Many aspects of the present method and apparatus for laser machining can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present method and apparatus for laser machining.
Referring to
(1): Providing a workpiece 140 and placing the workpiece 140 onto a laser machining station 110, the laser machining station 110 being configured (i.e., structured and arranged) for providing an initial ambient temperature T0 for the placed workpiece, and the workpiece 140 including a predetermined machining region 150.
The workpiece 140 can be made of brittle materials such as glass, silica, or other ceramic materials. It is preferred that the workpiece 140 has a board-like shape.
The laser machining station 110 is adapted to support the workpiece 140 and can be made of materials such as metal.
(2): Heating the machining region 150 of the workpiece 140 to a predetermined temperature between the initial ambient temperature T0 and the melting temperature of the workpiece material Tm.
A heating source 130 is adapted to heat the machining region 150 of the workpiece 140 and form a temperature field in the machining region 150 and its vicinity. The temperature of this field is predetermined substantially based on the material composition and the thickness of the workpiece 140 and should be chosen to be below the melting temperature of the workpiece material. Preferably, this temperature should be approximately between 120 degrees Celsius and 150 degrees Celsius.
The heating source 130 is an air-ejecting apparatus, which blows hot air at a predetermined temperature onto the surface of the machining region 150 of the workpiece 140 and increases the temperature of region 150 and its vicinity. The temperature of the hot air should be chosen to be between the initial ambient temperature T0 and the melting temperature of the workpiece material Tm. For example, if the workpiece is made of glass, the temperature of the hot air should preferably be approximately between 120 degrees Celsius and 150 degrees Celsius. The heating performed this way is uniform and easy to control. In addition, using an air-ejecting apparatus to heat the workpiece 140 does not leave any residue on the workpiece.
(3): Machining the machining region 150 of the workpiece 140 with a laser beam generated by a laser beam source.
A laser beam is generated by a laser beam source 120 and configured to machine the workpiece 140 in the machining region 150. The laser beam source 120 can be a gaseous state laser beam source, a liquid state laser beam source, or a solid state laser beam source such as a semiconductor laser. Preferably a 355 nm wavelength 3 Watt solid-state laser beam source should be used.
Referring to
Preferably, the laser beam source 120 and the heating source 130 are relatively fixed to each other, or alternatively, the heating source 130 can move relatively to the laser beam source 120 within a vicinity thereof during the process of machining. By moving the laser beam source 120 and the heating source 130 together as a whole relatively to the workpiece 140, such as moving the laser machining station 110 along the arrowed direction in
The heating source 130 can be other sources such as an electric oven. An electric oven can be placed under the workpiece 140 and used to heat the workpiece 140 through radiation of the heat generated by a heating resistance wire in the electric oven. The electric oven and the laser beam source 120 can move together as a whole relatively to the workpiece 140.
Compared with the related art, the laser machining method in this preferred embodiment of the present invention utilizes the heating source 130 to preheat the machining region 150 prior to laser machining the region and thereby reduces the temperature gradient and the gradient of heat expansion therein caused by the machining process. As a result, the formation of small cracks on the workpiece 140 due to machining is substantially avoided. In some cases, a cooling procedure can be applied following the laser machining process in order to further facilitate cutting the workpiece.
Referring to
The heating source 130 is an air-ejecting apparatus adapted to blow hot air on the surface of the workpiece 140 and thus raise the temperature thereof.
The laser beam source 120 can be a gaseous state laser beam source, a liquid state laser beam source, or a solid state laser beam source such as a semiconductor laser beam source. Preferably, a 355 nm wavelength 3 Watt solid state laser beam source should be used.
Preferably, the laser beam source 120 and the heating source 130 can be fixed to each other during the process of machining, or alternatively, the heating source 130 can move relatively to the laser beam source 120 within a vicinity thereof. In addition, the laser beam source 120 and the heating source 130 can move together as a whole relative to the workpiece 140. For example, the laser machining station 110 can move along the arrowed direction in
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the present invention.
Number | Date | Country | Kind |
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200610062437.3 | Sep 2006 | CN | national |