Method and apparatus for fractional skin treatment

Information

  • Patent Grant
  • 10322296
  • Patent Number
    10,322,296
  • Date Filed
    Monday, July 6, 2015
    9 years ago
  • Date Issued
    Tuesday, June 18, 2019
    5 years ago
Abstract
An apparatus for cosmetic RF skin treatment where the RF energy supply is isolated from the patient treated, such that in course of treatment no undesired current flows through the subject body.
Description
TECHNOLOGY FIELD

The method and apparatus generally relate to skin treatment procedures and in particular to cosmetic skin resurfacing and rejuvenation procedures.


BACKGROUND

Fractional skin resurfacing or rejuvenation is a recently developed skin ablative technology. There are two types of devices used to ablate the skin: laser based devices and RF based devices. Both types of these devices ablate a pattern of extremely small diameter shallow holes or zones. The holes are microscopically small treatment zones surrounded by untreated skin areas. The treatment results in a very rapid healing or recovery and skin resurfacing of the treated. In the healing process of the treated zones, a layer of new skin appears, restoring a fresh, youthful complexion.


The pattern of small holes is typically produced by an X-Y scanning laser beam or by application of RF energy or voltage. The laser is focused on the skin and usually operates in pulse mode ablating micron size holes in the skin.


RF based fractional skin treatment produces a scanning pattern of micron size holes in the skin a similar to laser. Typically, the energy is delivered to the skin by an applicator equipped by a tip having a plurality of voltage to skin applying/delivering elements or contact elements arranged in a matrix or in an array. The voltage to skin applying elements are placed in contact with the segment of the skin to be treated and driven by a source of suitable power and frequency RF energy. Application of a high voltage RF pulse to the electrodes ablates the skin under the respective electrode forming a small hole.


In some instances application of laser or RF voltage pulses causes discomfort and even pain to the treated subject, although the experience based on the individual and as such, the pain sensation may be different from subject to subject. In other instances there may be a difference in the size of micro holes formed by the applicator at the same treatment session. Healing of larger size holes may take a longer period of time than the healing process for smaller size holes and in some instances, the larger holes may tend to result in causing damage to the skin rather than producing the desired skin effect.


In order to soften the discomfort and lessen the pain and other side effects associated with the fractional treatment, practitioners have started using topically applied lidocaine cream or even oral sedation.


Fractional skin treatment is applicable in the correction of almost all cosmetic skin defects such as signs of aging, wrinkles, discolorations, acne scars, tattoo removal, and other skin defects. The cost of the RF based products is lower than that of the products operating with laser radiation and they will most probably become widely used if the discomfort and occasional pain associated with their use could be eliminated.


US Patent Application Publication No. 2006/0047281 and U.S. patent application Ser. No. 12/324,932 to the same assignee disclose RF based products such as eMatrix™ suitable for fractional skin treatment.


GLOSSARY

In the context of the present disclosure “RF voltage” and “RF energy” are used interchangeably and have the same meaning. The mathematical relationship between these two parameters is well known and knowledge of one of them allows easy determination of the other.


In the context of the present disclosure “skin resistance” and “skin impedance” are used interchangeably and have the same meaning. The mathematical relation between these two parameters is well known and knowledge of one of them allows easy determination of the other.


The term “desired skin effect” as used in the present disclosure means a result of RF energy application, which may be wrinkle removal, hair removal, collagen shrinking or destruction, skin rejuvenation, and other cosmetic and skin treatments.


The term “plateau” of a function is a part of its domain where the function has constant value.


BRIEF SUMMARY

An apparatus for cosmetic RF skin treatment where the RF energy supply is isolated from the subject treated, such that in course of treatment no undesired current flows through the subject body. The apparatus includes an applicator with a tip that is populated by a plurality of voltage applying dome shaped elements protruding from the tip surface and organized in one common cluster and a cluster of electrodes bounding the dome shaped elements and having an area larger than the dome shaped elements have. The apparatus applies voltage to the elements with a magnitude sufficient to cause a desired skin effect. A current limiter limits the RF induced current thereby preventing skin damage. The apparatus continuously senses the treated skin segment impedance and varies the RF energy at a low skin impedance and/or stops the pulse in cases of too low or too high skin impedance.





BRIEF DESCRIPTION OF THE FIGURES


FIGS. 1A and 1B, collectively referred to as FIG. 1, are schematic illustrations of a prior art RF applicator tip for fractional skin treatment.



FIG. 2 is a schematic illustration of a prior art RF voltage supplying circuit for driving the RF applicator tip for fractional skin treatment.



FIGS. 3A through 3C are schematic illustrations of an equivalent electric circuit of the tip for fractional skin treatment.



FIG. 4 is a schematic illustration of an exemplary embodiment of the present tip for fractional skin treatment driving circuit.



FIG. 5 is a schematic illustration of another exemplary embodiment of the present tip for fractional skin treatment driving circuit.



FIG. 6 is a schematic illustration of skin resistance variation under the application of an RF energy pulse.



FIG. 7 is a schematic illustration of an exemplary embodiment of the present tip for fractional skin treatment control circuit.



FIG. 8 is a schematic illustration of an exemplary embodiment of the present RF applicator tip for fractional skin treatment.





DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

The principles and execution of the method and the apparatus may be better understood with reference to the drawings and the accompanying description of the non-limiting, exemplary embodiments, shown in the Figures.


