 1994 A
5301061 Nakada et al. Apr 1994 A
5305091 Gelbart et al. Apr 1994 A
5305203 Raab Apr 1994 A
5306271 Zinreich et al. Apr 1994 A
5307072 Jones, Jr. Apr 1994 A
5309913 Kormos et al. May 1994 A
5315630 Sturm et al. May 1994 A
5316024 Hirschi et al. May 1994 A
5318025 Dumoulin et al. Jun 1994 A
5320111 Livingston Jun 1994 A
5325728 Zimmerman et al. Jul 1994 A
5325873 Hirschi et al. Jul 1994 A
5329944 Fabian et al. Jul 1994 A
5330485 Clayman et al. Jul 1994 A
5333168 Fernandes et al. Jul 1994 A
5353795 Souza et al. Oct 1994 A
5353800 Pohndorf et al. Oct 1994 A
5353807 DeMarco Oct 1994 A
5359417 Muller et al. Oct 1994 A
5368030 Zinreich et al. Nov 1994 A
5371778 Yanof et al. Dec 1994 A
5375596 Twiss et al. Dec 1994 A
5377678 Dumoulin et al. Jan 1995 A
5380302 Orth Jan 1995 A
5383454 Bucholz Jan 1995 A
5383852 Stevens-Wright Jan 1995 A
5385146 Goldreyer Jan 1995 A
5385148 Lesh et al. Jan 1995 A
5386828 Owens et al. Feb 1995 A
5389101 Heilbrun et al. Feb 1995 A
5391199 Ben-Haim Feb 1995 A
5394457 Leibinger et al. Feb 1995 A
5394875 Lewis et al. Mar 1995 A
5397329 Allen Mar 1995 A
5398684 Hardy Mar 1995 A
5399146 Nowacki et al. Mar 1995 A
5400384 Fernandes et al. Mar 1995 A
5402801 Taylor Apr 1995 A
5408409 Glassman et al. Apr 1995 A
5413573 Koivukangas May 1995 A
5417210 Funda et al. May 1995 A
5419325 Dumoulin et al. May 1995 A
5423334 Jordan Jun 1995 A
5425367 Shapiro et al. Jun 1995 A
5425382 Golden et al. Jun 1995 A
5426683 O'Farrell, Jr. et al. Jun 1995 A
5426687 Goodall et al. Jun 1995 A
5427097 Depp Jun 1995 A
5429132 Guy et al. Jul 1995 A
5433198 Desai Jul 1995 A
RE35025 Anderton Aug 1995 E
5437277 Dumoulin et al. Aug 1995 A
5443066 Dumoulin et al. Aug 1995 A
5443489 Ben-Haim Aug 1995 A
5444756 Pai et al. Aug 1995 A
5445144 Wodicka et al. Aug 1995 A
5445150 Dumoulin et al. Aug 1995 A
5445166 Taylor Aug 1995 A
5446548 Gerig et al. Aug 1995 A
5447154 Cinquin et al. Sep 1995 A
5448610 Yamamoto et al. Sep 1995 A
5453686 Anderson Sep 1995 A
5456718 Szymaitis Oct 1995 A
5457641 Zimmer et al. Oct 1995 A
5458718 Venkitachalam Oct 1995 A
5464446 Dreessen et al. Nov 1995 A
5469847 Zinreich et al. Nov 1995 A
5474075 Goldberg et al. Dec 1995 A
5478341 Cook et al. Dec 1995 A
5478343 Ritter Dec 1995 A
5480422 Ben-Haim Jan 1996 A
5480439 Bisek et al. Jan 1996 A
5483961 Kelly et al. Jan 1996 A
5485849 Panescu et al. Jan 1996 A
5487391 Panescu Jan 1996 A
5487729 Avellanet et al. Jan 1996 A
5487757 Truckai et al. Jan 1996 A
5489256 Adair Feb 1996 A
5490196 Rudich et al. Feb 1996 A
