Patent Application
20160010205
This disclosure relates to fluoroelastomer materials and in particular films bearing a conductive metal layer bound to the fluoroelastomer material through a thin layer of titanium.
Briefly, the present disclosure provides a metalized fluoroelastomer material comprising: a) a fluoroelastomer material, bearing b) a layer of titanium metal in direct contact with the fluoroelastomer, and thereupon c) a first metal overlayer in direct contact with the layer of titanium metal, wherein the first metal overlayer comprises a metal selected from the group consisting of copper, noble metals and combinations thereof. In some embodiments, the fluoroelastomer material is a film having a thickness of between 1 micron and 1 millimeter. In some embodiments, the fluoroelastomer material is a perfluorinated fluoroelastomer material. In some embodiments, the layer of titanium metal has a thickness of between 0.5 and 5.0 nm. In some embodiments, the first metal overlayer comprises a metal selected from alloys of copper, silver and gold. In some embodiments, the first metal overlayer is an alloy of copper. In some embodiments, the metalized fluoroelastomer material additionally comprises a metal top layer in direct contact with the metal overlayer having a thickness of at least 2 microns.
In another aspect, the present disclosure provides a method of making a metalized fluoroelastomer material comprising the steps of: a) providing a fluoroelastomer material; b) applying a layer of titanium metal to the fluoroelastomer material by a vapor coating method; and thereafter c) applying a metal overlayer to the fluoroelastomer material by a vapor coating method. In some embodiments, the method additionally comprises, prior to step b), the step of: d) exposing the fluoroelastomer material to an oxygen plasma. In some embodiments, the method additionally comprising, after step c), the step of: e) electroplating the fluoroelastomer material with a metal top layer.
As used herein with regard to a film, “thickness” means average thickness measured orthogonal to the plane of film, regardless of any patterning of the film, and where appropriate may be taken to be the nominal thickness of a film used in the practice of the present disclosure before patterning.
The present disclosure provides metalized fluoroelastomer materials such as fluoroelastomer films and methods of applying metal layers to fluoroelastomer materials.
The metalized fluoroelastomer materials according to the present disclosure may comprise any suitable fluoroelastomer. In some embodiments, the fluoroelastomer material is a fully cured polymer. In some embodiments, the fluoroelastomer material is a polymer of one or more of tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride. In some embodiments, the fluoroelastomer material is perfluorinated. In some embodiments, the fluoroelastomer material is a film. In some embodiments, the film has a thickness of between 1 micron and 1 millimeter. In some embodiments, the film has a thickness of between 10 microns and 1 millimeter. In some embodiments, the film has a thickness of between 10 microns and 100 microns. In some embodiments, the film bears or is patterned with three-dimensional structural features. In some embodiments, the film bears or is patterned with three-dimensional structural features as described in one or more of U.S. patent application Ser. Nos. 12/761162 and 12/761212, the disclosures of which are incorporated herein by reference.
The metalized surface of the fluoroelastomer material bears a layer of titanium in direct contact with the fluoroelastomer material and a first metal overlayer in direct contact with the titanium layer. Typically the layer of titanium has a thickness of between 0.5 and 5.0 nm, more typically between 1.0 and 3.0 nm. The first metal overlayer is copper, bronze, gold, a noble metal or a combination thereof. In some embodiments the first metal overlayer is copper or an alloy thereof. In some embodiments the first metal overlayer is copper. In some embodiments the first metal overlayer is gold or an alloy thereof. In some embodiments the first metal overlayer is gold. In some embodiments the first metal overlayer is silver or an alloy thereof. In some embodiments the first metal overlayer is silver. The metalized fluoroelastomer materials may optionally comprise a second metal overlayer which may be any suitable metal. In some embodiments, the second metal overlayer is copper, bronze, or another alloy of copper. In some embodiments the second metal overlayer is copper.
In some embodiments, the method according to the present invention comprises a first step of treatment with an oxygen plasma.
In some embodiments, the method according to the present invention comprises a second step of vapor coating with titanium, typically following after a first step of treatment with an oxygen plasma. In some embodiments, the second step of vapor coating with titanium is a step of sputter coating with titanium. In some embodiments, the second step of vapor coating with titanium is a step of evaporation coating with titanium.
In some embodiments, the method according to the present invention comprises a third step of vapor coating a first metal overlayer, typically following after a second step of vapor coating with titanium. In some embodiments, the third step of vapor coating with a first metal overlayer is a step of sputter coating with a first metal overlayer. In some embodiments, the third step of vapor coating with a first metal overlayer is a step of evaporation coating with a first metal overlayer. The first metal overlayer is copper, bronze, gold, a noble metal or a combination thereof. In some embodiments the first metal overlayer is copper or an alloy thereof. In some embodiments the first metal overlayer is copper. In some embodiments the first metal overlayer is gold or an alloy thereof. In some embodiments the first metal overlayer is gold. In some embodiments the first metal overlayer is silver or an alloy thereof. In some embodiments the first metal overlayer is silver. In some embodiments, the first metal overlayer has a thickness of between 20 nm and 2 microns. In some embodiments, the first metal overlayer has a thickness of between 100 nm and 500 nm.
In some embodiments, the method according to the present invention comprises a fourth step of applying a second metal overlayer, typically following after a third step of vapor coating a first metal overlayer. In some embodiments, the fourth step is a step of sputter coating with a second metal overlayer. In some embodiments, the fourth step is a step of evaporation coating with a second metal overlayer. In some embodiments, the fourth step is a step of electroplating with a second metal overlayer. The second metal overlayer may be any suitable metal. In some embodiments, the second metal overlayer is copper, bronze, or another alloy of copper. In some embodiments the second metal overlayer is copper. In some embodiments, the second metal overlayer has a thickness of between 20 nm and 2 microns. In some embodiments, the second metal overlayer has a thickness of between 100 nm and 500 nm.
