Information
-
Patent Grant
-
6482072
-
Patent Number
6,482,072
-
Date Filed
Thursday, October 26, 200024 years ago
-
Date Issued
Tuesday, November 19, 200222 years ago
-
Inventors
-
Original Assignees
-
Examiners
Agents
- Moser, Patterson & Sheridan
-
CPC
-
US Classifications
Field of Search
US
- 451 311
- 451 168
- 451 307
- 451 4
- 451 304
- 451 499
- 451 500
- 451 317
- 474 101
- 474 125
- 125 1602
-
International Classifications
-
Abstract
Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.
Description
BACKGROUND OF THE DISCLOSURE
1. Field of Invention
Embodiments of the present invention relate generally to a system and a method for supporting a web in a polishing system.
2. Background of Invention
In semiconductor wafer processing, the use of chemical mechanical planarization, or CMP, has gained favor due to the enhanced ability to increase device density on a semiconductor workpiece, or substrate, such as a wafer. As the demand for planarization of layers formed on wafers in semiconductor fabrication increases, the requirement for greater system (i.e., process tool) throughput with less wafer damage and enhanced wafer planarization has also increased.
CMP systems generally include a polishing head, a platen and polishing material disposed on the platen. A substrate retained in the polishing head is pressed against the polishing material and moved relative to the polishing material in the presence of a polishing fluid. Abrasives, typically contained in the polishing fluid or polishing material, remove material from the surface of the substrate synergistically with the chemical activity provided by the polishing fluid.
One type of polishing material that includes abrasives disposed therein is known as fixed abrasive material. The fixed abrasive material comprises a plurality of abrasive particles suspended in a resin binder that is disposed in discrete elements on a backing sheet. As the abrasive particles are contained in the polishing material itself, systems utilizing fixed abrasive material generally use polishing fluid that do not contain abrasives. Such polishing fluids enhance the service life of their fluid delivery systems.
Fixed abrasive polishing material is generally available in stick-down form but is often utilized in the form of a web. Generally, the web is periodically advanced over the course of polishing a number of substrates as the polishing surface of the web is consumed by the polishing process. A vacuum is typically applied between the web and platen to fix the web to the platen during the polishing process. When the web is advanced, the vacuum is removed, freeing the web from the platen's surface.
However, indexing the web across a polishing platen is sometimes difficult. Fluids that come in contact with the web may cause surface tension or attraction to develop between the web and the underlying surface of the platen.
This surface tension must be over-come to accomplish advancement of the web. If the attraction between the web and platen is great, the indexing means may not be able to index the web or the web may become damaged during the indexing process.
Providing a cushion of gas between the web and platen assists in overcoming the attraction between the web and platen. The gas lifts the web to a spaced-apart relation to the platen where the web may be freely indexed. However, providing gas to the area between the web and platen is complicated, and requires rotary union and process tubing to be routed through an already crowded platen.
Therefore, there is a need for an improved apparatus that supports a web of polishing material.
SUMMARY OF INVENTION
One aspect of the invention generally provides an apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The frame assembly may be actuated to lift the web into a space-apart relation relative to the platen.
In another aspect of the invention, method for supporting a web of polishing material is provided. In one embodiment, the method includes the steps of supporting a web across a frame at least partially circumscribing a platen and moving the frame assembly in relation to the platen. In one position, the frame assembly places the web in a space-apart relation relative to the platen.
In another aspect of the invention, an apparatus for tensioning a web of polishing material between a supply roll and a take-up roll is provided. In one embodiment, the apparatus includes a first drive adapted to pull the polishing material in a first direction, a clutch mechanism coupled to the first drive, and a second drive adapted to pull the polishing material in a second direction that opposes the first direction.
In another aspect of the invention, a method for tensioning a web of polishing material between a supply roll and a take-up roll is provided. In one embodiment, the method includes the steps of driving a first motor to urge the polishing material in a first direction, and driving a second motor to urge the polishing material in a second direction that opposes the first direction. In another embodiment, a method for tensioning includes the steps of disposing the web across a polishing platen having a guide supporting the web at one end of the platen, disposing a first sensor between the platen and one end of the guide, disposing a second sensor between the platen and another end of the guide, and generating a signal from the first and second sensors that is indicative of web tension.
