Patent Grant
8106741
The present subject matter relates generally to electric sensors for sensing ambient conditions and more particularly to method and apparatuses for coreless flexible temperature sensors having coiled elements.
Electronic sensors are known. Various sensors have become adapted for use in varying conditions. However, as technology evolves, there is an ever-present need for new configurations which are usable in new applications and new environments. In particular, the art presents a need for flexible sensors which can be applied in a robust manner. Some applications require a sensor which can sustain multiples flexes and high heat. Sensors which address these concerns should be configured for efficient and robust assembly.
The above-mentioned problems and others not expressly discussed herein are addressed by the present subject matter and will be understood by reading and studying this specification.
One embodiment of the present subject matter includes a first elongate section having a first flexible conductor enveloped by a first polytetrafluoroethylene jacket; a second elongate section having a second flexible conductor enveloped by a second polytetrafluoroethylene jacket; and an sensor section having an elongate flexible tubular shape, and including polytetrafluoroethylene material, the sensor section housing a resistance temperature detector element which is at least partially coiled and which is resistance welded to the first flexible conductor at a first weld and to the second flexible conductor at a second weld; wherein the sensor section at least partially envelops and overlaps the first elongate section and the second elongate section, with a first band crimping the sensor section to the first elongate section, and a second band crimping the sensor section to the second elongate section, and with the first and second welds disposed between the first and second bands.
This Summary is an overview of some of the teachings of the present application and not intended to be an exclusive or exhaustive treatment of the present subject matter. Further details about the present subject matter are found in the detailed description and appended claims. Other aspects will be apparent to persons skilled in the art upon reading and understanding the following detailed description and viewing the drawings that form a part thereof, each of which are not to be taken in a limiting sense. The scope of the present invention is defined by the appended claims and their legal equivalents.
The following detailed description of the present invention refers to subject matter in the accompanying drawings which show, by way of illustration, specific aspects and embodiments in which the present subject matter may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present subject matter. References to “an”, “one”, or “various” embodiments in this disclosure are not necessarily to the same embodiment, and such references contemplate more than one embodiment. The following detailed description is demonstrative and therefore and not exhaustive, and the scope of the present subject matter is defined by the appended claims and their legal equivalents.
Various embodiments include a first section 120 which includes a conductor. In some embodiments, round wire is used for the conductor. In additional embodiments, other conductors are used, such as flex wire, braided wire, or other types of conductors. Various embodiments include a conductive core 101 surrounded by an insulator 102. In one embodiment, the core 101 copper. Some embodiments include a core 101 which includes copper alloys. In some embodiments, the core is nickel plated copper. These materials demonstrate the present subject matter, and are not exhaustive or exclusive of the materials which are contemplated by the present subject matter. Other embodiments, including, but not limited to, aluminum conductor are also contemplated by the present subject matter. The second section 124 additionally includes a conductor, in various embodiments. In some embodiments, the second section 124 includes a core 111 surrounded by an insulator 112. Materials for core 101 are used for core 111, in various embodiments.
Various embodiments include insulators 102, 106, and 111. In some embodiments, the insulators 102, 106, and 111 are of identical materials. In additional embodiments, the insulators 102, 106, and 111 are not of identical materials. Various materials are contemplated by the present subject matter. Some embodiments include insulators having polytetrafluoroethylene (“PTFE”). One brand of polytetrafluoroethylene is TEFLON. TEFLON is a registered trademark of the E.I. DuPont de Nemours and Company Corporation, 101 West 10th St., Wilmington, Del. 19898. Other brands are within the present subject matter. Additional blends including polytetrafluoroethylene are within the present subject matter. Polytetrafluoroethylene is a suitable material for use with the present subject matter due to its resistance to reaction with other chemicals, in various embodiments. As such, it is important to note that other materials, which are known to resist further reactions, also fall within the scope of the present subject matter.
Various embodiments include an insulator 102 which includes other materials. In some embodiments, an insulator is used which includes perfluoroalkoxy fluorocarbon (“PFA”). Some of these embodiments melt when heated. In some embodiments, this is advantageous, as a melting insulator could form to a mated feature, such as a band 104 or a wire 106. In various embodiments, and insulator is used which melts during manufacture, but does not melt in use.