Reference is made to FIG. 1, which is a schematic illustration of a prior art RF applicator tip for fractional skin treatment disclosed in the U.S. patent application Ser. No. 12/324,932 to the same assignee. A carrier 100 on which voltage to skin delivering elements or contact elements are formed may be a flexible or rigid article made of a polyimide film or similar material, with an exemplary thickness range of 0.5 mil to 6 mil (12.5 micron to 150 micron). The term “carrier” in the context of the present disclosure means a substrate having an array of voltage to skin application elements, a two dimensional array or matrix of voltage to skin application elements. Substrate 104 has on one of its surfaces 112 an array or matrix of miniature (microscopic), discrete, voltage to skin application elements 116 protruding from surface 112 and terminated by dome type shapes 120. A pattern of conductors 124 and 128 shown in broken lines arranged on the back or second side of substrate 104 enables addressing of all elements 116, a cluster of elements 116, or each of elements 116 individually. Carrier 100, having formed on it, the voltage to skin delivering elements is configured to allow quick attachment to an applicator and will be termed in the present document as a “tip” or an “applicator tip.” An arrangement of RF contacts enabling connection to a source of radio frequency voltage is provided by forming on the back side of the carrier 104 contact points or strips 108 communicating with respective contact arrangements made in substrate 104. Voltage to skin delivering elements 116 are arranged in a symmetric pattern with all even rows 124 connected to one of the RF supply contact strips or ports 124 and all uneven rows 128 connected to another or second contact strip or RF supply port 128.



FIG. 2 is a schematic illustration of a prior art RF voltage supplying circuit for driving the RF applicator tip for fractional skin treatment. A source of RF voltage 200 may be located in stand alone housing 204. Alternatively, the source of the RF voltage may be located in the applicator case 208 shown in broken lines. The source provides RF voltage to applicator tip 212, and in particular to voltage to skin delivering elements 216 through a shielded harness 220. Shield 224 is schematically shown in broken and doted lines. The length of the harness 220 is selected to enable convenient caregiver operation and may be one to two meters long, for example. There exists a certain parasitic capacitance 232 and 236 between the shield 224 and each of the RF current conducting lines 240 and 244. The treated subject has also certain capacitance 248. For skin treatment, tip 212 is placed in contact with a segment of the skin 228 to be treated. As a result of uneven contact of the voltage to skin delivering elements 216 organized into even 124 and uneven 128 rows or clusters with segment of the skin 228 to be treated, an undesired RF current path 252 may be formed. This current passes through the subject 228 and may cause a painful sensation and even an electric shock to the subject.



FIG. 3 is a schematic illustration of an equivalent electric circuit of the tip for fractional skin treatment 212 being in contact with the treated segment of the skin. FIG. 3A schematically shows the tip 212 with all contact elements 330 located in uneven rows 1, 3, 5, and 7 of the tip 212 collectively marked as 302 and shown as connected to a first RF port of RF voltage source 306 and all contact elements located in even rows 2, 4, 6, and 8 collectively marked as 310 and shown as connected to a second RF port of RF voltage source 306. All of the contact elements are in contact with the upper skin layer 320 for example, stratum corneum which has a relatively low conductivity, where numeral 324 marks dermis layer and even deeper skin layers that have a relatively high, as compared to stratum corneum, conductivity.


Referring to FIG. 3B, the electrical channel from each contact element through the low conductance skin layer is represented as a resistor (for the simplicity of the explanation channel capacitance is neglected). The high conductivity dermis is represented as a common resistor Rs. Further equivalent electric scheme simplification is shown in FIG. 3C, where all uneven resistors have been replaced by an equivalent resistor Ru and even rows resistors by Re. Typically, each of the individual contact element resistors is 50K-100K Ohms, therefore Ru and Re are about 2K Ohms each, whereas Rs is an order of magnitude smaller, about 200 Ohms and it can be neglected for the purpose of the discussion.


Because not all of the voltage to skin delivering elements or contact elements 330 (FIG. 3A) may be properly attached to the skin and some of them may bear some dirt and other residuals from the previous treatment, and different skin segments may have different resistance, there is a difference in the resistance to current passing through each of the contact elements and accordingly through the clusters (even or uneven clusters) they form. If the RF voltage or energy flows into any of the Ru or Re resistors, it increases its resistance it generates a positive feedback under which the larger resistor gets more energy than the smaller one, its resistance increases more rapidly, therefore it gets even more energy, and so on. The end result is that the one of Ru or Re clusters, which had initially greater value finally takes most of the energy and leaves a different imprint on the skin (for example, only contact elements located in even or uneven rows may leave an imprint). This reduces the efficacy of the treatment and generates undesired skin effects, excessive pain, and even electric shock.


In order to resolve this problem, as disclosed in the U.S. patent application Ser. No. 12/324,932 assigned to the same assignee, it is possible to address individually each contact element or pin and connect it to the source of voltage through a large impedance, which can be a resistor, a small capacitor, a large inductor, or a combinations of all of them. This would stabilize the RF induced current to each individual channel reducing the “competition” between the contact elements and clusters of contact elements. For sterilization and hygiene purposes use of disposable tips is preferred to the use of reusable tips. Addressing of each individual contact element however, complicates and increases manufacturing cost of such tips.


Another way to equalize the resistance or impedance of each contact element and reduce the pain sensation and potential electric shocks to the treated subject is to bring the skin by some initial treatment to an optimal and more uniform resistance value, which for example may be about 3000 Ohms There will always be however, segments of skin where the resistance is low and any slight sweating may drive the skin to lower impedances.



FIG. 4 is a schematic illustration of an exemplary embodiment of the present tip driving circuit. The embodiment of FIG. 4 eliminates or at least, greatly reduces the pain sensation and electric shock that could affect the treated subject. A low capacitance for example, 4 pF to 10 pF isolating transformer 404 is located in close proximity to the tip 212 with the voltage to skin delivering elements 216. In the course of operation, transformer 404 reduces or completely eliminates currents flowing through the subject body due to parasitic capacitances 408 and 412 formed by the subject skin 320, 324 and the ground and between the shield 224 and each of the RF conducting lines 420 and 424. A controller 432 governing operation of all of the apparatus devices may be located in housing 204. Controller 432 may have a processor, a memory, and other devices necessary for controlling the treatment process.