BRIEF DESCRIPTION OF DRAWINGS
The teachings of the present invention can be readily understood by considering the following detailed description in conjunction with the accompanying drawings, in which:
FIG. 1
is a plan view of a chemical mechanical planarization system of the invention;
FIG. 2
is a sectional view of a polishing station taken along section line
2
—
2
of
FIG. 1
;
FIG. 3
is a plan view of one embodiment of a platen assembly;
FIG. 4A
depicts a polishing material disposed between a supply assembly and a take-up assembly;
FIG. 4B
depicts a sensor for indicating the movement of a polishing material;
FIG. 4C
is a sectional view of the platen assembly taken along section line
4
C—
4
C of
FIG. 3
; and
FIG. 5
is another embodiment of a platen assembly.
To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures.
DETAILED DESCRIPTION OF INVENTION
FIG. 1
depicts a plan view of one embodiment of a chemical mechanical polisher
100
having a platen assembly
108
. One polisher
100
that can be used to advantage with the present invention is a REFLEXIONS™ Chemical Mechanical Polisher, manufactured by Applied Materials, Inc., located in Santa Clara, Calif. Although the platen assembly
108
is described on one configuration of a chemical mechanical polisher, one skilled in the art may advantageously adapt embodiments of platen assembly
108
as taught and described herein to be employed on other chemical mechanical polishers that utilize a web of polishing material.
An exemplary polisher
100
is generally described in U.S. patent application Ser. No. 09/244,456, filed Feb. 4, 1999 to Birang et al., which is incorporated herein by reference in its entirety. The polisher
100
generally comprises a loading robot
104
, a controller
110
, a transfer station
136
, a plurality of polishing stations
132
each including one platen assembly
108
, a base
140
and a carousel
134
that supports a plurality of polishing heads
152
. Generally, the loading robot
104
is disposed proximate the polisher
100
and a factory interface (not shown) to facilitate the transfer of substrates
122
therebetween.
The transfer station
136
generally includes a transfer robot
146
, an input buffer
142
, an output buffer
144
and a load cup assembly
148
. The input buffer station
142
receives a substrate
122
from the loading robot
104
. The transfer robot
146
moves the substrate
122
from the input buffer station
142
and to the load cup assembly
148
where it may be transferred between the polishing head
152
. An example of a transfer station that may be used to advantage is described by Tobin in U.S. patent application Ser. No. 09/314,771, filed Oct. 6, 1999, which is incorporated herein by reference in its entirety.
To facilitate control of the polisher
100
as described above, the controller
110
comprising a central processing unit (CPU)
112
, support circuits
116
and memory
114
, is coupled to the polisher
100
. The CPU
112
may be one of any form of computer processor that can be used in an industrial setting for controlling various polishers, drives, robots and subprocessors. The memory
114
is coupled to the CPU
112
. The memory
114
, or computer-readable medium, may be one or more of readily available memory such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, or any other form of digital storage, local or remote. The support circuits
116
are coupled to the CPU
112
for supporting the processor in a conventional manner. These circuits include cache, power supplies, clock circuits, input/output circuitry, subsystems, and the like.
Generally, the carousel
134
has a plurality of arms
150
that each support one of the polishing heads
152
. Two of the arms
150
depicted in
FIG. 1
are shown in phantom such that a polishing material
102
disposed on one of the polishing stations
132
and the transfer station
136
may be seen. The carousel
134
is indexable such that the polishing heads
152
may be moved between the polishing stations
132
and the transfer station
136
.
Generally, a chemical mechanical polishing process is performed at each polishing station
132
by moving the substrate
122
retained in the polishing head assembly
152
relative to the polishing material
102
supported on the polishing station
132
. The web of polishing material
102
may have a smooth surface, a textured surface, a surface containing a fixed abrasive or a combination thereof. The web of polishing material
102
may be advanced across or releasably fixed to the polishing surface. Typically, the web of polishing material
102
is releasably fixed by adhesives, vacuum, mechanical clamps or by other holding methods to the polishing station
132
.
The web of polishing material
102
generally has a polishing side
256
and a backside
258
. In one embodiment, the polishing side
256
of the polishing material
102
includes fixed abrasives. Fixed abrasives typically comprise a plurality of abrasive particles suspended in a resin binder that is disposed in discrete elements on a backing sheet. Examples of such fixed abrasive pads are available from Minnesota Manufacturing and Mining Company, of Saint Paul, Minn. The web of polishing material
102
may optionally comprise conventional polishing material without fixed abrasives, for example, polyurethane foam available from Rodel Inc., of Newark, Del.
