Claims
- 1. A polishing surface cleaning method for use in a polisher in which a workpiece to be polished is pressed against a polishing surface of a polishing table to polish said workpiece by relative motion between said polishing surface and said workpiece, comprising spraying a fluid mixture on said polishing surface to clean said polishing surface, wherein the fluid mixture includes a gas and a liquid, and wherein the gas is formed by evaporation of the liquid.
- 2. A polishing surface cleaning method for use in a polisher in which a workpiece to be polished is held by a top ring and pressed against a polishing surface of a polishing table to polish the workpiece by relative motion between the polishing surface and said workpiece, comprising spraying a fluid mixture on the polishing surface to clean the polishing surface, wherein said spraying of the fluid mixture starts after polishing of the workpiece has finished and before the top ring is lifted from the polishing surface.
- 3. A polishing surface cleaning method for use in a polisher in which a workpiece to be polished is pressed against a polishing surface of a polishing table to polish the workpiece by relative motion between the polishing surface and the workpiece, comprising spraying a fluid mixture on the polishing surface to clean the polishing surface such that a liquid of the fluid mixture forms a gas by evaporation of the liquid.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2000-47694 |
Feb 2000 |
JP |
|
Parent Case Info
This is a Divisional Application of prior U.S. patent application Ser. No. 09/790,976, filed Feb. 23, 2001 now U.S. Pat. No. 6,443,816.
US Referenced Citations (10)
Foreign Referenced Citations (6)
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19737854 |
Mar 1999 |
DE |
0887153 |
Dec 1998 |
EP |
10-202502 |
Aug 1998 |
JP |
11-10524 |
Jan 1999 |
JP |
2000-354948 |
Dec 2000 |
JP |
9911433 |
Mar 1999 |
WO |