5494034 Schlondorff et al. Feb 1996 A
5503416 Aoki et al. Apr 1996 A
5506102 McDonnell Apr 1996 A
5513637 Twiss et al. May 1996 A
5514146 Lam et al. May 1996 A
5515160 Schulz et al. May 1996 A
5517990 Kalfas et al. May 1996 A
5522815 Durgin, Jr. et al. Jun 1996 A
5531227 Schneider Jul 1996 A
5531520 Grimson et al. Jul 1996 A
5542938 Avellanet et al. Aug 1996 A
5543951 Moehrmann Aug 1996 A
5546940 Panescu et al. Aug 1996 A
5546949 Frazin et al. Aug 1996 A
5546951 Ben-Haim Aug 1996 A
5551429 Fitzpatrick et al. Sep 1996 A
5558091 Acker et al. Sep 1996 A
5566681 Manwaring et al. Oct 1996 A
5568384 Robb et al. Oct 1996 A
5568809 Ben-haim Oct 1996 A
5571083 Lemelson Nov 1996 A
5572999 Funda et al. Nov 1996 A
5573493 Sauer et al. Nov 1996 A
5573533 Strul Nov 1996 A
5575794 Walus et al. Nov 1996 A
5575798 Koutrouvelis Nov 1996 A
5577991 Akui et al. Nov 1996 A
5583909 Hanover Dec 1996 A
5588430 Bova et al. Dec 1996 A
5590215 Allen Dec 1996 A
5592939 Martinelli Jan 1997 A
5595193 Walus et al. Jan 1997 A
5596228 Anderton et al. Jan 1997 A
5600330 Blood Feb 1997 A
5603318 Heilbrun et al. Feb 1997 A
5611025 Lorensen et al. Mar 1997 A
5617462 Spratt Apr 1997 A
5617857 Chader et al. Apr 1997 A
5619261 Anderton Apr 1997 A
5622169 Golden et al. Apr 1997 A
5622170 Schulz Apr 1997 A
5627873 Hanover et al. May 1997 A
5628315 Vilsmeier et al. May 1997 A
5630431 Taylor May 1997 A
5636644 Hart et al. Jun 1997 A
5638819 Manwaring et al. Jun 1997 A
5640170 Anderson Jun 1997 A
5642395 Anderton et al. Jun 1997 A
5643175 Adair Jul 1997 A
5643268 Vilsmeier et al. Jul 1997 A
5645065 Shapiro et al. Jul 1997 A
5646524 Gilboa Jul 1997 A
5646525 Gilboa Jul 1997 A
5647361 Damadian Jul 1997 A
5662111 Cosman Sep 1997 A
5664001 Tachibana et al. Sep 1997 A
5674296 Bryan et al. Oct 1997 A
5676673 Ferre et al. Oct 1997 A
5681260 Ueda et al. Oct 1997 A
5682886 Delp et al. Nov 1997 A
5682890 Kormos et al. Nov 1997 A
5690108 Chakeres Nov 1997 A
5694945 Ben-Haim Dec 1997 A
5695500 Taylor et al. Dec 1997 A
5695501 Carol et al. Dec 1997 A
5696500 Diem Dec 1997 A
5697377 Wittkampf Dec 1997 A
5700236 Sauer et al. Dec 1997 A
5702406 Vilsmeier et al. Dec 1997 A
5711299 Manwaring et al. Jan 1998 A
5713853 Clark et al. Feb 1998 A
5713946 Ben-Haim Feb 1998 A
5715822 Watkins et al. Feb 1998 A
5715836 Kliegis et al. Feb 1998 A
5718241 Ben-Haim et al. Feb 1998 A
5727552 Ryan Mar 1998 A
5727553 Saad Mar 1998 A
5728047 Edoga Mar 1998 A
5729129 Acker Mar 1998 A
5730129 Darrow et al. Mar 1998 A
5730130 Fitzpatrick et al. Mar 1998 A
5732703 Kalfas et al. Mar 1998 A