Generally, a conditioning device
182
is disposed on the base
140
adjacent each polishing station
132
. The conditioning device
182
periodically conditions the polishing material
102
to maintain uniform polishing results.
The polishing head
152
is generally coupled to the carousel
102
by a drive system
106
. The drive system
106
generally provides motion to the polishing head
152
during processing. In one embodiment, the polishing head
152
is a TITAN HEAD™ wafer carrier manufactured by Applied Materials, Inc., Santa Clara, Calif. Generally, the polishing head
152
comprises a housing in which is disposed a bladder (not shown). The bladder may be controllably inflated or deflated. The bladder, when in contact with the substrate
122
, retains the substrate
122
within the polishing head
152
by deflating, thus creating a vacuum between the substrate
122
and the bladder. A retaining ring (not shown) circumscribes the polishing head
152
to retain the substrate
122
within the polishing head
152
adjacent the bladder while polishing.
FIG. 2
depicts a sectional view of the polishing station
132
. The polishing station
132
generally includes a hub
202
and the platen assembly
108
that supports the polishing material
102
. The platen assembly
108
is supported above the base
140
by a bearing
204
. The hub
202
is coupled to the platen assembly
108
at one end and is coupled to a drive system
206
(e.g., an electric motor) at the opposite end. The drive system
204
provides rotational motion to the hub
202
, causing the platen assembly
108
to rotate.
Generally, an area of the base
140
circumscribed by the bearing
204
is open and provides a conduit for the electrical, mechanical, pneumatic, control signals and connections communicating with the platen assembly
108
. Conventional bearings, rotary unions and slip rings (not shown) are provided such that electrical, mechanical, pneumatic, control signals and connections are coupled between the base
140
and the rotating hub
202
and platen assembly
108
.
The platen assembly
108
generally comprises a frame assembly
208
, a platen
230
, at least one flexure
210
and at least one actuator
212
. A first side
214
of the platen
230
is coupled to the hub
202
. A second side
216
of the platen
230
supports the web of polishing material
102
. The flexure
210
is coupled between the platen
230
and frame assembly
208
. The flexure
210
allows the frame assembly
208
to move vertically relative the platen
230
while preventing lateral and rotational motion between the frame assembly
208
and the platen
230
.
In one embodiment, the platen
230
is comprised of aluminum. The platen
230
has an upper portion
236
that supports the web of polishing material
102
. A top surface
260
of the platen
230
contains two side recesses
218
and a center recess
276
extending into the top portion
236
. Each side recess
218
respectively accommodates a first side
220
of the flexure
210
. The depth of the side recesses
218
are typically selected such that the flexure
210
is flush with the top surface
260
of the platen
230
. A plurality of fasteners
222
, such as screws, bolts, rivets and the like, secure the flexure
210
to the platen
230
. Alternatively, the flexure
210
may be secured to the platen
230
by other means such as clamping, welding, adhering and the like.
A subpad
278
and a subplate
280
are disposed in the center recess
276
. The subpad
278
is typically a plastic, such as polycarbonate or foamed polyurethane. Generally, the hardness or durometer of the subpad may be chosen to produce a particular polishing result. The subpad
278
generally maintains the polishing material
102
parallel to the plane of the substrate
122
held in the polishing head
152
and promotes global planarization of the substrate
122
. The subplate
280
is positioned between the subpad
278
and the bottom of the recess
276
such that the upper surface of the subpad
278
is maintained coplanar with the top surface
260
of the platen
230
.
A vacuum port
284
is provided in the recess
276
and is coupled to an external pump
282
. When a vacuum is drawn through the vacuum port
284
, the air removed between the polishing material
102
and the subpad
278
causes the polishing material
102
to be firmly secured to the subpad
278
during polishing. An example of such polishing material retention system is disclosed in U.S. patent application Ser. No. 09/258,036, filed Feb. 25, 1999, by Sommer et al., which is hereby incorporated herein by reference in its entirety. The reader should note that other types of devices may be utilized to releasably fix the polishing material
102
to the platen
230
, for example releasable adhesives, bonding, electrostatic chucks, mechanical clamps and other releasable retention mechanisms.
