1. Field of the Invention
The invention relates to a heat transfer apparatus for a memory module.
2. Description of the Related Art
Semiconductor devices continue to shrink while the operational frequencies of the devices constantly increase. The combination of reduced size and higher frequencies results in a higher power density that increases the temperature of the devices. Cooling solutions are used to prevent overheating of the devices, which may for example lead to malfunction, reduced functionality or even destruction of the devices.
Cooling solutions are employed in many technical fields including, for example, consumer electronics (e.g. TV sets or HiFi components), computer (e.g. for processors, memories, chip sets or hard disks), or industrial electronics (e.g. power amplifier).
The afore said applies as well to memory modules for computer. For example, memory modules may be DIMMs (Dual Inline Memory Module), registered DIMMs, fully buffered DIMMS, SO-DIMMs or any other type of memory module.
The accompanying drawings are included to provide a further understanding of embodiments and are incorporated in and constitute part of the specification. The drawings illustrate embodiments and together with the description serve to explain principles of embodiments. Other embodiments and many of the intended advantages of embodiments will be readily appreciated as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.
In the following detailed description reference is made to the accompanying drawings which form part thereof and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard directional terminology such as “top”, “bottom”, “front”, “back”, “leading”, “trailing”, etc. is used with reference to the orientation of the Figures being described. Because components of embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description therefore is not to be taken in a limiting sense and the scope of the present invention is defined by the appended claims.
It is to be understood that the features of the various examples described herein may be combined with each other, unless specifically noted otherwise.
While the invention is described with respect to memory modules, it is not limited thereto. The invention may be used with any kind of module which comprises electronic components producing heat. For example, these modules may be processor modules, daughter cards, or power modules.
The illustrated memory module 1 may be inserted into a memory socket 5 that may be arranged on a motherboard of a computer system. A motherboard usually comprises two or more memory sockets 5 that are arranged in parallel so that inserted memory modules 1 are aligned in parallel relatively close to each other.
The memory module 1, as illustrated in
Reference is made to the top or the sides of the memory module. In this description, top of the memory module means opposite to connectors of the memory module that engage the socket 5. The sides of the memory module are the surfaces between the top and the connectors.
The terms top and sides are used to facilitate the understanding of the description. If a memory module is mounted horizontally (e.g. in a daughter board), or inclined (e.g. in a blade server) the heat transfer apparatus might not be arranged on top of the memory module as seen from a system point of view.
As seen from a memory module view the heat transfer apparatus is on top of the memory module. The terms used herein refer to the memory module view.
The heat transfer apparatus 10 may be secured to the memory module 1 by attachment parts 14. In the illustrated embodiment of
The heat transfer apparatus 10 further comprises a contact portion 15, which contacts the heat spreader 3 in order to transfer heat from the heat spreader 3 and thereby from the memory module 1 to the heat transfer apparatus 10. To facilitate heat transfer from the heat spreader 3 to the heat transfer apparatus 10, thermal interface material, such as thermal grease, may be used between the heat spreader 3 and the contact portion 15. The contact portion 15 may be resilient or bent inwards (i.e. towards the heat spreader 3) for good contact between the heat spreader 3 and the contact portion 15.
In one embodiment, the heat transfer apparatus 10 may be one piece, for example integrally formed from a piece of aluminum or copper. In another embodiment, the heat transfer apparatus 10 may comprise metal, graphite, or a combination of both. The whole heat transfer apparatus 10 may be resilient, not only the attachment parts 14 or the contact portion 15. The attachment parts 14 and the contact portions 15 extend from the sidewalls 13. The attachment parts 14 and the contact portions 15 may be part of the sidewalls 13, while the parts of the sidewalls 13 that are defining the channel 11 are stretching continuously and the attachment parts 14 and the contact portions 15 are divided by recesses 13a in the sidewalls 13. In one embodiment, the recesses in the sidewalls 13 may be adapted to fit over a protrusion, for example the clips 4, of the heat spreader 3.
As can be seen from the front view illustrated in
The orientation of the heat transfer apparatus 10 is labeled as a front view. This is with reference to the direction of a cooling medium which flows parallel to the length of the channel 11. One could designate
Referring back to
As illustrated in
As an example of operation, the electrical components of the memory module 1 may heat up during operation. The heat may spread into the heat spreaders 3 and is transferred by the attachment parts 14 and the contact portion 15 to the sidewalls 13. The contact portions 15 are optional. Depending on the circumstances, only one contact portion 15 or no contact portion is needed to transport the heat away from the heat spreader 3 towards the sidewalls 13.
A cooling medium, usually air, may be streaming along the memory module 1, thereby taking away heat from the heat spreader 3 at the sides of the memory module 1. Additional cooling may be achieved by the channel 11. Part of the surrounding air stream flows through the channel 11, thereby taking away heat from the sidewalls 13, the top wall 12, and the top of the memory module 1. Another part of the air stream flowing along the outer boundaries of the channel 11 (i.e. the top wall 13 and the sidewalls 13) takes away heat as well.
Another embodiment of the invention is illustrated in
The heat transfer apparatus 20 may include a channel 21 defined by an upper wall 22 and two sidewalls 23. In an attached state of the heat transfer apparatus 20 the channel 21 may be arranged above the memory module 1. The heat transfer apparatus 20 may be attached to the heat spreader 6 by attachment parts 24, which may be arranged on each side of the memory module 1. In the illustrative embodiment shown in
The memory module 1 may comprise a hot spot (e.g. a logic chip including a register or a buffer chip). The heat transfer apparatus 20 may include a contact portion 25 to establish thermal communication to the hot spot of the memory module 1. The contact portion 25 may be arranged at one side of the heat transfer apparatus and may contact a certain part of the heat spreader 6 above the hot spot.
In one embodiment, it may be possible as well to provide multiple contact portions. In another embodiment, central contact portions adapted to fit in between the pair of clips 4 may be provided. In case of a memory module without clips, the attachment parts and the contact portions may be integrated into one portion. This particular portion may be an extension of the sidewall 23 and may span the whole length of the heat transfer apparatus. This particular portion may be provided at both sides of the heat transfer apparatus.
In one embodiment, the attachment parts 24 and the contact portion 25 may each comprise an elongated recess 26 which is adapted to fit over the reinforced edge of the heat spreader 6.
As seen in
The above description refers several times to an assembled unit (i.e. a memory unit with attached heat transfer apparatus). Those skilled in the art will appreciate that the invention may not only encompass the assembled unit but the discrete add-on as well. For example, the memory unit including a heat spreader may be a base unit while the heat transfer apparatus may be designed as an add-on to the heat spreader of the memory module.
The illustrated examples may be combined or certain features of one example may be implemented in a different example. The elongated recess 26 of the example shown in
Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that a variety of alternate and/or equivalent implementations may be substituted for the specific embodiments shown and described without departing from the scope of the present invention. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore it is intended that this invention be limited only by the claims and the equivalents thereof.