FIG. 5 is a schematic illustration of an additional exemplary embodiment of the present tip 212 driving circuit that eliminates, or greatly reduces, pain sensation and electric shock that could affect the treated subject. In addition to the low capacitance transformer 404 one or more capacitors 502 and 504 located in the current path and connected in series to the electrodes 216 form a high pass filter. In the course of apparatus operation, the high pass filter filters out the low frequency currents, to which the sensitivity of the treated subject is high, generated by plasma formed at the voltage to skin delivering elements 216 being in contact with the skin 320, 324 and flowing through the subject body in course of the apparatus/applicator operation. (reference can be made to Guidelines for Limiting Exposure to Time-Varying Electric, Magnetic, and Electromagnetic Fields up to 300 GHz; International Commission on Non-Ionizing Radiation Protection, Page 10.


Electrical resistance of skin differs from subject to subject and complicates proper RF energy value selection and application of the RF energy for cosmetic skin treatment. Further to this, resistance of the subject may vary under application of RF energy. FIG. 6 is a schematic illustration of skin resistance variation under the application of RF energy in a pulse mode. Lines 602 and 606 mark different skin behavior under an RF energy pulse and lines 610 and 614 mark the upper and lower skin resistance or impedance values that result in a desired skin effect, although because of the large variability of the treated subjects skin properties, there may be a need to set experimentally other values matching a particular subject properties. The length of the pulse, as will be explained later, may vary from few milliseconds to hundreds of milliseconds or even seconds.


In order to establish proper treatment parameters prior to the treatment, a system operator or user can calibrate the apparatus and operational treatment parameters derived as a result of the calibration are loaded into a look-up-table (LUT) that may be stored in the memory of the controller 432. For the purpose of calibration, a known variable resistance modeling the subject and the tip behavior is connected instead of a subject to the RF voltage supply. In one of the calibrations, a current flowing in the circuit at different RF voltages and different resistance value is recorded and in another calibration the RF energy applied to the variable resistance, modeling different skin impedance is recorded.


When skin is wet its resistance is low and with the application of the RF energy it continues to fall (line 606). Without being bound by a specific theory it is believed that most of the RF energy applied to the skin is initially wasted to dry the skin and when the skin under the influence of RF energy becomes dry, the skin resistance begins growing to higher values. Resistance increase is believed to be connected with vaporization, accompanied or followed by tissue ablation. It is considered a good treatment (desired skin effect) when ablation is created in the tissue below the electrodes.


It has been experimentally established that treatment resulting in a desired skin effect takes place when the resistance of the subject's skin is between Rlow and Rhigh, where the specific values depend on the number of electrodes in the tip and their arrangement and on the skin properties. For a typical tip shown in FIG. 1, with 64 electrodes and a diameter of 250 μm each, Rlow is about 1500 Ohms and Rhigh is about 4000 Ohms. For the asymmetrical tip of FIG. 8, Rlow is about 600 Ohms and Rhigh is about 1600 Ohms. When the skin resistance (or impedance) falls below the lower limit, most of the RF energy applied to the skin is wasted on drying the skin and not on causing the desired skin effect. Generally, the upper skin resistance limit is in the vicinity of the stratum corneum resistance with the lower limit corresponding to wet skin. When the skin resistance is within the indicated resistance limits, as shown by broken lines 610 and 614, application of RF to the skin through the voltage to skin delivering elements results in a desired skin effect. Continuous or pseudo continuous monitoring of the skin impedance during the RF pulse enables control of the energy delivered to skin. For example, when the resistance falls below the pre-set threshold of e.g. 600 Ohms, the time of the RF pulse may be increased by the control, until the control unit identifies or detects the beginning of an increase in the resistance. From the time that the beginning of the resistance increase is detected, the amount of energy delivered is either fixed or it takes into consideration the energy delivered up to that point, thereby allowing or ensuring the proper skin effect. It is also possible to cut off the RF pulses when the skin impedance is below a pre-set impedance or resistance value and notify operator, to exclude inefficient pulses. Another possibility is to notifying the operator on the low value of skin resistance and the need to dry out the skin. It is also possible to set the apparatus to deliver a pre-set amount of energy to the skin.


It is possible to generalize the skin behavior under an RF pulse into at least two typical cases, although a mixture of these cases and other skin behavior may be present: a) skin resistance remains high through all of the RF pulse application time and b) skin resistance drops down below the lower resistance limit and after it reaches (the function reaches) a plateau it begins to rise. Accordingly, by monitoring the current flowing in the voltage to skin delivering elements circuit, it is possible to set proper treatment parameters resulting in a desired skin effect and not causing adverse side effects such as pain, burnings and other. It was found that resistances above Rhigh correspond to dirty tip and/or are caused by improper attachment of the tip to the skin. In both cases, the pulses may cause undesired pain. In order to reduce the pain, current limiter 704 (FIG. 7) or a control system immediately cuts the pulse when the resistance is above a certain pre-set threshold. The control will notify the operator to check proper attachment of the tip to skin and/or clean the tip.



FIG. 7 is a schematic illustration of another exemplary embodiment of the present tip for fractional skin treatment driving circuit that eliminates pain sensation and electric shock that could affect the treated subject. A sensing element 700 senses the current flowing in the immediate to the tip for fractional skin treatment circuit. The sensing and sampling may be continuous or performed at very short time intervals, for example every few tens of a microsecond. A fast response RF induced current limiter 704 in course of operation sets a maximum to the current which flows into the skin. Immediately, with the current increase above a pre-set value, it operates a fast switch 708 that closes the circuit directing the current to an energy absorbing element 712, which dissipates the excessive energy as heat. The RF energy absorbing element 712 may be packaged or even be a part of current limiter 704. The switch may be a bi-polar transistor, a MOSFET switch, an IGBT switch or any other fast switch. If the switch is operated in the analogue regime, it can stabilize the current to the pre-set maximum value or below that value. The energy absorbing element 712 may be a bank of resistors, bridge of diodes or similar devices. This protects the subject from electric shock, skin burn, and other potential treatment side effects.