In some embodiments, the method according to the present invention comprises a fifth step of applying a metal top layer, typically following after a third step of vapor coating a first metal overlayer. In some embodiments, the fifth step is a step of electroplating. The metal top layer may be any suitable metal. In some embodiments, the metal top layer is copper, bronze, or another alloy of copper. In some embodiments the metal top layer is copper. In some embodiments, the metal top layer has a thickness of between 20 nm and 2 microns. In some embodiments, the metal top layer has a thickness of greater than 2 microns. In some embodiments, the metal top layer has a thickness of greater than 5 microns. In some embodiments, the metal top layer has a thickness of greater than 10 microns.
The method of the present disclosure may be carried out using roll to roll vacuum processing techniques.
The disclosures of the following patent applications are incorporated herein by reference: U.S. patent application Ser. Nos. 12/637879, 12/637915, 12/761162 and 12/761212.
Objects and advantages of this disclosure are further illustrated by the following examples, but the particular materials and amounts thereof recited in these examples, as well as other conditions and details, should not be construed to unduly limit this disclosure.
Unless otherwise noted, all reagents were obtained or are available from Sigma-Aldrich Company, St. Louis, Mo., or may be synthesized by known methods. Unless otherwise reported, all ratios are by weight percent.
The following abbreviations are used to describe the examples:
A/ft2: Amps per square foot
A/m2: Amps per square meter
° F.: degrees Fahrenheit
° C.: degrees Centigrade
cm: centimeters
cm3/min.: cubic centimeters per minute
g/cm3: grams per cubic centimeter
kg: kilograms
kg/cm: kilograms per centimeter
kPa: kilopascals
kV: kilovolts
lbs/in.: pounds per inch
mA: milliamps
mil: 10−3 inches
mJ/cm2: milliJoules per square centimeter
mm: millimeters
μm: micrometers
W: Watts
A nominally 4 inch by 5 mil (10.16 cm by 127 μm) web of fluoroelastomer film comprising a non-perfluorinated THV polymer was subjected to an oxygen plasma pre-treatment, followed by a titanium tie-coat and then a copper sputter coating according to the conditions listed in Table 1. A total of four replicates were made.
Following copper sputtering, the sample was copper plated to a nominal thickness of 12 μm in a plating solution obtained under the trade designation “COPPER GLEAM CLX” from Dow Chemical Company, Midland, Mich., for 28 minutes at 70° F. (21.1° C.) and 20 A/ft2 (1.86 A/m2). After copper plating, the sample was rinsed with deionized water, dried using compressed air, immersed in a 10% by volume sulfuric acid/3% by volume hydrogen peroxide solution for 30 seconds, and again rinsed with deionized water and dried with compressed air. The sample was then laminated to a dry photoresist film, obtained under the trade designation “WBR 2050” from E.I. DuPont de Nemours and Company, Wilmington, Del., using a model “XRL 120” laminator from Western Magnum Corporation, El Segundo, Calif., at a roller temperature of 200° F. (93.3° C.) and 3 ft/min. (0.91 m/min). A 16 mil (0.41 mm) line photomask was placed over the photoresist film, exposed at 340 mJ/cm2, developed in a “KEPRO” model bench top spray developer containing a 1%/0.1% by weight sodium carbonate/sodium bicarbonate solution for 5 minutes at 70° F. (21.1° C.), after which the sample was rinsed for 1 minute in deionized water and dried using compressed air. The sample was then etched for 6 minutes at 50° C. in a 1.6 Molar copper (II) chloride dehydrate in 1.0 Molar hydrochloric acid solution, rinsed for 1 minute in deionized water and dried using compressed air. After etching, the photoresist was removed by immersing the sample in a 4% by weight potassium hydroxide solution for 3 minutes at 50° C., rinsing in deionized water for one minute and drying with compressed air.
The force required to peel the test material from a substrate at an angle of 90 degrees was measured according to The Institute for Printed Circuits Test Method No. IPS-TM-650 No. 2.4.9.
The non-metal side of the fluoroelastomer film was glued to a microscope slide using an epoxy adhesive, obtained under the trade designation “SCOTCH-WELD EPDXY ADHESIVE 2216” from 3M Company, St. Paul, Minn. One edge of the copper layer was lifted off the microscope slide using a scalpel and attached to the jaws of the peel strength instrument, model “INSTRON 5567” from Illinois Tool Works, Inc., Glenview, Ill. Peel strength was then measured three times per example with a 10 Newton load cell. Results are listed in Table 2.
Various modifications and alterations of this disclosure will become apparent to those skilled in the art without departing from the scope and principles of this disclosure, and it should be understood that this disclosure is not to be unduly limited to the illustrative embodiments set forth hereinabove.
This application is a divisional of U.S. application Ser. No. 14/369,302, filed Jun. 27, 2014, which is a national stage filing under 35 U.S.C. 371 of PCT/US2012/071642, filed Dec. 26, 2012, which claims priority to U.S. Provisional Application No. 61/581,387, filed Dec. 29, 2011, the disclosure of which is incorporated by reference in its/their entirety herein.
| Number | Date | Country | |
|---|---|---|---|
| 61581387 | Dec 2011 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 14369302 | Jun 2014 | US |
| Child | 14859504 | US |
