Claims
- 1. A method for a substantially photolytic photodepostion of cobalt film on a surface of a photomask substrate disposed in a reaction chamber comprising the steps of:
- (a) introducing gaseous Co.sub.2 (CO).sub.8 at low vapor pressure into said chamber;
- (b) focusing a beam of coherent, visible light at or near the surface of said substrate to initiate deposition of cobalt on said surface.
- 2. A method for deposition of metal containing films on a surface of a substrate disposed in a reaction chamber comprising the steps of:
- (a) introducing a gaseous metal oxyhalide vapor precursor into said chamber wherein the metal of the metal oxyhalide is selected from the group consisting of Tantalum (Ta), Niobium (Nb) and Vanadium (V);
- (b) generating a beam of visible light directed at or near the surface upon which deposition is desired; and
- (c) initiating deposition with said beam of visible light via a substantially photolytic dissociation of said precursor, resulting in formation of metallic material on said substrate surface.
- 3. The method of claim 2 wherein the precursor is VOClhd 3.
- 4. A method for deposition of metal containing films on a surface of a substrate disposed in a reaction chamber comprising the steps of:
- (a) introducing a gaseous nitrosylcarbonyl vapor precursor into said chamber;
- (b) generating a beam of visible light directed at or near the surface upon which deposition is required;
- (c) initiating deposition with said beam of visible light via a substantially photolytic dissociation of said precursor resulting in formation of metal containing material on said substrate surface.
- 5. The method of claim 4 wherein the metal containing nitrosylcarbonyl vapor precursor is taken from the class comprising Co(CO).sub.3 NO and Fe(CO).sub.2 (NO).sub.2.
- 6. A method for deposition of metal films on a surface of a substrate disposed in a reaction chamber comprising the steps of:
- (a) introducing a visible absorbing gaseous metal precursor compound containing PF.sub.3 groups into said reaction chamber;
- (b) generating a beam of visible light directed at or near the surface upon which deposition is required;
- (c) initiating deposition with said beam of visible light via a substantially photolytic dissociation of said precursor resulting in formation of metal containing material on said substrate surface.
- 7. The method of claim 6 wherein the precursor is Pt(PF.sub.3).sub.4.
RELATED APPLICATION
This application is a continuation of U.S. patent application Ser. No. 26,062, Mar. 16, 1987 now U.S. Pat. No. 4,748,045 which is a Continuation-In-Part of U.S. patent application Ser. No. 849,710 filed Apr. 9, 1986,now U.S. Pat. No. 4,668,528 which are incorporated herein by reference.
GOVERNMENT SUPPORT
The Government has rights in this invention pursuant to Contract No. F19628-76-C-0002 and F19628-78-C-0002 awarded by the U.S. Air Force.
US Referenced Citations (9)
Continuations (1)
|
Number |
Date |
Country |
Parent |
26062 |
Mar 1987 |
|
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
849710 |
Apr 1986 |
|