FIG. 1 illustrates a prior art tip, which is basically a symmetrical tip including even and uneven arrays of electrodes. FIG. 8 is a schematic illustration of an exemplary embodiment of the present RF applicator tip for fractional skin treatment that eliminates or significantly reduces the “competition” between the tip electrodes. Although the tip 800 is for a bi-polar treatment, it is an asymmetrical tip. Tip 800 has one or more (a cluster) large “ground” electrodes 804 located in the peripheral area of substrate 808 and connected to one RF output port. All of the miniature discrete, voltage to skin application elements 812 protruding from the substrate surface and terminated by dome type shapes are connected together to the other port of the RF output transformer. The particular tip has 64 elements, although other designs with different number of elements are possible. The further advantage of this solution is that the resistance variations may be more obvious since there is no competition between the electrodes located in the even and uneven contact strips, thus preventing the undesired partial imprint on the skin and the accompanied pain. The area of the voltage to skin application elements 804 is substantially larger than the area of the terminated by dome type shapes elements 812. Tip 800 possesses a mechanism 820 enabling quick removal and attachment of the tip to the applicator and RF voltage connection elements (not shown).


The electric scheme and the tip structure disclosed above eliminate electrical shock feeling, reduce or eliminate the pain associated with the treatment and increase the treatment efficacy. The isolating transformer is located very close to the application tip to reduce ground currents through parasitic capacitance. Series capacitors located in the path to the electrodes filter out low frequency currents which are produced by plasma formed at the electrodes and fast current limiter sets a maximum to the current which flows into the skin.


Typical operating parameters of the apparatus are:


Voltage on high impedance load: 850 Vp-p


Current: 50-400 mA


Pulse length: 10-150 msec


Energy per pulse (Actual energy delivered to the skin): 0.5-4 J, more typical 1-2 J.


Frequency of the RF: 1 MHz, although 100 kHz up to 10 MHz may be considered.


Typical control parameters for the asymmetrical tip, 64 pins, 250 microns each:


High resistance limit for cutting of pulses for pain reduction: >1600 Ohms (for 64 pins asymmetrical tip)


Low resistance limit for cutting low efficiency pulses: <200 Ohms (for 64 pins asymmetrical tip)


Range of resistance where control adds energy to dry the skin: 200-600 Ohms (for 64 pins asymmetrical tip)

Claims
  • 1. An RF skin treatment apparatus, comprising: an RF voltage source configured to connect to a tip to apply an RF pulse to skin in order to achieve a desired skin effect; andat least one processor configured to: monitor skin impedance as the RF pulse is applied to the skin;compare the monitored skin impedance to a lower threshold, wherein the lower threshold corresponds to an impedance of wet skin; andincrease a time of the RF pulse when the monitored skin impedance is below the lower threshold until an increase in resistance is detected.
  • 2. The RF skin treatment apparatus of claim 1, wherein the at least one processor is further configured to: compare the monitored skin impedance to an upper threshold; anda) determine that the monitored skin impedance is below the lower threshold, and provide a wet skin notification to an operator of the skin treatment apparatus indicative of a low value of skin resistance and a need to dry the skin, orb) determine that the monitored skin impedance is above the upper threshold, and provide a tip notification to the operator indicative of a need to check for proper attachment of the tip or a need to clean the tip.
  • 3. The RF skin treatment apparatus of claim 2, wherein the at least one processor is further configured to provide a high resistance notification advising the operator of a high value of resistance above the upper threshold when the monitored skin impedance is above the upper threshold.
  • 4. The RF skin treatment apparatus of claim 2, wherein the at least one processor is further configured to cut the RF pulse when the monitored skin impedance is above the upper threshold.
  • 5. The RF skin treatment apparatus of claim 2, wherein at least one of the upper threshold and the lower threshold are chosen to minimize pain to a subject under treatment.
  • 6. The RF skin treatment apparatus of claim 2, wherein the at least one processor is further configured to provide the wet skin notification and the tip notification.
  • 7. The RF skin treatment apparatus of claim 2, wherein the at least one processor is configured to provide the wet skin notification to the operator indicative of the need to dry the skin when the monitored skin impedance is below the lower threshold; and to provide the tip notification to the operator indicative of at least one of the need to check for proper attachment of the tip or the need to clean the tip when the monitored skin impedance is above the upper threshold.
  • 8. The RF skin treatment apparatus of claim 2, further comprising a switch configured to direct current to an energy absorbing element when the monitored skin impedance is above the upper threshold.
  • 9. The RF skin treatment apparatus of claim 1, wherein the desired skin effect includes at least one of wrinkle reduction, hair removal, collagen shrinking, collagen destruction, and skin rejuvenation.
  • 10. The RF skin treatment apparatus of claim 1, wherein the RF voltage source and the at least one processor are configured to cause fractional skin ablation.
  • 11. The RF skin treatment apparatus of claim 1, wherein the RF voltage source and the at least one processor are configured to cause fractional skin treatment.
  • 12. The RF skin treatment apparatus of claim 1, wherein the at least one processor is further configured to provide an inefficient pulse notification advising the operator to exclude inefficient pulses.
  • 13. The RF skin treatment apparatus of claim 1, wherein the at least one processor is further configured to provide a low resistance notification advising the operator of a low value of resistance below the lower threshold when the monitored skin impedance is below the lower threshold.
  • 14. The RF skin treatment apparatus of claim 1, wherein the RF voltage source and the at least one processor are further configured to deliver RF energy to electrodes on the tip.
  • 15. The RF skin treatment apparatus of claim 14, wherein the tip has an asymmetrical electrode arrangement.
  • 16. The RF skin treatment apparatus of claim 15, wherein the asymmetrical electrode arrangement includes at least one electrode having a size greater than a size of another electrode.
  • 17. The RF skin treatment apparatus of claim 15, wherein the asymmetrical electrode arrangement includes a plurality of energy applying electrodes including electrodes of a first size, and at least one larger electrode of a second size located at a periphery of the plurality of energy applying electrodes, the second size being substantially greater than the first size.
  • 18. The RF skin treatment apparatus of claim 17, wherein a combined area of the at least one larger electrode is substantially greater than a combined area of the energy applying electrodes.
  • 19. The RF skin treatment apparatus of claim 14, wherein the RF voltage source and the at least one processor are configured to cause ablation in tissue below the electrodes.
  • 20. The RF skin treatment apparatus of claim 1, wherein the at least one processor is part of a control circuit.
  • 21. The RF skin treatment apparatus of claim 1, wherein the at least one processor is configured to monitor skin impedance by measuring current.
  • 22. The RF skin treatment apparatus of claim 1, wherein the at least one processor is configured to monitor skin impedance by sampling substantially continuously.
  • 23. The RF skin treatment apparatus of claim 1, wherein the at least one processor is configured to monitor skin impedance by sampling every few tens of a microsecond.
CROSS-REFERENCE TO RELATED REFERENCES

