Claims
- 1. An apparatus of manufacturing a non-resonance knock sensor having a cylindrical base, a lower insulator, a lower terminal palate, a piezoelectric element, an upper terminal plate, an upper insulator, a nut and a resistor which are covered with resin, comprising:
an assembly body stage positioned at a first floor for forming an assembly body in which the lower insulator, the lower terminal plate, the piezoelectric element, the upper terminal plate and the upper insulator are mounted on the cylindrical base; process stages positioned at a second floor for fastening the assembly body with the nut to form a sensor main body, bending partly the lower and upper terminal plates of the sensor main body and connecting by welding the resistor between the lower and upper terminal plates which are partly bent in the sensor main body; and an elevator for transferring the assembly body from the first floor to the second floor so that the assembly stage at the first floor and the process stages at second floor constitute an integrated two stories equipment.
- 2. An apparatus according to claim 1, wherein each of the lower and upper insulators is identical and each of the lower and upper terminal plates is identical, and, further, wherein the assembly body stage comprises a first laminate forming device of assembling a first laminate in which the lower insulator, the lower terminal plate and the piezoelectric element are sequentially piled up on top of one another, a second laminate forming device of assembling a second laminate in which the upper insulator and the upper terminal plate are sequentially piled up, a first assembly device of mounting the first laminate on the cylindrical base, and a second assembly of mounting the second laminate on upside down on the first laminate mounted on the cylindrical base to form the assembly body.
- 3. An apparatus according to claim 2, wherein the first and second assembly devices have an assembly turn table commonly usable therefor on which the cylindrical base is mounted.
- 4. An apparatus according to claim 1, wherein the process stages have a fastening turn table to be used for mounting the nut on the assembly body and fastening the nut to the cylindrical base of the assembly body to form the sensor main body, both in a state that the assembly body is mounted thereon.
- 5. An apparatus according to claim 1, wherein the process stages have a bending turn table to be used for bending partly the lower and upper terminal plates in a state that the sensor main body is mounted thereon.
- 6. An apparatus according to claim 1, wherein the process stages have a bending turn table to be used for connecting by welding the resistor between the lower and upper terminal plates which are partly bent in a state that the sensor main body is mounted thereon.
- 7. An apparatus according to claim 1, further comprising:
a resign molding device for molding with the resin the sensor main body having the resistor connected between the upper and lower terminal plate by welding to form the non-resonance sensor; a belt conveyer type anneal furnace for annealing the non-resonance sensor in use of at least one of infrared rays and far infrared ray; and check stations for checking leak, insulation and performance of the non-resonance knock sensor.
- 8. An apparatus according to claim 7, further comprising:
a conveyer for transferring the non-resonance knock sensor among the check stations, and a loader provided at each of the check stations for loading and unloading each of the check stations with the non-resonance knock sensor on the conveyer.
- 9. A method of manufacturing the non-resonance knock sensor in use of the apparatus according to any one of claims 1 to 8.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2001-242781 |
Aug 2001 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application is based upon and claims the benefit of priority of Japanese Patent Application No. 2001-242781 filed on Aug. 9, 2001, the content of which is incorporated herein by reference.