5735278 Hoult et al. Apr 1998 A
5738096 Ben-Haim Apr 1998 A
5740802 Natis et al. Apr 1998 A
5741214 Ouchi et al. Apr 1998 A
5742394 Hansen Apr 1998 A
5744953 Hansen Apr 1998 A
5748767 Raab May 1998 A
5749362 Funda et al. May 1998 A
5749835 Glantz May 1998 A
5752513 Acker et al. May 1998 A
5755725 Druais May 1998 A
RE35816 Schulz Jun 1998 E
5758667 Slettenmark Jun 1998 A
5762064 Polvani Jun 1998 A
5767669 Hansen et al. Jun 1998 A
5767699 Bosnyak et al. Jun 1998 A
5767960 Orman Jun 1998 A
5769789 Wang et al. Jun 1998 A
5769843 Abela et al. Jun 1998 A
5769861 Vilsmeier Jun 1998 A
5772594 Barrick Jun 1998 A
5775322 Silverstein et al. Jul 1998 A
5776064 Kalfas et al. Jul 1998 A
5782765 Jonkman Jul 1998 A
5787886 Kelly et al. Aug 1998 A
5792055 McKinnon Aug 1998 A
5795294 Luber et al. Aug 1998 A
5797849 Vesely et al. Aug 1998 A
5799055 Peshkin et al. Aug 1998 A
5799099 Wang et al. Aug 1998 A
5800352 Ferre et al. Sep 1998 A
5800535 Howard, III Sep 1998 A
5802719 O'Farrell, Jr. et al. Sep 1998 A
5803089 Ferre et al. Sep 1998 A
5807252 Hassfeld et al. Sep 1998 A
5810008 Dekel et al. Sep 1998 A
5810728 Kuhn Sep 1998 A
5810735 Halperin et al. Sep 1998 A
5820553 Hughes Oct 1998 A
5823192 Kalend et al. Oct 1998 A
5823958 Truppe Oct 1998 A
5828725 Levinson Oct 1998 A
5828770 Leis et al. Oct 1998 A
5829444 Ferre et al. Nov 1998 A
5831260 Hansen Nov 1998 A
5833608 Acker Nov 1998 A
5834759 Glossop Nov 1998 A
5836954 Heilbrun et al. Nov 1998 A
5840024 Taniguchi et al. Nov 1998 A
5840025 Ben-Haim Nov 1998 A
5843051 Adams et al. Dec 1998 A
5843076 Webster, Jr. et al. Dec 1998 A
5846183 Chilcoat Dec 1998 A
5848967 Cosman Dec 1998 A
5851183 Bucholz Dec 1998 A
5865726 Katsurada et al. Feb 1999 A
5865846 Bryan et al. Feb 1999 A
5868674 Glowinski et al. Feb 1999 A
5868675 Henrion et al. Feb 1999 A
5871445 Bucholz Feb 1999 A
5871455 Ueno Feb 1999 A
5871487 Warner et al. Feb 1999 A
5873822 Ferre et al. Feb 1999 A
5879499 Corvi Mar 1999 A
5882304 Ehnholm et al. Mar 1999 A
5884410 Prinz Mar 1999 A
5889834 Vilsmeier et al. Mar 1999 A
5891034 Bucholz Apr 1999 A
5891157 Day et al. Apr 1999 A
5893885 Webster, Jr. Apr 1999 A
5904691 Barnett et al. May 1999 A
5907395 Schulz et al. May 1999 A
5913820 Bladen et al. Jun 1999 A
5920395 Schulz Jul 1999 A
5921992 Costales et al. Jul 1999 A
5923727 Navab Jul 1999 A
5928248 Acker Jul 1999 A
5935160 Auricchio et al. Aug 1999 A
5938603 Ponzi Aug 1999 A
5938694 Jaraczewski et al. Aug 1999 A
5947925 Ashiya et al. Sep 1999 A
5947980 Jensen et al. Sep 1999 A
5947981 Cosman Sep 1999 A