This application is a continuation of U.S. application Ser. No. 14/252,832, filed on Apr. 15, 2014, now issued as U.S. Pat. No. 9,072,882, which is a continuation of U.S. application Ser. No. 13/400,434, filed on Feb. 20, 2012, which is a continuation of U.S. application Ser. No. 12/505,576, filed on Jul. 20, 2009, now issued as U.S. Pat. No. 8,357,150. The contents of these priority applications are incorporated herein by reference. This application is related to U.S. application Ser. No. 12/324,932, filed Nov. 28, 2008, now issued as U.S. Pat. No. 8,216,215, which is incorporated herein by reference.

US Referenced Citations (310)
Number Name Date Kind
4200104 Harris Apr 1980 A
4844063 Clark Jul 1989 A
5287380 Hsia Feb 1994 A
5312395 Tan et al. May 1994 A
5319363 Welch et al. Jun 1994 A
5320618 Gustafsson Jun 1994 A
5360425 Cho Nov 1994 A
5383874 Jackson et al. Jan 1995 A
5394492 Hwang Feb 1995 A
5598426 Hsia et al. Jan 1997 A
5599342 Hsia et al. Feb 1997 A
5681282 Eggers et al. Oct 1997 A
5755753 Knowlton May 1998 A
5766153 Eggers et al. Jun 1998 A
5789755 Bender Aug 1998 A
5814040 Nelson et al. Sep 1998 A
5820626 Baumgardner Oct 1998 A
5873855 Eggers et al. Feb 1999 A
5885274 Fullmer et al. Mar 1999 A
5968034 Fullmer et al. Oct 1999 A
5971982 Betsill et al. Oct 1999 A
5976123 Baumgardner et al. Nov 1999 A
5979454 Anvari et al. Nov 1999 A
5983135 Avrahami Nov 1999 A
6024733 Eggers et al. Feb 2000 A
6026816 McMillian et al. Feb 2000 A
6028316 Bender Feb 2000 A
6059772 Hsia et al. May 2000 A
6117335 Bender Sep 2000 A
6120497 Anderson et al. Sep 2000 A
6132426 Kroll Oct 2000 A
6148232 Avrahami Nov 2000 A
6171301 Nelson et al. Jan 2001 B1
6200308 Pope et al. Mar 2001 B1
6200466 Bender Mar 2001 B1
6235015 Mead, III et al. May 2001 B1
6248103 Tannenbaum et al. Jun 2001 B1
6273885 Koop et al. Aug 2001 B1
6277116 Utely et al. Aug 2001 B1
6328033 Avrahami Dec 2001 B1
6364872 Hsia et al. Apr 2002 B1
6402742 Blewett Jun 2002 B1
6413253 Koop et al. Jul 2002 B1
6413255 Stern Jul 2002 B1
6440121 Weber et al. Aug 2002 B1
6451007 Koop et al. Sep 2002 B1
6512782 Hsia et al. Jan 2003 B1
6514241 Hsia et al. Feb 2003 B1
6514244 Pope et al. Feb 2003 B2
6547786 Goble Apr 2003 B1
6597946 Avrahami et al. Jul 2003 B2
6605080 Altshuler et al. Aug 2003 B1
6607498 Eshel Aug 2003 B2
6611706 Avrahami et al. Aug 2003 B2
6615079 Avrahami Sep 2003 B1
6659999 Anderson et al. Dec 2003 B1
6662054 Kreindel et al. Dec 2003 B2
6702808 Kreindel Mar 2004 B1
6708060 Avrahami et al. Mar 2004 B1
6711435 Avrahami Mar 2004 B2
6743222 Durkin et al. Jun 2004 B2
6749624 Knowlton Jun 2004 B2
6761826 Bender Jul 2004 B2
6829260 Hsia et al. Dec 2004 B2
6889090 Kreindel May 2005 B2
6939344 Kreindel Sep 2005 B2
7022121 Stern et al. Apr 2006 B2
7041100 Kreindel May 2006 B2
7060061 Altshuler et al. Jun 2006 B2
7062317 Avrahami et al. Jun 2006 B2
7094252 Koop Aug 2006 B2
7122029 Koop et al. Oct 2006 B2
7123957 Avrahami Oct 2006 B2
7164942 Avrahami et al. Jan 2007 B2
7184614 Slatkine Feb 2007 B2
7217265 Hennings et al. May 2007 B2
7238183 Kreindel Jul 2007 B2
7241491 Kreindel et al. Jul 2007 B2
7331951 Eshel et al. Feb 2008 B2
7333698 Israel Feb 2008 B2
7335377 Stern et al. Feb 2008 B2
7347855 Eshel et al. Mar 2008 B2
7363075 Stern et al. Apr 2008 B2
7383084 Stern et al. Jun 2008 B2
7395111 Levin et al. Jul 2008 B2
7415306 Levin et al. Aug 2008 B2
7435247 Woloszko et al. Oct 2008 B2
7494488 Weber Feb 2009 B2
7524316 Hennings et al. Apr 2009 B2
7558625 Levin et al. Jul 2009 B2
7637906 Koop et al. Dec 2009 B2
7643883 Kreindel Jan 2010 B2
7644715 Hayes et al. Jan 2010 B2
7662404 Stern et al. Feb 2010 B2
