Patent Application
20110318585
1. Technical Field
The present disclosure relates to metal-and-resin composites, particularly to a metal-and-resin composite having high bonding strength and a method for making the composite.
2. Description of Related Art
Adhesives, for combining heterogeneous materials in the form of a metal and a synthetic resin are demanded in a wide variety of technical fields and industries, such as the automotive and household appliance fields. However, adhesives are generally only effective in a narrow temperature range of about −50° C. to about 100° C., which means that they are not suitable for applications where operating or environmental temperatures may fall outside the range.
Therefore, other bonding methods have been applied that do not involve the use of an adhesive. One example of such methods is by forming bonds through injection molding or other similar process. However, the bonding strength of the metal and resin can be improved.
Therefore, there is room for improvement within the art.
Many aspects of the metal-and-resin composite can be better understood with reference to the following figures. The components in the figures are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the metal-and-resin composite. Moreover, in the drawings like reference numerals designate corresponding parts throughout the several views.
The metal substrate 11 may be made of aluminum alloy, magnesium alloy, stainless steel, copper, or copper alloy.
The antioxidant film 12 may be an organic film. The antioxidant film 12 is used for protecting the metal substrate 11 from oxidation. Oxidation may affect bonding force between the resin compositions 13 and the substrate 11.
The resin compositions 13 may be coupled to the substrate 11 and the antioxidant film 12 by molding. During the molding process, molten resin coats surface of the antioxidant film 12 and fills the nano-pores 111, thus strongly bonding the resin compositions 13 to the antioxidant film 12 and the substrate 11. Compared to the conventional injection molding wherein the metal substrate is not chemically cleaned to form the nano-pores, the composite 100 in this exemplary embodiment has a much stronger bond between the resin compositions 13 and the substrate 11 (about quintuple the bonding force). The resin compositions 13 may be made up of crystalline thermoplastic synthetic resins having high fluidity. In this exemplary embodiment, composite of polyphenylene sulfide (PPS) and fiberglass (GF), polyamide (PA), polyethylene terephthalate (PET), and polybutylene terephthalate (PBT) can be selected as the molding material for the resin compositions 13, and all of the resin compositions 13 can bond firmly with the antioxidant film 12 and the substrate 11. The fiberglass may have a mass percentage of about 20-50% of the composite of PPS and GF.
A method for making the composite 100 may include the following steps:
The metal substrate 11 is provided. The metal substrate 11 may be made of aluminum alloy, magnesium alloy, stainless steel, copper, or copper alloy.
The metal substrate 11 is chemically cleaned. The chemically cleaning process may include the steps of dewaxing the metal substrate 11, degreasing the metal substrate 11, and removing any oxidation residue that has formed.
Dewaxing the metal substrate 11 may be carried out by dipping the substrate 11 in a dewaxing solution for no less than 5 minutes. The dewaxing solution may be a conventional dewaxing solution. The dewaxing solution in this embodiment may have a concentration of about 30-80 ml/L. The temperature of the dewaxing solution may be about 55° C.-65° C. Once dewaxed, the substrate 11 is removed from the dewaxing solution and rinsed in water.
Degreasing the substrate 11 may be carried out by dipping the substrate 11 in a degreasing solution for about 1-6 minutes. The degreasing solution may be a conventional degreasing solution. The degreasing solution in this embodiment may have a concentration of about 90-150 g/L. The temperature of the degreasing solution may be about 20° C.-30° C. Then, the substrate 11 is removed from the degreasing solution and rinsed in water.
The substrate 11 may oxidize during manufacture. Therefor, a step of removing any residue of oxidation is necessary. The removing process in this embodiment may be carried out by dipping the substrate 11 in an acid eliminating solution for about 1-10 minutes. The acid eliminating solution may be a conventional acid eliminating solution. The acid eliminating solution in this embodiment may have a concentration of about 30-80 ml/L. The temperature of the acid eliminating solution may be about 20° C.-30° C. Next, the substrate 11 is removed from the acid eliminating solution and rinsed in water.
Referring to
Next the substrate 11 is anti-oxidizing treated to form the anti-oxidation film 12. The treatment may include the step of dipping the substrate 11 in an anti-oxidizing solution for about 1-5 minutes. The anti-oxidizing solution may be a conventional anti-oxidizing solution. The temperature of the anti-oxidizing solution may be about 20°C.-30° C. After the anti-oxidizing process, the substrate 11 formed with the anti-oxidation film 12 is rinsed in water and then dried.
Referring to
Tensile strength and shear strength of the composite 100 have been tested. The tests indicate that the tensile strength of the composite 100 is greater than 10 MPa, and the shear strength of the composite 100 is greater than 25 MPa. Furthermore, the composite 100 has been subjected to a temperature humidity bias test (72 hours, 85° C., relative humidity: 85%) and a thermal shock test (48 hours, -−40° C.˜85° C., 4 hours/cycle, 12 cycles total), such tests did not result in decreased tensile strength and shear strength of the composite 100.
It is believed that the exemplary embodiment and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its advantages, the examples hereinbefore described merely being preferred or exemplary embodiment of the disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201010207576.7 | Jun 2010 | CN | national |