Optionally, to assist in releasing the polishing material
102
from the subpad
278
and platen
230
prior to advancing the polishing material
102
, surface tension caused by fluid that may be disposed between the subpad
278
and the polishing material
102
is overcome by a blast of fluid (e.g., air) provided through the vacuum port
284
or other port (not shown) into the recess
276
by the pump
282
(or other pump). The fluid pressure within the recess
276
moves through apertures (not shown) disposed in the subpad
278
and subplate
280
and lifts the polishing material
102
from the subpad
278
and the top surface
260
of the platen
230
. Alternatively, the subpad
278
may be a porous material that permits gas (e.g., air) to permeate therethrough and lift the polishing material
102
from the platen
230
. Such a method for releasing the web of polishing material
102
is described in U.S. Patent Application No. 60/157,303, filed Oct. 1, 1999, by Butterfield, et al., and is hereby incorporated herein by reference in its entirety.
The top portion
236
of the platen
230
may optionally include a plurality of passages
244
disposed adjacent to the recess
276
. The passages
244
are coupled to a fluid source (not shown). Fluid flowing through the passages
244
may be used to control the temperature of the platen
230
and the polishing material
102
disposed thereon.
The flexure
210
generally comprises a flexible material of sufficient strength to constrain the frame assembly
208
and platen
230
while the platen assembly
108
is rotating. Generally, the flexure
210
may comprise different geometric forms. For example, the geometry of the flexure
210
may be varied to control the flex characteristics and rigidity of the flexure
210
. By changing the geometry of the flexure
210
, design variations such as platen rotation speed, displacement of the frame assembly
208
relative to the platen
230
, weight of the frame assembly
208
and the number of flexures
210
incorporated into the platen assembly
210
may be accommodated. In one embodiment, the flexure
210
comprises a sheet of stainless steel, wherein one flexure
210
is fastened between each side recess
218
and the platen
230
. Other flexures
210
may include stiffening ribs, embossing, slots or have holes formed therein.
Generally, the first side
220
of the flexure
210
is coupled to the platen
230
and a second side
224
is coupled to the frame assembly
208
. Typically, the second side
224
is coupled to the side rails
244
using fasteners
226
in the same fashion as the first side
220
is coupled to the platen
230
.
The platen assembly
108
typically includes one or more actuators
212
that provide the bias force required to displace the frame assembly
208
in relation to the platen
230
. In one embodiment, the platen assembly
108
includes two actuators
212
, one mounted between each side rail
244
and the platen
230
. Generally, the actuator
212
is disposed on a mounting pad
240
that is coupled to the platen
230
. A rod
238
of the actuator
212
typically contacts a contact plate
242
that is disposed on the side rail
244
. The actuator
212
, shown in a retracted position in
FIG. 2
, has an extended position. In the extended position, the rod
238
urges the contact plate
242
away from the mounting plate
240
. The resulting force from the actuator
212
causes the flexure
210
to flex, allowing an upper surface
234
of the frame assembly
208
to elevate from a position coplanar with the top surface
260
of the platen
230
.
FIG. 3
depicts a plan view of one embodiment of the frame assembly
208
. The frame assembly
208
generally includes the two side rails
244
and the two end rails
246
. Optionally, guards
340
may be coupled to each of the rails
244
and
246
. The guards
340
, which are generally semicircular in shape, give the platen assembly
108
a circular plan form that shields the corners of the platen assembly
108
during rotation.
The rails
244
and
246
are coupled and define a rectangular center section
302
that accommodates the platen
230
. The side rails
244
have end sections
304
that extend beyond the end rails
246
. Mounted between one pair of end sections
304
on opposing end rails
246
is a web supply assembly
306
. A web take-up assembly
308
is mounted between the other pair of end sections
304
on the opposite side of the platen
230
. The web of polishing material
102
is disposed across the platen
230
between the web supply assembly
306
and web take-up assembly
308
. Generally the web supply assembly
306
holds an unused portion of the web of polishing material
102
while the web take-up assembly
308
holds a used portion of the web of polishing material
102
.
A first web drive
310
is coupled to one of the side rails
244
of the frame assembly
208
. The first web drive
310
generally tensions the web of polishing material
102
disposed across the platen
230
. The first web drive
310
additionally permits the web of polishing material
102
to be unwound from the web supply assembly
306
.