7671327 Clancy et al. Mar 2010 B2
7709997 Nudelman et al. May 2010 B2
7740651 Barak et al. Jun 2010 B2
7762965 Slatkine Jul 2010 B2
7815570 Eshel et al. Oct 2010 B2
7824394 Manstein Nov 2010 B2
7857775 Rosenberg et al. Dec 2010 B2
7875023 Eshel et al. Jan 2011 B2
7891362 Domankevitz et al. Feb 2011 B2
7921854 Hennings et al. Apr 2011 B2
7935139 Slatkine May 2011 B2
7947304 Sacks et al. May 2011 B2
7955262 Rosenberg Jun 2011 B2
8007493 McGill et al. Aug 2011 B2
8016810 Levin et al. Sep 2011 B2
8041421 Birchall et al. Oct 2011 B2
8127771 Hennings Mar 2012 B2
8133191 Rosenberg et al. Mar 2012 B2
8133216 Knopp et al. Mar 2012 B2
8133505 Stern et al. Mar 2012 B2
8135475 Kreindel et al. Mar 2012 B2
8142426 Knopp et al. Mar 2012 B2
8216215 Flyash et al. Jul 2012 B2
8246611 Paithankar et al. Aug 2012 B2
8256429 Hennings et al. Sep 2012 B2
8273037 Kreindel et al. Sep 2012 B2
8273080 Mehta Sep 2012 B2
8276590 Hennings et al. Oct 2012 B2
8277495 Demetriou et al. Oct 2012 B2
8281675 Levin et al. Oct 2012 B2
8328795 Domankevitz et al. Dec 2012 B2
8337493 Sohn Dec 2012 B2
D674485 Flyash et al. Jan 2013 S
8357146 Hennings et al. Jan 2013 B2
8357150 Rosenberg Jan 2013 B2
D676959 Flyash et al. Feb 2013 S
D676960 Flyash et al. Feb 2013 S
8365741 Hennings et al. Feb 2013 B2
8409183 Hennings et al. Apr 2013 B2
8419726 Mehta Apr 2013 B2
8430104 Hennings et al. Apr 2013 B2
8439045 Hennings et al. May 2013 B2
8448644 Hennings et al. May 2013 B2
8454540 Eshel et al. Jun 2013 B2
8466605 Kushculey et al. Jun 2013 B2
8479624 Flyash et al. Jul 2013 B2
8496654 Rosenberg Avner Jul 2013 B2
8512327 Knopp et al. Aug 2013 B2
8516706 Flyash et al. Aug 2013 B2
8540705 Mehta Sep 2013 B2
8568339 Rybyanets Oct 2013 B2
8573227 Hennings et al. Nov 2013 B2
8579896 Kreindel Nov 2013 B2
8585693 Knopp et al. Nov 2013 B2
8606366 Flyash et al. Dec 2013 B2
8608737 Mehta et al. Dec 2013 B2
8613741 Jones et al. Dec 2013 B1
8641703 Flyash et al. Feb 2014 B2
8685012 Hennings et al. Apr 2014 B2
8702769 Eckhouse et al. Apr 2014 B2
8709011 Eckhouse et al. Apr 2014 B2
8771263 Epshtein et al. Jul 2014 B2
8771268 Kreindel Jul 2014 B2
8778003 Eckhouse et al. Jul 2014 B2
8814922 Hennings et al. Aug 2014 B2
8906015 Kreindel Dec 2014 B2
8936593 Epshtein et al. Jan 2015 B2
D724749 Koby et al. Mar 2015 S
8979830 Hennings Mar 2015 B2
8979833 McGill et al. Mar 2015 B2
9011419 Flyash et al. Mar 2015 B2
9037229 Bar-El et al. May 2015 B2
D732679 Assa et al. Jun 2015 S
D733310 Assa et al. Jun 2015 S
9084587 Eckhouse et al. Jul 2015 B2
D735866 Assa et al. Aug 2015 S
9144463 Hennings et al. Sep 2015 B2
9277958 Schomacker et al. Mar 2016 B2
9278230 Levin et al. Mar 2016 B2
9314293 Rosenberg Mar 2016 B2
9301588 Eckhouse et al. Apr 2016 B2
9308046 Schomacker et al. Apr 2016 B2
9381057 Schomacker et al. Jul 2016 B2
9486285 Paithankar et al. Nov 2016 B2
9496678 Bhawalkar et al. Nov 2016 B2
9539439 Jones et al. Jan 2017 B2
9585687 Tenenbaum et al. Mar 2017 B2
9597528 Schomacker et al. Mar 2017 B2
9722392 Bhawalkar et al. Aug 2017 B2
9889297 Schomacker Feb 2018 B2
9895188 Schomacker et al. Feb 2018 B2
20040210214 Knowlton Oct 2004 A1
20060036300 Kreindel Feb 2006 A1
20060047281 Kreindel Mar 2006 A1
20060241440 Eshel et al. Oct 2006 A1
20070038201 Koop et al. Feb 2007 A1
20070073367 Jones et al. Mar 2007 A1
20070173799 Hsia Jul 2007 A1
20070191827 Lischinsky et al. Aug 2007 A1
20070270785 Jones et al. Nov 2007 A1
20070287949 Levin et al. Dec 2007 A1
20070292445 Levin Dec 2007 A1
20080004678 Kreindel Jan 2008 A1
20080021527 Hennings et al. Jan 2008 A1
20080091179 Durkin et al. Apr 2008 A1
20080161888 Hisa Jul 2008 A1