Some embodiments include insulators which includes other materials. In some embodiments, an insulator is used which includes fluoroethylene-propylene (“FEP”). Some of these embodiments melt when heated. In some embodiments, this is advantageous, as a melting insulator could form to a mated feature, such as a band 104 or a wire 106. In various embodiments, and insulator is used which melts during manufacture, but does not melt in use.
Embodiments of the present subject matter include an which includes other materials. In some embodiments, an insulator is used which includes polyvinylchloride (“PVC”).
The insulative materials listed herein are not exhaustive of exclusive of the present subject matter, and additional materials not listed herein expressly are also contemplated.
The first 120 and second 124 sections, in various embodiments, have a cylindrical shape. However, it is important to note that other shapes are possible, such as flat shapes, braided shapes, or other shapes.
Various embodiments of the present subject matter include a sensor section 122122. In various embodiments, the sensor section 122 includes a sensor insulator 106 which is elongate. Some embodiments additionally include a sensor insulator 106 which is flexible. As such, the sensor section 122 is adapted to be elastically configured into a coil shape, in various embodiments. In some embodiments of the present subject matter, the sensor insulator 106 is tube shaped. In one embodiment, a sensor insulator is elongate and tubular, and is sized such that each of its ends can fit over another component. For example, in one embodiment, the sensor insulator is sleeved over the first section 120 and the second section 124. In such a configuration, various embodiments use an inner diameter of the tube such that a snug fit is accomplished. In one embodiment, the outer diameter of the sensor insulator 106 is approximately 0.098 inches.
Various embodiments of the present subject matter include a sensor element 108 which is at least partially housed by the sensor insulator 106. The sensor element 108 can be constructed from one or more of a range of materials, in various embodiments. Materials contemplated by the present subject matter include, but are not limited to, platinum, nickel, copper, iron, and combinations thereof. The present subject matter includes materials not expressly recited herein, which are suitable for use as a temperature sensor. In some embodiments of the present subject matter, a Nickel Iron material manufactured by BALCO is used. BALCO is a registered trademark of CRS Holdings, Inc., 209F Baynard Building, 3411 Silverside Rd., Wilmington, Del. 19810.
In housing the sensor element 108, some embodiments of the present subject matter use additional components attached to the sensor section 122. For example, in various embodiments, the sensor element 108 is interconnected between the first section 120 and the second section 124. The sensor element 108 of the present subject matter, in some embodiments, is adapted for use as an resistance temperature detector (“RTD”).
In various embodiments, the sensor element 108 is welded to a conductor of the first section 120 with a first weld 109, and to a conductor or the second section 124 with a second weld 110. In some embodiments, the sensor element 108 is connected to core 101 and to core 112. Various interconnection means are within the present subject matter. For example, in some embodiments, the sensor element 108 is interconnected to one or more components using resistance welding. In additional embodiments, the sensor element 108 is interconnected to additional components using solder. Additional methods of interconnection suitable for forming a mechanical and an electrical interconnect fall within the present subject matter.
The sensor element 108, in various embodiments, is in a coil configuration as it extends at least part of the way along the sensor insulator 106. Such a configuration, in various embodiments, allows for increased flexibility along the sensor section 122. Embodiments which are not coiled, however, additionally fall within the present subject matter.
In some embodiments, the coils are spaced apart. In various embodiments, the coils are spaced apart such that they do not contact one another. Some RTD sensors operate when the coils are spaced apart, and when they are not touching one another. Coils may additionally be isolated from one another with a separator or another form of electrical isolative materials, in various embodiments.
To protect the sensor element 108, some embodiments seal the sensor section 122 to other components. For example, some embodiments are configured such that the sensor section 122 at least partially envelops and overlaps the first section 120 and the second section 124 in a sealable manner. Some embodiments include one or more insulators which are meltable, as disclosed herein, to seal the sensor section 122. Additional embodiments do not seal the sensor wire 108 in the sensor insulator 106.