The first web drive
310
generally comprises a mounting pad
314
that supports a motor
316
. The mounting pad
314
is coupled to the side rail
244
. The motor
316
typically is an electric motor that incorporates a harmonic drive, however, other types of motors with or without gear reducers may be utilized. For example, solenoid, gear motors, hydraulic, electric motors, stepper, servo or air motors may be utilized. Disposed between the motor
316
and mounting pad
314
is a pulley
318
. The pulley
318
drives a belt
320
that turns a second pulley
332
. The second pulley
332
provides the rotary motion utilized to tension the web of polishing material
102
in the web supply assembly
306
. The belt
320
is typically a timing belt. Optionally, the belt
320
and pulleys
318
,
332
may be replaced with gears or other motion transfer devices.
A second web drive
312
is coupled on the opposite side of the platen
230
to one of the side rails
244
of the frame assembly
208
. The second web drive
312
may be coupled to the same or opposite side rail
244
that the first web drive
310
is coupled to. Generally, the second drive system
312
advances the web of polishing material
102
across the platen
230
from the web supply assembly
306
to the web take-up assembly
308
. Alternatively, the web drives
310
and
312
may be coupled to the platen
230
.
The second web drive
312
generally Comprises a mounting pad
322
that supports a motor
324
. The motor
324
is configured similarly to the motor
316
. The mounting pad
322
is coupled to the side rail
244
. The motor
324
is typically coupled to a clutch
326
that allows rotation in only one direction. The clutch
326
is configured to prevent the motor
324
from rotating in a direction that would allow the web of polishing material
102
to unwind from the takeup assembly
308
. Alternatively, the motor
324
, such as an electric motor, may be controlled in to prevent rotation, for example, by application of a brake or electronically through the motor controls.
Disposed between the clutch
326
and mounting pad
322
is a pulley
328
. The pulley
328
drives a belt
330
that turns a second pulley
334
. The second pulley
334
provides the rotary motion utilized to wind the web of polishing material
102
onto the web take-up assembly
308
. The belt
330
is typically a timing belt. Optionally, the belt
330
and pulleys
328
,
334
may be replaced with gears or other motion transfer devices.
Referring to
FIGS. 4A-4C
, one embodiment of the web supply assembly
306
and the web take-up assembly
308
that illustrates the movement of the web of polishing material
102
across the platen
230
. Generally, the web supply assembly
306
includes a supply roll
402
, an upper guide member
404
and a lower guide member
406
that are disposed between the side rails
244
. The supply roll
402
generally contains an unused portion of polishing material
102
and is configured to that it may easily be replaced with another supply roll containing new polishing material once the polishing material
102
disposed on the supply roll
402
has been consumed by the polishing process. One embodiment of a replaceable supply roll
402
is disclosed in the previously incorporated U.S. patent application Ser. No. 09/244,456 to Birang et al.
The supply roll
402
generally interfaces with the pulley
332
that is coupled to the mounting pad
314
. The belt
320
is disposed between the pulleys
318
and
332
such that the motion provided by the motor
316
is transferred to the supply roll
402
.
The lower guide member
406
is positioned to lead the web of polishing material
102
from the supply roll
402
to the upper guide member
404
. The upper guide member
404
is disposed between the side rails
244
such that the polishing material
102
leading off the roller
404
is disposed substantially coplanar (i.e., lies immediately adjacent and parallel) to the top surface
260
of the platen
230
. The guide members
404
and
406
may comprise a bar having a radius or chamfer that protects the polishing. material
102
moving thereover from damage. Alternatively, the guide members
404
and
406
may comprise rollers or shafts to further facilitate travel of the polishing material
102
thereover.
Generally, the web take-up assembly
308
includes a take-up roll
412
, an upper guide member
414
and a lower guide member
416
that are all disposed between the side rails
244
. The take-up roll
412
generally contains a used portion of polishing material
102
and is configured so that it may easily be replaced with an empty take-up roll once take-up roll
412
is filled with used polishing material
102
. The take-up roll
412
generally interfaces with the pulley
334
that is coupled to the mounting pad
322
. The belt
330
is disposed between the pulleys
328
and
334
such that the motion provided by the motor
324
is transferred to the take-up roll
412
.
The upper guide member
414
is positioned to lead the web of polishing material
102
from the platen
230
to the lower guide member
416
. The lower guide member
416
leads the web of polishing material
102
onto the take-up roll
412
. The guide members
416
and
418
may comprise a bar having a radius or chamfer that protects the polishing material
102
moving thereover from damage. Alternatively, the guide members
416
and
418
may comprise rollers or shafts to further ease the travel of the polishing material
102
.