20080188846 Palanker et al. Aug 2008 A1
20080214988 Altshuler et al. Sep 2008 A1
20080215040 Paithankar et al. Sep 2008 A1
20080221649 Echague et al. Sep 2008 A1
20080269734 Echague et al. Oct 2008 A1
20080274166 Sacks et al. Nov 2008 A1
20080281236 Eshel et al. Nov 2008 A1
20080281389 Koop et al. Nov 2008 A1
20090036958 Mehta Feb 2009 A1
20090054743 Stewart Feb 2009 A1
20090099483 Rybyanets Apr 2009 A1
20090105706 Livneh Apr 2009 A1
20090112205 McGill et al. Apr 2009 A1
20090171251 Rybyanets et al. Jul 2009 A1
20090171254 Goland et al. Jul 2009 A1
20090186318 Assa et al. Jul 2009 A1
20090187175 Assa et al. Jul 2009 A1
20090187176 Assa et al. Jul 2009 A1
20090210766 Eckhouse et al. Aug 2009 A1
20090221938 Rosenberg et al. Sep 2009 A1
20090227995 Bhawalkar et al. Sep 2009 A1
20100004536 Rosenberg Jan 2010 A1
20100010480 Mehta et al. Jan 2010 A1
20100010484 Mehta et al. Jan 2010 A1
20100016846 Hennings et al. Jan 2010 A1
20100017750 Rosenberg et al. Jan 2010 A1
20100016727 Rosenberg Feb 2010 A1
20100016761 Rosenberg Feb 2010 A1
20100042020 Ben-Ezra Feb 2010 A1
20100042085 Hennings et al. Feb 2010 A1
20100049098 Shalgi et al. Feb 2010 A1
20100066918 Gupta et al. Mar 2010 A1
20100100014 Eshel et al. Apr 2010 A1
20100106064 Kreindel et al. Apr 2010 A1
20100106145 Widgerow Apr 2010 A1
20100174224 Sohn Jul 2010 A1
20100185193 Kriendel Jul 2010 A1
20100185194 Kriendel Jul 2010 A1
20100198134 Eckhouse et al. Aug 2010 A1
20100198199 Kriendel Aug 2010 A1
20100198216 Palanker Aug 2010 A1
20100204619 Rosenberg Aug 2010 A1
20100204694 Mehta et al. Aug 2010 A1
20100217254 Mehta Aug 2010 A1
20100249772 Mehta et al. Sep 2010 A1
20100256617 Domankevitz et al. Oct 2010 A1
20100262135 Berube Oct 2010 A1
20100293807 Bar-El et al. Nov 2010 A1
20110015549 Eckhouse et al. Jan 2011 A1
20110129522 MeVorat-Kaplan et al. Jun 2011 A1
20110137386 Kriendel Jun 2011 A1
20110150976 Levin et al. Jun 2011 A1
20110264173 Flyash et al. Jul 2011 A1
20110190745 Uebelhoer et al. Aug 2011 A1
20110218525 Hennings et al. Sep 2011 A1
20110251527 Kushculey et al. Oct 2011 A1
20110270364 Kriendel et al. Nov 2011 A1
20120004548 Eshel et al. Jan 2012 A1
20120022504 Haim et al. Jan 2012 A1
20120022627 Rosenberg Jan 2012 A1
20120136280 Rosenberg et al. May 2012 A1
20120136282 Rosenberg et al. May 2012 A1
20120123397 Haim et al. Jun 2012 A1
20120143178 Mehta Jun 2012 A9
20120150079 Rosenberg Jun 2012 A1
20120150168 Rosenberg Jun 2012 A1
20120157838 Adanny et al. Jun 2012 A1
20120158100 Schomacker Jun 2012 A1
20120172869 McGill et al. Jul 2012 A1
20120197242 Rosenberg Aug 2012 A1
20120270743 Weisgerber et al. Oct 2012 A1
20120271219 Weisgerber et al. Oct 2012 A1
20120277587 Adanny et al. Nov 2012 A1
20120310311 Elkah Dec 2012 A1
20130023855 Hennings et al. Jan 2013 A1
20130041308 Hennings et al. Feb 2013 A1
20130072914 Domankevitz et al. Mar 2013 A1
20130123629 Rosenberg et al. May 2013 A1
20130150841 Schomacker et al. Jun 2013 A1
20130178764 Eckhouse et al. Jul 2013 A1
20130211347 Arbel et al. Aug 2013 A1
20130218146 Hennings et al. Aug 2013 A1
20130226075 Hennings et al. Aug 2013 A1
20130261436 Hennings et al. Oct 2013 A1
20130261437 Hennings et al. Oct 2013 A1
20130261454 Hennings et al. Oct 2013 A1
20130274841 Eckhous et al. Oct 2013 A1
20130310714 Eshel et al. Nov 2013 A1
20140005658 Rosenbergr Jan 2014 A1
20140025062 Rosenberg et al. Jan 2014 A1
20140081250 Eckhouse et al. Mar 2014 A1
20140200564 Schomacker et al. Jul 2014 A1
20140214022 Adanny et al. Jul 2014 A1
20140221990 Kreindel Aug 2014 A1
20140228834 Adanny et al. Aug 2014 A1
20140249522 Adanny et al. Sep 2014 A1
20140296852 Adanny et al. Oct 2014 A1