Some of these embodiments use a first band 104 to crimp the sensor section 122 to the first section 120. In various embodiments, the first band 104 is brass. In additional embodiments, the band is another material including, but not limited to, steel, nickel, nickel plated brass. These materials are not exhaustive or exclusive of the present subject matter, and additional materials are contemplated. Some materials for bands are selected based on their strength. Materials, in some embodiments, are selected based on their reactivity to one or more chemicals. Some materials, in various embodiments, are selected based on their durability at certain temperatures. For example, some embodiments use a materials which is routinely exposed to around 260 degrees centigrade.
Some of these embodiments use a second band 105 to crimp the sensor section 122 to the second section 124. In the interest of protecting the welds, in various embodiments the first and second welds are disposed between the first and second bands. These bands provide strain relief for the sensor element 108, as stresses pulling on the first insulator 102 and the second insulator 111 are absorbed by the bands 104, 105 and the sensor insulator 106.
Some materials present problems with interconnection. For example, in some configurations, a first section 120 having a polytetrafluoroethylene jacket may present a low friction coefficient when fitted to a sensor section 122 constructed from polytetrafluoroethylene. As such, various embodiments of the present subject matter use various material preparation techniques to increase the friction coefficient. In one embodiment, the first section 120 is pretreated before interconnection to increase its coefficient of friction. In another embodiment, the sensor section 122 is pretreated to increase its coefficient of friction. Some embodiments treat both the first section 120 and the sensor section 122. Embodiments including treatments to the second section 124 additionally fall within the scope of the present subject matter. Embodiments having treatments improving the coefficient of friction can additionally be combined with banding, as described herein.
Various processes which increase the coefficient of friction are possible. For example, surface abrasion techniques are used. Some embodiments perform surface conditioning using TETRA-ETCH fluoropolymer etchant. TETRA-ETCH is a registered trademark of W. L. Gore & Associates, Inc., which is a corporation of Delaware and which is located at 555 Paper Mill Road P.O. BOX 9329 Newark Del. 19714.
Other manufacturing processes are additionally taught by the present subject matter. As described herein, various embodiments of the present subject matter include a sensor element 108 which is at least partially coiled. In various embodiments, the sensor element is originally a substantially straight wire, and is wound into a coil shape. Some embodiments of the present subject matter wind the sensor element by winding it onto a mandrel. For example, in one embodiment, the mandrel is approximately 0.045 inches in diameter. Various coil configurations have a winding pitch which ranges from about 0.005 inches to about 0.200 inches. In one embodiment, the coil winding pitch is approximately 0.040 inches.
In some of these embodiments, a wound sensor element is removed from the mandrel and is used to construct a sensor of the present subject matter. In constructing the sensor into a use configuration suitable for market sales, this coil is pulled through the sensor insulator 106. In various embodiments, the fit between the sensor insulator 106 and the sensor element 108 is an interference fit. In some embodiments, the coil is not attached to the sensor insulator directly, but is rather attached to the entire assembly through connections to the first section 120 and the second section 124. A free floating configuration as such improves flexibility, in various embodiments.
In various embodiments, a third band 410 is provided, banding wire 402 unto itself. In some embodiments, the third band 410 is brass. In additional embodiments, the band is another material including, but not limited to, steel, nickel, nickel plated brass. These materials are not exhaustive or exclusive of the present subject matter, and additional materials are contemplated. Additional materials are possible, however. Some embodiments cover the third band 410 with KAPTON tape. In various embodiments, a fourth band 412 banding wire 402 unto itself. The materials in use for the third band can be used for the fourth band. In various embodiments, the fourth band 412 is covered with KAPTON tape. In some embodiments, the first piece of tape 410 is wrapped around wire 402 such that wire 402 and tape 410 define a hoop.
In various embodiments, by routing the wire 402 back along the sensor 414 so that the wire's origin and its termination are occur near the proximal side 418 of the sensor, the present subject matter enables a sensor to be used with communications electronics being disposed on a proximal side 418 of the sensor, as opposed to a design in which the wire does not loop back along the sensor, and instead terminates on a distal end of the sensor 416.
In various embodiments, the present subject matter provides sensors for use in measuring ambient conditions. In particular, the present subject matter includes embodiments which use RTD to measure the temperature in various applications. The sensor element of the present subject matter, in various examples, is an RTD element.