The web of polishing material
102
is generally moved in relation to the platen
230
by balancing the forces between the motor
316
coupled to the supply assembly
306
and the motor
324
coupled to the takeup assembly
308
. For example, to advance the polishing material
102
across the platen
230
, the motor
324
Is driven to apply a greater force on the polishing material
102
than the motor
316
. The pull of polishing material
102
by the takeup roll
412
exceeds the opposing force applied to the supply roll
402
, thus causing the polishing material
102
to unwind from the supply roll
402
and be wound on the takeup roll
412
.
To control the amount of polishing material
102
advanced, a sensor is positioned to contact the polishing material
102
or one of the rollers in contact with the polishing material
102
. In one embodiment, a rotary encoder
440
coupled to the controller
110
, is disposed on one of the end rails
246
. The encoder
440
touches the surface of the polishing material
102
such that as the polishing material advances, a rotating element
442
of the encoder
440
is caused to rotate an amount corresponding to the linear displacement of the polishing material
102
. The encoder
440
provides feedback to controller
110
which is used to balance the force between the motors
316
,
324
so that the web of polishing material
102
may advance a predetermined amount.
Conversely the web of polishing material
102
is prevented from creeping across the platen
230
during polishing by driving the motor
316
to apply a greater force on the polishing material than the motor
324
. The motor
316
pulls the polishing material towards the supply roll
402
. As the take-up roll
412
can not unroll the polishing material
102
against the one-way clutch
326
disposed in the second drive system
312
, the polishing material
102
is stretched tightly (i.e., tensioned) between the supply roll
402
and take-up roll
412
.
Generally, one or both of the web supply assembly
306
or take-up assembly
308
incorporates a tension sensor
408
. In one embodiment, the sensor
408
is coupled to the lower guide member
416
. The lower guide member
416
is disposed between a notches
420
formed in an end
422
of opposing rails
244
. The tension sensor
408
generally comprises two load cells
423
, one disposed between each end of the guide bar
416
and the notch
420
. Alternatively, the tension sensor
408
may incorporated with other guide bars, the supply or take-up rolls.
Generally, the lower guide member
416
of the tension sensor
408
has a curved surface
424
(or alternatively a roller) that contacts the polishing material
102
. The guide member
416
has a through hole
426
disposed in each end of the guide member
416
. A mounting fastener
428
is disposed in the hole
428
and fastens the guide member
416
to each rail
244
.
Each hole
428
includes a counter bore
430
so that a head of the fastener
428
is disposed beneath the surface
424
as not to incidentally contact the polishing media
102
.
The load cells
432
are coupled to the controller
110
. Each load cell
432
is disposed on the fastener
428
between the guide member
416
and the rail
244
. The fastener
428
is typically a shoulder screw that captures the guide
416
and load cell
432
to the rail
244
without generating a load upon the cell
432
. The use of two load cells
432
, one on each side of the web of polishing material
102
permits the determination of the overall tension on the web of polishing material
102
along with the load upon each side of the web. The controller
110
enables a predetermined tension to be applied and maintained on the polishing material
102
by utilizing the tension sensed by the load cells
432
in conjunction with the force applied on the motor
316
.
Referring primarily to
FIGS. 2 and 3
, in one example of operation, the polishing material
102
is advanced across the platen
230
as follows. The vacuum applied between the platen
230
and the polishing material
102
is removed. Optionally, a blast of air may be provided between the platen
230
and the polishing material
102
. The actuator
212
is then activated to force the frame assembly
208
upwards relative to the platen
230
. The flexure
210
restricts the relative motion of the frame assembly
208
relative to the platen
230
so that the frame assembly
208
can only move coaxial to the platen
230
.
As the frame assembly
208
reaches an extended position, the upper guide members
404
,
414
that are coupled to the frame assembly
208
places the polishing material
102
in a spaced-apart relation to the top surface
260
of the platen
230
. In this spaced-apart position, the surface tension of fluids that may be disposed between the polishing material
102
and the platen
230
is overcome as the polishing material
102
is raised by the frame assembly
208
.
The force generated by the motor
324
disposed in the second drive system
312
is increased to overcome the force applied on the polishing material
102
by the motor
316
. Alternatively, the force generated by the motor
316
may be decreased alone or in conjunction with the increase of the force generated by the motor
324
. The imbalance of force on the polishing material
102
causes an unused amount of polishing material
102
to unwind from the web supply assembly
306
and be wound upon the take-up roll
412
of the web take-up assembly
308
.
