Means to fasten electrical component to wiring board, base, or substrate

Industry

CPC
Y10T29/53174

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

Current Industry

Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatuses for executing a direct transfer of a semiconductor devi...
- Patent number 12,165,895
- Issue date Dec 10, 2024
- Cowles Semi, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component feeder mechanism with floating frame
- Patent number 12,114,430
- Issue date Oct 8, 2024
- Automation Technical Service Inc
- Kelvin Wiley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape feeder and mount device
- Patent number 12,096,565
- Issue date Sep 17, 2024
- FUJI CORPORATION
- Keita Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component replenishment management apparatus, component mounting sy...
- Patent number 12,041,725
- Issue date Jul 16, 2024
- Yamaha Hatsudoki Kabushiki Kaisha
- Yuichi Matsushita
- G05 - CONTROLLING REGULATING
Information Patent Grant
Systems for surface mounting electronic components on a printed cir...
- Patent number 12,010,800
- Issue date Jun 11, 2024
- IO Tech Group Ltd.
- Michael Zenou
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Substrate work machine
- Patent number 12,010,801
- Issue date Jun 11, 2024
- FUJI CORPORATION
- Hisahiro Torii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular-design component handling device with component gripping to...
- Patent number 11,956,901
- Issue date Apr 9, 2024
- ASMPT GMBH & CO. KG
- Sebastian Lohmeier
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Information processing device, information processing method, and p...
- Patent number 11,950,370
- Issue date Apr 2, 2024
- FUJI CORPORATION
- Hiroko Tokunaga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electric component supply device, and electric component supply method
- Patent number 11,903,136
- Issue date Feb 13, 2024
- FUJI CORPORATION
- Takaji Mukohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 11,894,342
- Issue date Feb 6, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a camera for a vision system of a vehicle
- Patent number 11,812,563
- Issue date Nov 7, 2023
- Magna Electronics Inc.
- Jens Steigerwald
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electrical element transfer apparatus
- Patent number 11,805,633
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Hyun-Tae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Article management apparatus and article management method
- Patent number 11,778,800
- Issue date Oct 3, 2023
- FUJI CORPORATION
- Kazuya Fukao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support pin arrangement determination assisting apparatus
- Patent number 11,778,796
- Issue date Oct 3, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirokazu Takehara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component mounting method
- Patent number 11,770,901
- Issue date Sep 26, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Norihisa Yamasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component mounting device
- Patent number 11,751,371
- Issue date Sep 5, 2023
- FUJI CORPORATION
- Kohei Sugihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatuses for executing a direct transfer of a semiconductor devi...
- Patent number 11,728,195
- Issue date Aug 15, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to control transfer parameters during transfer of semicon...
- Patent number 11,728,189
- Issue date Aug 15, 2023
- Rohinni, Inc.
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foil laminate intermediate and method of manufacturing
- Patent number 11,710,886
- Issue date Jul 25, 2023
- AVERY DENNISON RETAIL INFORMATION SERVICES LLC
- Ian J. Forster
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Repair or refurbishment of limited use medical devices
- Patent number 11,647,996
- Issue date May 16, 2023
- Medline Industries, LP
- Richard Walton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component supply device and surface mounting machine
- Patent number 11,606,891
- Issue date Mar 14, 2023
- Yamaha Hatsudoki Kabushiki Kaisha
- Tomoharu Kurayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape feeder and carrier tape loading method
- Patent number 11,596,090
- Issue date Feb 28, 2023
- FUJI CORPORATION
- Hiroyasu Ohashi
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor structure and method for making thereof
- Patent number 11,569,208
- Issue date Jan 31, 2023
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting apparatus with feeder control device
- Patent number 11,570,940
- Issue date Jan 31, 2023
- FUJI CORPORATION
- Koichiro Sugimoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Tray-type component supply device
- Patent number 11,547,032
- Issue date Jan 3, 2023
- FUJI CORPORATION
- Shotaro Hibino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component supply device
- Patent number 11,510,352
- Issue date Nov 22, 2022
- FUJI CORPORATION
- Toru Matsumoto
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Component supply device and tape feeder
- Patent number 11,497,153
- Issue date Nov 8, 2022
- Yamaha Hatsudoki Kabushiki Kaisha
- Katsuyuki Amma
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Component mounting device
- Patent number 11,477,928
- Issue date Oct 18, 2022
- Yamaha Hatsudoki Kabushiki Kaisha
- Kunimune Komaike
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board working system
- Patent number 11,432,449
- Issue date Aug 30, 2022
- FUJI CORPORATION
- Teruyuki Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SYSTEM INTEGRATION
- Publication number 20240128238
- Publication date Apr 18, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatuses for executing a direct transfer of a semiconductor devi...
- Publication number 20240038564
- Publication date Feb 1, 2024
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING APPARATUS
- Publication number 20230403835
- Publication date Dec 14, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Hirokazu TAKEHARA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20230397341
- Publication date Dec 7, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Norihisa Yamasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20230041977
- Publication date Feb 9, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED SEMICONDUCTOR STRUCTURES
- Publication number 20230026177
- Publication date Jan 26, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF
- Publication number 20220293575
- Publication date Sep 15, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR
- Publication number 20220240392
- Publication date Jul 28, 2022
- MAGNA ELECTRONICS INC.
- Jens Steigerwald
- B60 - VEHICLES IN GENERAL
Information Patent Application
3D INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20220189864
- Publication date Jun 16, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING APPARATUS
- Publication number 20220095499
- Publication date Mar 24, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Hirokazu TAKEHARA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT FEEDER MECHANISM WITH FLOATING FRAME
- Publication number 20210392801
- Publication date Dec 16, 2021
- Automation Technical Service Inc
- Kelvin Wiley
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and Apparatus to Increase Transfer Speed of Semiconductor De...
- Publication number 20210375656
- Publication date Dec 2, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...
- Publication number 20210343558
- Publication date Nov 4, 2021
- Rohinni, LLC
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20210289634
- Publication date Sep 16, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Norihisa Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF
- Publication number 20210242185
- Publication date Aug 5, 2021
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR INTEGRATION
- Publication number 20210175162
- Publication date Jun 10, 2021
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING INTEGRATED CIRCUITS CONTAINING SERIALIZER AND DESERIALIZER...
- Publication number 20210035955
- Publication date Feb 4, 2021
- BroadPak Corporation
- Farhang YAZDANI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Foil Laminate Intermediate and Method of Manufacturing
- Publication number 20200403291
- Publication date Dec 24, 2020
- Avery Dennison Retail Information Services, LLC
- Ian J. FORSTER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR
- Publication number 20200178397
- Publication date Jun 4, 2020
- MAGNA ELECTRONICS INC.
- Jens Steigerwald
- B60 - VEHICLES IN GENERAL
Information Patent Application
SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION
- Publication number 20200144170
- Publication date May 7, 2020
- BroadPak Corporation
- Farhang YAZDANI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
COMPONENT PLACEMENT DEVICE
- Publication number 20190343006
- Publication date Nov 7, 2019
- Assembleon B.V.
- Roy Brewel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING METHOD
- Publication number 20190150333
- Publication date May 16, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Hirokazu TAKEHARA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20190141839
- Publication date May 9, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Norihisa Yamasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PRODUCTS, RELATED ARRANGEMENT A...
- Publication number 20190090353
- Publication date Mar 21, 2019
- TactoTek Oy
- Paavo NISKALA
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
BOARD WORKING SYSTEM
- Publication number 20180332748
- Publication date Nov 15, 2018
- FUJI CORPORATION
- Teruyuki Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING A PRODUCT USING A SOLDERING PROCESS
- Publication number 20180139851
- Publication date May 17, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION
- Publication number 20180068938
- Publication date Mar 8, 2018
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT PLACEMENT DEVICE AS WELL AS A METHOD FOR PICKING UP A COM...
- Publication number 20180063964
- Publication date Mar 1, 2018
- Assembleon B.V.
- Roy Brewel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Weld Gun Part Clamp Device And Method
- Publication number 20180043462
- Publication date Feb 15, 2018
- Comau LLC
- Velibor Kilibarda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Means to fasten electrical component to wiring board, base, or substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatuses for executing a direct transfer of a semiconductor devi...

