Claims
- 1. An apparatus for a cleaning treatment, comprising:first supply means for supplying a cleaning liquid to a peripheral portion of a liquid crystal device substrate in order to remove a coating film from the peripheral portion of the substrate; a recovering pipe for recovering a used cleaning liquid from the substrate; gas/liquid separation means for separating and removing gas from the recovered liquid through the recovering pipe; a cleaning liquid storing section for storing the cleaning liquid separated by the gas/liquid separation means; a coating mechanism including means for supplying a coating liquid to the substrate, means for rotating the substrate, and a drainage cup surrounding a periphery of a rotating substrate and receiving a coating liquid scattering from the substrate; and second cleaning liquid supply means for supplying the cleaning liquid from the cleaning liquid storing section to the drainage cup and removing a foreign substance from the drainage cup.
- 2. An apparatus for a cleaning treatment according to claim 1, wherein the second cleaning liquid supply means comprises a plurality of cleaning nozzles used to supply a cleaning liquid to each section of the drainage cup on the coating mechanism.
- 3. An apparatus for a cleaning treatment according to claim 1, wherein the first supply means includes:a plurality of nozzle holes for jetting the cleaning liquid toward positions, which do not interfere with each other, on both surfaces of the peripheral portion of the substrate; and a suction opening surrounding the plurality of nozzle holes and communicating with the cleaning liquid storing section.
- 4. An apparatus for a cleaning treatment according to claim 1, further comprising the cleaning liquid supply source supplying a new cleaning liquid to the cleaning liquid storing section.
Priority Claims (2)
Number |
Date |
Country |
Kind |
8-271292 |
Sep 1996 |
JP |
|
9-009432 |
Jan 1997 |
JP |
|
Parent Case Info
This application is a divisional of application Ser. No. 08/935,917, filed Sep. 23, 1997, and now U.S. Pat. No. 6,159,288.
US Referenced Citations (24)
Foreign Referenced Citations (2)
Number |
Date |
Country |
216633 |
Aug 1990 |
JP |
5-3184 |
Jan 1993 |
JP |