The present subject matter is suited for a number of applications, including, but not limited to, determining, through sensing, an absolute temperature. Additional embodiments are concerned primarily with changes in temperatures. Thus, some embodiments, of the present subject matter provide an averaging temperatures sensor.
In sensing, various sensor element configurations are used. Some sensor elements provide for a resistance of approximately 284 Ohms at approximately 177 degrees Centigrade. Some of these designs provide for a resistance of 120 Ohms at 0 degrees Centigrade. Other values are within the present subject matter. For examples, some embodiments provide approximately 100 Ohms of resistance.
Sensors of the present subject matter are compatible with operation at a range of temperatures. Some embodiments of the present subject matter are suited for operation at approximately 260 degrees centigrade. Some of the present subject matter are suited for operation at greater than 260 degrees centigrade. Embodiments adapted to operate at these temperatures utilize the high temperature compatibility discussed herein with respect to several aspects of the design. For example, some embodiments include a sensor insulator made from a material which is compatible with such high temperatures.
Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that any arrangement which is calculated to achieve the same purpose may be substituted for the specific embodiment shown. This application is intended to cover adaptations or variations of the present subject matter. It is to be understood that the above description is intended to be illustrative, and not restrictive. Combinations of the above embodiments, and other embodiments will be apparent to those of skill in the art upon reviewing the above description. The scope of the present subject matter should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.
This application is a Continuation of U.S. patent application Ser. No. 11/462,020, filed Aug. 2, 2006 now U.S. Pat. No. 7,719,400. This application claims the benefit under 35 U.S.C. 119(e) of U.S. Provisional Patent Application Ser. No. 60/705,143, filed Aug. 2, 2005, the entire disclosure of which is hereby incorporated by reference in its entirety.
| Number | Name | Date | Kind |
|---|---|---|---|
| 2530256 | Malek | Nov 1950 | A |
| 2619573 | Dawson | Nov 1952 | A |
| 2749753 | Adams | Jun 1956 | A |
| 2758294 | Duncan | Aug 1956 | A |
| 2802925 | Seelen et al. | Aug 1957 | A |
| RE24436 | Jacobson et al. | Feb 1958 | E |
| 2945265 | Sell, Jr. et al. | Jul 1960 | A |
| 2994219 | Schaschl | Aug 1961 | A |
| 3049012 | Daniels | Aug 1962 | A |
| 3165426 | Beckam | Jan 1965 | A |
| 3339164 | Landis et al. | Aug 1967 | A |
| 3343589 | Holzl | Sep 1967 | A |
| 3589360 | Sinclair | Jun 1971 | A |
| 3975720 | Chen et al. | Aug 1976 | A |
| 4042900 | Hinton et al. | Aug 1977 | A |
| 4122322 | Ohkubo et al. | Oct 1978 | A |
| 4289553 | Nolf | Sep 1981 | A |
| 4369795 | Bicher | Jan 1983 | A |
| 4419169 | Becker et al. | Dec 1983 | A |
| 4437084 | Clayton, Jr. | Mar 1984 | A |
| 4527909 | Dale et al. | Jul 1985 | A |
| 4553023 | Jameson et al. | Nov 1985 | A |
| 4607154 | Mills | Aug 1986 | A |
| 4698756 | Gonzalez et al. | Oct 1987 | A |
| 4827487 | Twerdochlib | May 1989 | A |
| 4848926 | Jenkins | Jul 1989 | A |
