Reference symbols are used in the Figures to indicate components, aspects or features shown therein, with reference symbols common to more than one Figure indicating like components, aspects or features shown therein.
Although some preferred embodiments and examples are disclosed below, it will be understood by those skilled in the art that the inventive subject matter extends beyond the specifically disclosed embodiments to other alternative embodiments and/or uses and obvious modifications and equivalents thereof. Thus it is intended that the scope of the inventions herein disclosed should not be limited by the particular disclosed embodiments described below. Thus, for example, in any method or process disclosed herein, the acts or operations making up the method/process may be performed in any suitable sequence, and are not necessarily limited to any particular disclosed sequence. Also, for example, various functions may be performed in one or a combination of devices.
The light source 100 of
In some embodiments, diagnostics 240 measures one or more properties related to the operation of emitter 120, and transmits the measures as a control measurement CM to power controller 210. Power controller 210 accepts control measurement CM, compares the value of the control measurement to a target value, and generates a control error CE that is transmitted to power unit 220. Power unit 220 in turn provides an electrical power signal P that drives emitter 120. In some embodiments, light source 100 is controlled to achieve a dissipated power versus time profile. In another embodiment, light source 100 is controlled to achieve a light source temperature.
In some embodiments, emitter 120 is an electrical resistance-type radiator.
Emitter 520 includes a heater element 521, a housing 523, a support 525, an opening 527, and electrical leads 501 and 503. Heater element 521 is the portion of emitter 520 that emits electromagnetic radiation E, and can be for example, a wire filament, or can be a thin film on a backing. Heater element 521 is supported within housing 532 by support 525, which is either conducting or includes a conducting portion to provide electrical contact with leads 501, 503. Housing 523 provides protection for heater element 521, a structure for mounting emitter 520, and opening 527 to direct radiation from emitter 520. In alternative embodiments, opening 527 has a covering to further protect heater element 521 and which may or may not be shaped to act as a lens to focus electromagnetic radiation E. In use as emitter 120, leads 501, 503 are shown as leads 120a, 120b. Lead 120a is connected to power signal P, and lead 120b is connected, directly or indirectly, to ground.
Heater element 521 can have a low thermal mass (that is, it can heat up rapidly). Housing 523 is in thermal contact with heater element 521 and may affect the operation of emitter 520 by providing a thermal mass and acting as a heat sink for heater element 521. Thus, heat from heater element 521 is transported to housing 523 at a rate that depends on the housing and radiator base temperature. Housing 523 may also affect the operation of emitter 520 by radiating at a temperature that is both different from, and which responds at a different time response than, heater element 521.
Examples of emitter 520 include, but are not limited to, the IR Source manufactured by Axetris, the microsystems division of Leister (Leister Technologies, LLC, Itasca, Ill.) or the pulse IR Emitter manufactured by Boston Electronics Corporation (Brookline, Mass.).
Power controller 210 includes control module 311 and a differential amplifier 313. Power controller 210 accepts a control measurement CM, which is a measure of the electric power P(t) dissipated in emitter 120, which may be an emitter 520, and produces a control error CE, which is a signal e(t) that is used to power the emitter. More specifically, control module 311 generates a signal Ps(t) that is a target for the measured dissipated electric power P(t). The signals Ps(t) and P(t) are provided to differential amplifier 313, which has an output e(t) that is proportional to the difference between the target and measured power, that is:
e(t)=K1(Ps(t)−P(t)), (1)
where K1 is a constant of the differential amplifier 313.
Control module 311 includes a modulation control module 401, a lamp power set point module 403, and a switch 405. Switch 405 is responsive to a control input 405a that connects one of two inputs 405b and 405c with an output 405d. Thus, for example, if input 405b is provided to output 405d for a control input 405a greater than or equal to a voltage Vset, and if input 405c is provided to output 405d for a control input 405a less than a voltage Vset, then the voltage Ps(t) is given by:
With reference to
V(t)=K1*K2*(Ps(t)−P(t)), (3)
that is, the power signal is proportional to the difference between a desired set point and a measured set point value. Emitter 120 is connected to power signal P and emits electromagnetic radiation E in response the time varying signal V(t).