5950629 Taylor et al. Sep 1999 A
5951475 Gueziec et al. Sep 1999 A
5951571 Audette Sep 1999 A
5954647 Bova et al. Sep 1999 A
5954796 McCarty et al. Sep 1999 A
5957844 Dekel et al. Sep 1999 A
5967980 Ferre et al. Oct 1999 A
5967982 Barnett Oct 1999 A
5968047 Reed Oct 1999 A
5971997 Guthrie et al. Oct 1999 A
5976156 Taylor et al. Nov 1999 A
5980535 Bamett et al. Nov 1999 A
5983126 Wittkampf Nov 1999 A
5987349 Schulz Nov 1999 A
5987960 Messner et al. Nov 1999 A
5999837 Messner et al. Dec 1999 A
5999840 Grimson et al. Dec 1999 A
6001130 Bryan et al. Dec 1999 A
6004269 Crowley et al. Dec 1999 A
6006126 Cosman Dec 1999 A
6006127 Van Der Brug et al. Dec 1999 A
6013087 Adams et al. Jan 2000 A
6014580 Blume et al. Jan 2000 A
6016439 Acker Jan 2000 A
6019725 Vesely et al. Feb 2000 A
6024695 Taylor et al. Feb 2000 A
6035229 Silverstein et al. Mar 2000 A
6050724 Schmitz et al. Apr 2000 A
6059718 Taniguchi et al. May 2000 A
6061588 Thornton et al. May 2000 A
6063022 Ben-Haim May 2000 A
6071288 Carol et al. Jun 2000 A
6073043 Schneider Jun 2000 A
6076008 Bucholz Jun 2000 A
6086529 Arndt Jul 2000 A
6096050 Audette Aug 2000 A
6104944 Martinelli Aug 2000 A
6112111 Glantz Aug 2000 A
6117070 Akiba Sep 2000 A
6118845 Simon et al. Sep 2000 A
6122538 Sliwa, Jr. et al. Sep 2000 A
6122541 Cosman et al. Sep 2000 A
6131396 Duerr et al. Oct 2000 A
6139183 Graumann Oct 2000 A
6147480 Osadchy et al. Nov 2000 A
6149592 Yanof et al. Nov 2000 A
6156067 Bryan et al. Dec 2000 A
6161032 Acker Dec 2000 A
6165181 Heilbrun et al. Dec 2000 A
6167296 Shahidi Dec 2000 A
6172499 Ashe Jan 2001 B1
6175756 Ferre et al. Jan 2001 B1
6178345 Vilsmeier et al. Jan 2001 B1
6183444 Glines et al. Feb 2001 B1
6188355 Gilboa Feb 2001 B1
6192280 Sommer et al. Feb 2001 B1
6194639 Botella et al. Feb 2001 B1
6200262 Ouchi Mar 2001 B1
6201387 Govari Mar 2001 B1
6203493 Ben-Haim Mar 2001 B1
6203497 Dekel et al. Mar 2001 B1
6210362 Ponzi Apr 2001 B1
6210378 Ouchi Apr 2001 B1
6211666 Acker Apr 2001 B1
6213995 Steen et al. Apr 2001 B1
6216027 Willis et al. Apr 2001 B1
6223067 Vilsmeier et al. Apr 2001 B1
6226543 Gilboa et al. May 2001 B1
6233476 Strommer et al. May 2001 B1
6236875 Bucholz et al. May 2001 B1
6246231 Ashe Jun 2001 B1
6246784 Summers et al. Jun 2001 B1
6253770 Acker et al. Jul 2001 B1
6259942 Westermann et al. Jul 2001 B1
6273896 Franck et al. Aug 2001 B1
6285902 Kienzle, III et al. Sep 2001 B1
6298262 Franck et al. Oct 2001 B1
6314310 Ben-Haim et al. Nov 2001 B1
6319250 Falwell et al. Nov 2001 B1
6332089 Acker et al. Dec 2001 B1