Component feeder mechanism with floating frame

Tape feeder and mount device

3D integrations and methods of making thereof

Component replenishment management apparatus, component mounting sy...

Systems for surface mounting electronic components on a printed cir...

Substrate work machine

Modular-design component handling device with component gripping to...

Information processing device, information processing method, and p...

Electric component supply device, and electric component supply method

Stacking integrated circuits containing serializer and deserializer...

Method for assembling a camera for a vision system of a vehicle

Electrical element transfer apparatus

Article management apparatus and article management method

Support pin arrangement determination assisting apparatus

Electronic component mounting method

Component mounting device

Apparatuses for executing a direct transfer of a semiconductor devi...

Apparatus to control transfer parameters during transfer of semicon...

Foil laminate intermediate and method of manufacturing

Repair or refurbishment of limited use medical devices

Component supply device and surface mounting machine

Tape feeder and carrier tape loading method

Semiconductor structure and method for making thereof

Component mounting apparatus with feeder control device

Tray-type component supply device

Component supply device

Component supply device and tape feeder

Component mounting device

Board working system

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

3D SYSTEM INTEGRATION

Apparatuses for executing a direct transfer of a semiconductor devi...

SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING APPARATUS

ELECTRONIC COMPONENT MOUNTING METHOD

3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF

ENHANCED SEMICONDUCTOR STRUCTURES

SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF

VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR

3D INTEGRATIONS AND METHODS OF MAKING THEREOF

SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING APPARATUS

COMPONENT FEEDER MECHANISM WITH FLOATING FRAME

Method and Apparatus to Increase Transfer Speed of Semiconductor De...

METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...

ELECTRONIC COMPONENT MOUNTING METHOD

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF

SECURE SEMICONDUCTOR INTEGRATION

STACKING INTEGRATED CIRCUITS CONTAINING SERIALIZER AND DESERIALIZER...

Foil Laminate Intermediate and Method of Manufacturing

VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR

SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION

COMPONENT PLACEMENT DEVICE

SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING METHOD

ELECTRONIC COMPONENT MOUNTING METHOD

METHOD FOR MANUFACTURING ELECTRONIC PRODUCTS, RELATED ARRANGEMENT A...

BOARD WORKING SYSTEM

MANUFACTURING A PRODUCT USING A SOLDERING PROCESS

SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION

COMPONENT PLACEMENT DEVICE AS WELL AS A METHOD FOR PICKING UP A COM...

Weld Gun Part Clamp Device And Method