The embodiment of diagnostics 240 shown in
In some embodiments, the effect of the value of Psb can be described as follows. As the value of Psb is increased from zero, fluctuations in the housing temperature will diminish. At a value of Psb that approximately corresponds to an average power dissipation during the “on” period and “stand by” period, the temperature during these two periods will be approximately constant, greatly minimizing temperature variation. Thus, providing power according to
In some embodiments, the values of Psb, Pmax, Pmin, and the “on” and “stand by” periods of time are predetermined such that the average power dissipation within the light source is the same during the “on” and “stand by” time periods, resulting in an approximately constant light source temperature. In another embodiment, the values of Pmax, Pmin, and the “on” and “stand by” periods of time are determined by required energy E, and the value of Psb is selected to minimize the temperature variation of the light source. In yet another embodiment, the value Psb is modified based on temperature measurement of the light source.
Thus, for example, if infrared light is needed for 5 minutes every 15 minutes, then it would be expected that the source lifetime should be at least 3 times longer than if driven continuously at some duty cycle. It has been found that, in practice, the increase in source lifetime greatly exceeds this estimate. One likely explanation is that periodically operating the heater element at a moderate temperature anneals the element or other light source components, reversing damage done during high temperature operation and resulting in a much improved lifetime.
The operation of light source 100 may further be modified to heat the light source from a cold start. Thus, for example, during instrument warm-up, the source can be driven at perhaps 80% of the peak power level with 100% duty cycle to accelerate heating of the source heat sink. The timing of this would have to be determined by experiment.
In addition, if there are one or two wavelengths which are especially sensitive to signal-to-noise, the source may be overdriven during the measurement of those wavelengths as long as the total overdrive time is small compared to the measurement cycle.
In an alternative embodiment, diagnostics 240 includes a thermocouple and associated circuitry for measuring the temperature of a part of emitter 120, and a power controller 210 includes circuitry for maintaining a constant temperature. Thus, for example, in some embodiments, the power controller 210 adjusts Psb so that the “on” and “standby” temperatures are approximately constant.
In yet another alternative embodiment, the light source power is controlled such that an average light source housing temperature including, but not limited to the temperature of housing 523, in an “on” period is the same or approximately equal to the average light source temperature in a “stand by” period. In either case, control can be obtained by measuring either the light source power or housing temperature.
The systems, methods, and devices described above can be used to drive a radiation source in a spectroscopic device, which can be incorporated into a medical device, for example. Thus, in some embodiments, the systems, methods, and devices described above can be used with the devices, systems, and methods described in the context of analyte detection and/or quantification in: U.S. Patent Publication No. 2007/0103678, published May 10, 2007 (Atty. Docket No. OPTIS.150A); U.S. patent application Ser. No. 11/734,261, filed Apr. 11, 2007 (Atty. Docket No. OPTIS.165A); and U.S. Provisional Patent Application No. 60/939,023, filed May 18, 2007 (Atty. Docket No. OPTIS.184PR). The entirety of each of the documents listed in this paragraph is hereby incorporated herein and made part of this specification.
It will be understood that the steps of methods discussed are performed in some embodiments by an appropriate processor (or processors) of a processing (i.e., computer) system executing instructions (code segments) stored in appropriate storage. It will also be understood that the disclosed methods and apparatus are not limited to any particular implementation or programming technique and that the methods and apparatus may be implemented using any appropriate techniques for implementing the functionality described herein. The methods and apparatus are not limited to any particular programming language or operating system. In addition, the various components of the apparatus may be included in a single housing or in multiple housings that communication by wire or wireless communication.
Reference throughout this specification to “one embodiment,” “an embodiment,” or “some embodiments,” means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner, as would be apparent to one of ordinary skill in the art from this disclosure, in one or more embodiments.
Similarly, in the above description of exemplary embodiments, various features of the inventions are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. This method of disclosure, however, is not to be interpreted as reflecting an intention that any claim require more features than are expressly recited in that claim. Rather, as the following claims reflect, inventive aspects lie in a combination of fewer than all features of any single foregoing disclosed embodiment. Thus, the claims following the Detailed Description are hereby expressly incorporated into this Detailed Description, with each claim standing on its own as a separate embodiment.
This application claims the benefit of U.S. Provisional Application No. 60/809,937, filed Jun. 1, 2006, and U.S. Provisional Application No. 60/855,059, filed Oct. 27, 2006. The entirety of each of these applications is hereby incorporated herein by reference and made part of this specification.
Number | Date | Country | |
---|---|---|---|
60809937 | Jun 2006 | US | |
60855059 | Oct 2006 | US |