6335617 Osadchy et al. Jan 2002 B1
6341231 Ferre et al. Jan 2002 B1
6345112 Summers et al. Feb 2002 B1
6351659 Vilsmeier Feb 2002 B1
6366799 Acker et al. Apr 2002 B1
6373240 Govari Apr 2002 B1
6381485 Hunter et al. Apr 2002 B1
6423009 Downey et al. Jul 2002 B1
6424856 Vilsmeier et al. Jul 2002 B1
6427314 Acker Aug 2002 B1
6428547 Vilsmeier et al. Aug 2002 B1
6434415 Foley et al. Aug 2002 B1
6437567 Schenck et al. Aug 2002 B1
6443894 Sumanaweera et al. Sep 2002 B1
6445943 Ferre et al. Sep 2002 B1
6447504 Ben-Haim et al. Sep 2002 B1
6453190 Acker et al. Sep 2002 B1
6468265 Evans et al. Oct 2002 B1
6470207 Simon et al. Oct 2002 B1
6474341 Hunter et al. Nov 2002 B1
6478802 Kienzle, III et al. Nov 2002 B2
6484049 Seeley et al. Nov 2002 B1
6484118 Govari Nov 2002 B1
6490475 Seeley et al. Dec 2002 B1
6493573 Martinelli et al. Dec 2002 B1
6498944 Ben-Haim et al. Dec 2002 B1
6499488 Hunter et al. Dec 2002 B1
6516046 Frohlich et al. Feb 2003 B1
6527443 Vilsmeier et al. Mar 2003 B1
6551325 Neubauer et al. Apr 2003 B2
6580938 Acker Jun 2003 B1
6584174 Schubert et al. Jun 2003 B2
6585639 Kotmel et al. Jul 2003 B1
6591129 Ben-Haim et al. Jul 2003 B1
6593884 Gilboa et al. Jul 2003 B1
6609022 Vilsmeier et al. Aug 2003 B2
6611700 Vilsmeier et al. Aug 2003 B1
6615155 Gilboa Sep 2003 B2
6618612 Acker et al. Sep 2003 B1
6640128 Vilsmeier et al. Oct 2003 B2
6650927 Keidar Nov 2003 B1
6666864 Bencini et al. Dec 2003 B2
6676659 Hutchins et al. Jan 2004 B2
6690963 Ben-Haim et al. Feb 2004 B2
6694162 Hartlep Feb 2004 B2
6701179 Martinelli et al. Mar 2004 B1
6711429 Gilboa et al. Mar 2004 B1
6712842 Gifford, III et al. Mar 2004 B1
6751492 Ben-Haim Jun 2004 B2
6770027 Banik et al. Aug 2004 B2
6788967 Ben-Haim et al. Sep 2004 B2
6796963 Carpenter et al. Sep 2004 B2
6846286 Suzuki et al. Jan 2005 B2
6947788 Gilboa et al. Sep 2005 B2
6960161 Amling et al. Nov 2005 B2
6995729 Govari et al. Feb 2006 B2
7022066 Yokoi et al. Apr 2006 B2
7101380 Khachin et al. Sep 2006 B2
7182756 Saeed et al. Feb 2007 B2
7197354 Sobe Mar 2007 B2
7233820 Gilboa Jun 2007 B2
7236567 Sandkamp et al. Jun 2007 B2
7286868 Govari Oct 2007 B2
7301332 Govari et al. Nov 2007 B2
7321228 Govari Jan 2008 B2
7324915 Altmann et al. Jan 2008 B2
7343195 Strommer et al. Mar 2008 B2
7353125 Nieminen et al. Apr 2008 B2
7357795 Kaji et al. Apr 2008 B2
7366562 Dukesherer et al. Apr 2008 B2
7370656 Gleich et al. May 2008 B2
7373271 Schneider May 2008 B1
7386339 Strommer et al. Jun 2008 B2
7397364 Govari Jul 2008 B2
7399296 Poole et al. Jul 2008 B2