The controller
110
, in response to the signal generated from the encoder
440
, maintains the imbalance between the motors
316
and
324
until a predetermined length of polishing material
102
is advanced. Once the predetermined length has been advanced, the controller
110
causes the motor
316
to generate a force upon the polishing material
102
that exceeds the force generated by the motor
324
. The imbalance of forces causes the polishing material
102
to be pulled towards the web supply assembly
306
. As the clutch
326
prevents the polishing material
102
from advancing in that direction, the polishing material
102
is held tightly between the supply roll
402
and take-up roll
412
.
The tension sensor
408
provides the controller
110
with a signal indicative of the tension on the polishing material. The controller
110
adjusts the relative forces applied to the polishing material
102
by the motors
316
,
324
to maintain a predetermined tension on the polishing material
102
.
FIG. 5
depicts another embodiment of a platen assembly
500
. The platen assembly
500
is substantially similar to the platen assembly
108
described in reference to
FIGS. 3 and 4
, except the platen assembly
500
includes a lifting means
502
disposed between a platen
504
and frame assembly
506
. Generally, the lifting means
502
maintains the relative orientation between the platen
504
and frame assembly
506
while allowing coaxial movement therebetween.
For example, the lifting means
502
may include linear bearings
508
. The bearings
508
are disposed between the platen
504
and frame assembly
506
such that the frame assembly
506
may move vertically to offset a top surface
510
of the frame assembly
506
relative to a top surface
512
of the platen
504
. The bearings
508
, while allowing movement in one direction, constrain the platen
504
and frame assembly
506
from moving laterally or rotating relative one another.
The lifting means
502
may additionally incorporate a cylinder
514
to provide the bias force necessary to displace the frame assembly
506
. The lifting means
502
may alternatively comprise one or more flexures, linear bearing, rails, solenoids, linear actuators, pneumatic actuators, hydraulic actuators, electric motors, air motors or other linear motion devices.
Although the teachings of the present invention that have been shown and described in detail herein, those skilled in the art can readily devise other varied embodiments that still incorporate the teachings and do not depart from the scope and spirit of the invention.
Claims
- 1. Apparatus for tensioning a web of polishing material between a supply roll and a take-up roll, the apparatus comprising:a first drive adapted to pull the polishing material in a first direction; a clutch mechanism coupled to the first drive; and a second drive adapted pull the polishing material in a second direction that opposes the first direction.
- 2. The apparatus of claim 1, wherein the clutch mechanism prevents movement of the polishing material in the second direction.
- 3. The apparatus of claim 1, wherein the first drive is a stepper motor, a harmonic drive, a pneumatic motor, a hydraulic motor, an electric motor, an air motor or a solenoid.
- 4. The apparatus of claim 1, wherein the first drive applies a force to the web that exceeds an opposing force applied to the web by the second drive, causing the web to advance.
- 5. The apparatus of claim 1, wherein the force applied by the first drive causes the web to be wound on the take-up roll.
- 6. The apparatus of claim 1, wherein the second drive applies a force to the web that exceeds an opposing force applied to the web by the first drive, causing the web to remain stationary.
- 7. The apparatus of claim 6, wherein the force applied by the second drive causes the web to be tensioned between the clutch mechanism and the supply roll.
- 8. The apparatus of claim 1 further comprising:a platen; and a frame assembly at least partially circumscribes the platen, the drives coupled to the frame assembly.
- 9. The apparatus of claim 1 further comprising:a platen having the drives coupled thereto.
- 10. A method for tensioning a web of polishing material between a supply roll and a take-up roll, the method comprising the steps of:driving a first motor to urge the polishing material in a first direction; driving a second motor to urge the polishing material in a second direction that opposes the first direction.
- 11. The method of claim 10 further comprising the step of:preventing the polishing material from moving in the first direction by engaging a one-way clutch mechanism coupled to the second drive.
- 12. The method of claim 10 wherein the drive system holds the polishing material stationary against a force generated by the first motor, causing the polishing material to be tensioned.
- 13. The method of claim 10 wherein the force exerted on the polishing material generated by the second motor exceeds the force exerted on the polishing material generated by the first motor, causing the polishing material to move in the second direction.
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Foreign Referenced Citations (8)
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