20150032092 Addany Jan 2015 A1
20150250543 Israeli et al. Sep 2015 A1
20150265492 Eckhouse et al. Sep 2015 A1
20150283026 Rosenberg Oct 2015 A1
20150328474 Flyash et al. Nov 2015 A1
20150366611 Rosenberger et al. Dec 2015 A1
20160045265 Bhawalkar et al. Feb 2016 A1
20160143692 Shang et al. May 2016 A1
20160367830 Eisenmann Dec 2016 A1
20170014174 Levine et al. Jan 2017 A1
20170136237 Rosenberg et al. May 2017 A1
20170266457 Eckhouse et al. Sep 2017 A1
20170304641 Eisenmann et al. Oct 2017 A1
Foreign Referenced Citations (116)
Number Date Country
200017948 May 2003 AU
199964868 Jan 2005 AU
2002307781 Jan 2007 AU
2006209047 May 2012 AU
2011292747 Mar 2014 AU
PI0606804 Jan 2006 BR
2610757 Dec 2006 CA
2696227 Apr 2009 CA
2704740 Apr 2009 CA
2704164 May 2009 CA
2747767 Sep 2010 CA
2356175 Oct 2011 CA
2349169 Aug 2012 CA
200680003537.7 Jan 2006 CN
200780008298.9 Jul 2007 CN
101232852 Jul 2008 CN
200880019693.1 Jun 2013 CN
200880101512.X Jun 2013 CN
0569670 Nov 1993 EP
1140280 Dec 1999 EP
2272455 Sep 2001 EP
1502622 Apr 2002 EP
2286751 Mar 2003 EP
1320333 Jun 2003 EP
1850781 Jan 2006 EP
2527005 Feb 2007 EP
1852060 Nov 2007 EP
1863569 Dec 2007 EP
1888001 Dec 2007 EP
2200666 Oct 2008 EP
2205967 Oct 2008 EP
2211918 Oct 2008 EP
1502622 Jun 2009 EP
2393444 Feb 2010 EP
2401026 Feb 2010 EP
2730313 Feb 2010 EP
2319445 Sep 2010 EP
2319577 May 2011 EP
2394594 Dec 2011 EP
2139560 May 2012 EP
2205967 May 2013 EP
2190525 Jul 2013 EP
2605718 Mar 2014 EP
1499255 Jul 2015 EP
1955731 Aug 2015 EP
1128870 Aug 2016 EP
1450876 Aug 2016 EP
1502622 Apr 2002 FR
1320333 Jun 2003 FR
1320333 Jun 2003 GB
181112 Aug 2005 IL
188968 Jul 2006 IL
202907 Jan 2007 IL
193497 Feb 2007 IL
143014 Sep 2007 IL
187608 Nov 2007 IL
202558 Jun 2008 IL
206652 Dec 2008 IL
206654 Dec 2008 IL
213561 Jun 2011 IL
158582 Feb 2012 IL
219219 Apr 2012 IL
184869 May 2012 IL
226319 May 2013 IL
203339 Jul 2014 IL
200992 Aug 2014 IL
204969 Mar 2015 IL
4745500 May 2000 JP
2008-515379 May 2008 JP
4837723 Aug 2008 JP
4262985 Feb 2009 JP
2009-527269 Jul 2009 JP
4335522 Jul 2009 JP
4382991 Oct 2009 JP
4452511 Feb 2010 JP
2010-528803 Aug 2010 JP
4638130 Dec 2010 JP
5507022011 Jun 2011 JP
2011-237691 Nov 2011 JP
5116488 Oct 2012 JP
2012-542684 Apr 2013 JP
5294852 Jun 2013 JP
2013-538323 Oct 2013 JP
5389025 Oct 2013 JP
5466161 Jan 2014 JP
5508272 Mar 2014 JP
5612474 Sep 2014 JP
5620458 Sep 2014 JP
5934211 May 2016 JP
10-2007-0116253 Dec 2007 KR
10-2008-0025028 Mar 2008 KR
10-2010-0044161 Apr 2010 KR
10-2010-0065297 Jun 2010 KR
10-2012-0037011 Apr 2012 KR
2012-0111725 Oct 2012 KR
10-1227286 Jan 2013 KR
10-1246980 Mar 2013 KR
10-1272372 May 2013 KR
2013-0128391 Nov 2013 KR
1679467 Nov 2016 KR
WO 0038781 Jul 2000 WO
WO 01085234 Nov 2001 WO
WO 02092163 Nov 2002 WO
WO 2007013072 Feb 2007 WO
WO 2007093998 Aug 2007 WO
WO 2008091625 Jul 2008 WO
WO 2008152630 Dec 2008 WO
WO 2009057112 May 2009 WO
WO 2010097790 Sep 2010 WO
WO 2010115196 Oct 2010 WO
WO 2011067771 Jun 2011 WO
WO 2012011098 Jan 2012 WO
WO 2012023129 Feb 2012 WO
WO 2012063236 May 2012 WO
WO 2014141229 Sep 2014 WO
WO 2017130185 Aug 2017 WO
Non-Patent Literature Citations (1)
Entry
Guidelines for Limiting Exposure to Time-Varying Electric, Magnetic, and Electromagnetic Fields (Up to 300 GHz), International Commission on Non-Ionizing Radiation Protection, ICNIRP Guidelines, Apr. 1998, vol. 74, No. 4, pp. 496-522.
Related Publications (1)
Number Date Country
20150297283 A1 Oct 2015 US
Continuations (3)
Number Date Country
Parent 14252832 Apr 2014 US
Child 14791840 US
Parent 13400434 Feb 2012 US
Child 14252832 US
Parent 12505576 Jul 2009 US
Child 13400434 US