7497029 Plassky et al. Mar 2009 B2
7505809 Strommer et al. Mar 2009 B2
7536218 Govari et al. May 2009 B2
RE40852 Martinelli et al. Jul 2009 E
7570987 Raabe et al. Aug 2009 B2
7577474 Vilsmeier Aug 2009 B2
7579837 Fath et al. Aug 2009 B2
7587235 Wist et al. Sep 2009 B2
7599535 Kiraly et al. Oct 2009 B2
7599810 Yamazaki Oct 2009 B2
7630753 Simon et al. Dec 2009 B2
7634122 Bertram et al. Dec 2009 B2
7636595 Marquart et al. Dec 2009 B2
7641609 Ohnishi et al. Jan 2010 B2
7648458 Niwa et al. Jan 2010 B2
7652468 Kruger et al. Jan 2010 B2
7657300 Hunter et al. Feb 2010 B2
7659912 Akimoto et al. Feb 2010 B2
7660623 Hunter et al. Feb 2010 B2
7680528 Pfister et al. Mar 2010 B2
7684849 Wright et al. Mar 2010 B2
7686767 Maschke Mar 2010 B2
7688064 Shalgi et al. Mar 2010 B2
7696899 Immerz et al. Apr 2010 B2
7697972 Verard et al. Apr 2010 B2
7697973 Strommer et al. Apr 2010 B2
7697974 Jenkins et al. Apr 2010 B2
7720517 Drysen May 2010 B2
7722565 Wood et al. May 2010 B2
7725154 Beck et al. May 2010 B2
7725164 Suurmond et al. May 2010 B2
7727269 Abraham-Fuchs et al. Jun 2010 B2
7729742 Govari Jun 2010 B2
7744605 Vilsmeier et al. Jun 2010 B2
7747307 Wright et al. Jun 2010 B2
7751865 Jascob et al. Jul 2010 B2
7998062 Gilboa Aug 2011 B2
8190238 Moll et al. May 2012 B2
8828201 Simpson Sep 2014 B2
8932207 Greenburg et al. Jan 2015 B2
20010007918 Vilsmeier et al. Jul 2001 A1
20010007925 Ritchart et al. Jul 2001 A1
20010031919 Strommer et al. Oct 2001 A1
20010034530 Malackowski et al. Oct 2001 A1
20010036245 Kienzle et al. Nov 2001 A1
20020026097 Akiba Feb 2002 A1
20020067408 Adair et al. Jun 2002 A1
20020087100 Onuki et al. Jul 2002 A1
20020095081 Vilsmeier Jul 2002 A1
20020128565 Rudy Sep 2002 A1
20020137014 Anderson et al. Sep 2002 A1
20020162555 West et al. Nov 2002 A1
20020165503 Morris et al. Nov 2002 A1
20020173689 Kaplan Nov 2002 A1
20020193686 Gilboa Dec 2002 A1
20030018251 Solomon Jan 2003 A1
20030028096 Niwa et al. Feb 2003 A1
20030040657 Yamaya et al. Feb 2003 A1
20030074011 Gilboa et al. Apr 2003 A1
20030086599 Armato et al. May 2003 A1
20030114742 Lewkowicz et al. Jun 2003 A1
20030142753 Gunday Jul 2003 A1
20030160721 Gilboa et al. Aug 2003 A1
20030171653 Yokoi et al. Sep 2003 A1
20030227547 Iddan Dec 2003 A1
20040015049 Zaar Jan 2004 A1
20040024309 Ferre et al. Feb 2004 A1
20040086161 Sivaramakrishna et al. May 2004 A1
20040097804 Sobe May 2004 A1
20040138548 Strommer et al. Jul 2004 A1
20040169509 Czipott et al. Sep 2004 A1
20040249267 Gilboa Dec 2004 A1
20040260201 Mueller Dec 2004 A1