| 4899741 | Bentley et al. | Feb 1990 | A |
| 4977385 | McQueen | Dec 1990 | A |
| 4994780 | McQueen | Feb 1991 | A |
| 5161894 | Bourigault | Nov 1992 | A |
| 5221916 | McQueen | Jun 1993 | A |
| 5460041 | Andes et al. | Oct 1995 | A |
| 5666593 | Amico | Sep 1997 | A |
| 5749656 | Boehm et al. | May 1998 | A |
| 5769622 | Aoki et al. | Jun 1998 | A |
| 5769847 | Panescu et al. | Jun 1998 | A |
| 5831511 | Manning et al. | Nov 1998 | A |
| 5833688 | Sieben et al. | Nov 1998 | A |
| 5864282 | Hannigan et al. | Jan 1999 | A |
| 5889460 | Bachmann et al. | Mar 1999 | A |
| 5906584 | Pavoni et al. | May 1999 | A |
| 5938624 | Akerfeldt et al. | Aug 1999 | A |
| 5955960 | Monnier | Sep 1999 | A |
| 5959524 | Wienand et al. | Sep 1999 | A |
| 5999081 | Hannigan et al. | Dec 1999 | A |
| 6028382 | Blalock et al. | Feb 2000 | A |
| 6033398 | Farley et al. | Mar 2000 | A |
| 6078830 | Levin et al. | Jun 2000 | A |
| 6117088 | Kreizman et al. | Sep 2000 | A |
| 6123675 | Kreizman et al. | Sep 2000 | A |
| 6162184 | Swanson et al. | Dec 2000 | A |
| 6197021 | Panescu et al. | Mar 2001 | B1 |
| 6213995 | Steen et al. | Apr 2001 | B1 |
| 6262574 | Cho et al. | Jul 2001 | B1 |
| 6267746 | Bumbalough | Jul 2001 | B1 |
| 6322559 | Daulton et al. | Nov 2001 | B1 |
| 6323413 | Roth et al. | Nov 2001 | B1 |
| 6354735 | Thermos et al. | Mar 2002 | B2 |
| 6440129 | Simpson | Aug 2002 | B1 |
| 6456863 | Levin et al. | Sep 2002 | B1 |
| 6539981 | Kleven et al. | Apr 2003 | B1 |
| 6547788 | Maguire et al. | Apr 2003 | B1 |
| 6623821 | Kendig | Sep 2003 | B1 |
| 6639505 | Murata et al. | Oct 2003 | B2 |
| 6655835 | Mattoon et al. | Dec 2003 | B2 |
| 6666578 | Gibbs et al. | Dec 2003 | B2 |
| 6698922 | Adachi et al. | Mar 2004 | B2 |
| 6738566 | Pagnella | May 2004 | B2 |
| 6886977 | Kaminski et al. | May 2005 | B2 |
| 6977575 | Bernier et al. | Dec 2005 | B2 |
| 6986746 | Fox et al. | Jan 2006 | B2 |
| 6991370 | Kofune et al. | Jan 2006 | B2 |
| 7029173 | Engel et al. | Apr 2006 | B2 |
| 7053509 | Ryan et al. | May 2006 | B2 |
| 7090645 | Fox et al. | Aug 2006 | B2 |
| 7111983 | Hudson | Sep 2006 | B2 |
| 7361830 | Richetto et al. | Apr 2008 | B2 |
| 7719400 | Peter et al. | May 2010 | B1 |
| 7864026 | Pete | Jan 2011 | B2 |
| 20020048310 | Heuser | Apr 2002 | A1 |
| 20020048312 | Schurr et al. | Apr 2002 | A1 |
| 20020103445 | Rahdert et al. | Aug 2002 | A1 |
| 20020198465 | Fox et al. | Dec 2002 | A1 |
| 20030050634 | Ellman et al. | Mar 2003 | A1 |
| 20030209264 | Richetto et al. | Nov 2003 | A1 |
| 20040094706 | Covey et al. | May 2004 | A1 |
| 20040114665 | Park et al. | Jun 2004 | A1 |
| 20040162502 | Kokate et al. | Aug 2004 | A1 |
| 20040233034 | Bernier | Nov 2004 | A1 |
| 20040238023 | Richetto et al. | Dec 2004 | A1 |
| 20060247726 | Biggs et al. | Nov 2006 | A1 |
| 20060284722 | Bernier | Dec 2006 | A1 |
| 20090026894 | Lesmeister et al. | Jan 2009 | A1 |
| 20090044849 | Richetto et al. | Feb 2009 | A1 |
| 20110026562 | Bernier et al. | Feb 2011 | A1 |
| Number | Date | Country |
|---|---|---|
| 57-079689 | May 1982 | JP |
| Number | Date | Country | |
|---|---|---|---|
| 20100278213 A1 | Nov 2010 | US |
| Number | Date | Country | |
|---|---|---|---|
| 60705143 | Aug 2005 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 11462020 | Aug 2006 | US |
| Child | 12776655 | US |