20050022993 Wilson et al. Feb 2005 A1
20050033149 Strommer et al. Feb 2005 A1
20050075680 Lowry Apr 2005 A1
20050080342 Gilreath et al. Apr 2005 A1
20050085715 Dukesherer et al. Apr 2005 A1
20050107688 Strommer May 2005 A1
20050119527 Banik et al. Jun 2005 A1
20050197566 Strommer et al. Sep 2005 A1
20050229934 Willeford Oct 2005 A1
20060015126 Sher Jan 2006 A1
20060058647 Strommer et al. Mar 2006 A1
20060064006 Strommer et al. Mar 2006 A1
20060069313 Couvillon et al. Mar 2006 A1
20060149134 Soper et al. Jul 2006 A1
20070015964 Eversull et al. Jan 2007 A1
20070163597 Mikkaichi et al. Jul 2007 A1
20070167714 Kiraly et al. Jul 2007 A1
20070167738 Timinger et al. Jul 2007 A1
20070167743 Honda et al. Jul 2007 A1
20070167806 Wood et al. Jul 2007 A1
20070197896 Moll et al. Aug 2007 A1
20070225559 Clerc et al. Sep 2007 A1
20070265639 Danek et al. Nov 2007 A1
20070287901 Strommer et al. Dec 2007 A1
20070293721 Gilboa Dec 2007 A1
20080086051 Voegele Apr 2008 A1
20080097187 Gielen et al. Apr 2008 A1
20080118135 Averbuch et al. May 2008 A1
20080125760 Gilboa May 2008 A1
20080132757 Tgavalekos Jun 2008 A1
20080132909 Jascob et al. Jun 2008 A1
20080132911 Sobe Jun 2008 A1
20080139886 Tatsuyama Jun 2008 A1
20080139915 Dolan et al. Jun 2008 A1
20080144909 Wiemker et al. Jun 2008 A1
20080147000 Seibel et al. Jun 2008 A1
20080154172 Mauch Jun 2008 A1
20080157755 Kruger et al. Jul 2008 A1
20080161682 Kendrick et al. Jul 2008 A1
20080162074 Schneider Jul 2008 A1
20080183071 Strommer et al. Jul 2008 A1
20080188749 Rasche et al. Aug 2008 A1
20090182224 Shmarak et al. Jul 2009 A1
20090234223 Onoda et al. Sep 2009 A1
20100016757 Greenburg et al. Jan 2010 A1
20110207997 Greenburg et al. Aug 2011 A1
20120150022 Bar-Tal et al. Jun 2012 A1
20130066194 Seter Mar 2013 A1
Foreign Referenced Citations (102)
Number Date Country
964149 Mar 1975 CA
3042343 Jun 1982 DE
3508730 Sep 1986 DE
3520782 Dec 1986 DE
3717871 Dec 1988 DE
3831278 Mar 1989 DE
3838011 Jul 1989 DE
4213426 Oct 1992 DE
4225112 Dec 1993 DE
4233978 Apr 1994 DE
19610984 Sep 1997 DE
19715202 Oct 1998 DE
19751761 Oct 1998 DE
19832296 Feb 1999 DE
19747427 May 1999 DE
10085137 Nov 2002 DE
0062941 Oct 1982 EP
0119660 Sep 1984 EP
0155857 Sep 1985 EP
0319844 Jun 1989 EP
0326768 Aug 1989 EP
0350996 Jan 1990 EP
0419729 Apr 1991 EP
0427358 May 1991 EP
0456103 Nov 1991 EP
0581704 Feb 1994 EP
0600610 Jun 1994 EP
0651968 May 1995 EP
0796633 Sep 1997 EP
0857461 Aug 1998 EP
0894473 Feb 1999 EP
0908146 Apr 1999 EP
0 922 966 Jun 1999 EP
0930046 Jul 1999 EP
1078644 Feb 2001 EP
1255113 Nov 2002 EP
2096523 Sep 2009 EP
2755554 Jul 2014 EP
2417970 Sep 1979 FR
2618211 Jan 1989 FR
2094590 Sep 1982 GB
2164856 Apr 1986 GB
63-240851 Oct 1988 JP
03-267054 Nov 1991 JP
06194639 Jul 1994 JP
07-043619 Feb 1995 JP
10-197807 Jul 1998 JP
2000-075218 Mar 2000 JP
8809151 Dec 1988 WO
8905123 Jun 1989 WO
9005494 May 1990 WO
9103982 Apr 1991 WO
9104711 Apr 1991 WO
9107726 May 1991 WO
9203090 Mar 1992 WO
9206645 Apr 1992 WO
9404938 Mar 1994 WO
9423647 Oct 1994 WO
9424933 Nov 1994 WO
9507055 Mar 1995 WO
9605768 Feb 1996 WO
9611624 Apr 1996 WO
9632059 Oct 1996 WO
9729682 Aug 1997 WO
9729684 Aug 1997 WO
9736192 Oct 1997 WO
9749453 Dec 1997 WO
9808554 Mar 1998 WO
9838908 Sep 1998 WO
9915097 Apr 1999 WO
9921498 May 1999 WO
9923956 May 1999 WO
9926549 Jun 1999 WO
9927839 Jun 1999 WO
9929253 Jun 1999 WO
9932033 Jul 1999 WO
9933406 Jul 1999 WO
9937208 Jul 1999 WO
9938449 Aug 1999 WO
9952094 Oct 1999 WO
9960939 Dec 1999 WO
0006701 Feb 2000 WO
0010456 Mar 2000 WO
0016684 Mar 2000 WO
0035531 Jun 2000 WO
0130437 May 2001 WO
0167035 Sep 2001 WO
0187136 Nov 2001 WO
0187398 Nov 2001 WO
0191842 Dec 2001 WO
0224054 Mar 2002 WO
02064011 Aug 2002 WO
02070047 Sep 2002 WO
03086498 Oct 2003 WO
2004023986 Mar 2004 WO
2005025635 Mar 2005 WO
2007033379 Mar 2007 WO
2013038354 Mar 2013 WO
2013056006 Apr 2013 WO
201398715 Jul 2013 WO
2014061354 Apr 2014 WO
2015116687 Aug 2015 WO
Non-Patent Literature Citations (6)
Entry
McKenna, N.J. et al., “Nuclear Receptor Coregulators: Cellular and Molecular Biology,” Endocrine Reviews 20(3): 321-344, Jun. 1, 1999, 24 pages.
Ding, X.F. et al., “Nuclear Receptor-Binding Sites of Coactivators Glucocorticoid Receptor Interacting Protein 1 (GRIP1) and Steroid Receptor Coactivator 1 (SRC-1): Multiple Motifs with Different Binding Specificities,” Molecular Endocrinology12:302-313, Feb. 1, 1998 (9 pages).
Stenoien, D.L. et al., “Ligand-Mediated Assembly and Real-Time Cellular Dynamics of Estrogen Receptor .alpha.-Coactivator Complexes in Living Cells,” Molecular and Cellular Biology, Jul. 2001, pp. 4404-4412, 9 pages.
International Search Report and Written Opinion from Appl. No. PCT/US2016/033063 dated Aug. 16, 2016.
Chinese Office Action dated Jan. 7, 2019 issued in corresponding CN Appln. No. 2016800320825. (Summary only).
Extended European Search Report issued in corresponding Appl. No. EP 16803978.2 dated Feb. 21, 2019 (8 pages).
Related Publications (1)
Number Date Country
20160354160 A1 Dec 2016 US
Provisional Applications (1)
Number Date Country
62170383 Jun 2015 US