Embodiments of a method include coupling light from a light source into a waveguide coupler embedded in a slider. The light source is capable of being positioned in a cross-track, a down-track, and a vertical direction with regards to the waveguide coupler. The method includes imaging the light emanating from an air-bearing surface of the slider using a device that generates an optical image of the air-bearing surface. The method also includes identifying a cross-track alignment position between the light source and the waveguide coupler in the cross-track direction as a location at which the image shows substantially the same number of photons on each side of the cross-track alignment position. Finally, the method includes identifying a down-track alignment position between the light source and the waveguide coupler in a down-track direction as a location at which the light emanating from the air-bearing surface has a maximal intensity in the down-track direction. In some embodiments, the method also includes performing a fine adjustment of the cross-track alignment position by identifying a fine adjustment alignment position at which a spread of the photons shown by the image along the cross-track direction is minimal.
Other embodiments are directed to a system that includes an imaging device. The imaging device is configured to generate an optical image of light emanating from an air-bearing surface of a slider. The light is emitted by a light source that is capable of being positioned in a cross-track, a down-track, and a vertical direction with respect to a waveguide coupler embedded in the slider. The system also includes an analyzer configured to determine an alignment position of the light source relative to the waveguide coupler in the cross-track direction as a location at which the image shows substantially the same number of photons on each side of the cross-track alignment position. The analyzer is further configured to determine an alignment position between the light source and the waveguide coupler in a down-track direction as a location at which the light emanating from the air-bearing surface has a maximum intensity in the down-track direction.
The above summary is not intended to describe each disclosed embodiment or every implementation of the present disclosure. The figures and the detailed description below more particularly exemplify illustrative embodiments
Throughout the specification reference is made to the appended drawings, where like reference numerals designate like elements, and wherein:
FIGS. 5A′-5D′ are near-field intensity profiles of
FIGS. 7A′-7C′ are near-field intensity profiles of
The figures are not necessarily to scale. Like numbers used in the figures refer to like components. However, it will be understood that the use of a number to refer to a component in a given figure is not intended to limit the component in another figure labeled with the same number.
In the following description, reference is made to the accompanying set of drawings that form a part of the description hereof and in which are shown by way of illustration several specific embodiments. It is to be understood that other embodiments are contemplated and may be made without departing from the scope of the present disclosure. The following detailed description, therefore, is not to be taken in a limiting sense.
Unless otherwise indicated, all numbers expressing feature sizes, amounts, and physical properties used in the specification and claims are to be understood as being modified in all instances by the term “about.” Accordingly, unless indicated to the contrary, the numerical parameters set forth in the foregoing specification and attached claims are approximations that can vary depending upon the desired properties sought to be obtained by those skilled in the art utilizing the teachings disclosed herein. The use of numerical ranges by endpoints includes all numbers within that range (e.g. 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5) and any range within that range.
The present disclosure generally relates to magnetic recording devices used for data storage. Methods and systems are described herein that can facilitate assembly of very small scale optical devices. These methods and systems can be used, for example, for assembling heat-assisted magnetic recording (HAMR) devices, which can also be described as thermal-assisted magnetic recording (TAMR) and energy-assisted magnetic recording (EAMR). Generally, a HAMR device uses a light source, such as a laser diode, to heat a magnetic medium while it is storing the data.
A HAMR data storage medium has a high magnetic coercivity that is able to overcome superparamagnetic effects (e.g., thermally-induced, random, changes in magnetic orientations) that currently limit the areal data density of conventional hard drive media. In a HAMR device, a small portion, or “hot spot”, of the magnetic medium is locally heated to its increase its coercivity, thereby allowing magnetic orientation of the medium to be changed at the hot spot while being written to by a transducer (e.g., magnetic write pole).
A HAMR read/write head, sometimes referred to as a slider, includes magnetic read and write transducers similar to those on current hard drives. For example, data can be read by a magneto-resistive sensor that detects magnetic fluctuations of the moving medium. Data can be written to the magnetic medium by a write coil that is magnetically coupled to a write pole. A HAMR slider can also include a light source, such as a laser diode, and an optical delivery path through the slider that delivers the energy to the surface of the medium. In some configurations, the light source can be a separately-manufactured device that can be attached to the slider. In these configurations, the light source can be attached to the top of the slider (laser-on-slider or LOS) and guided from the light source into the slider using a channel waveguide input coupler.
During the attachment procedure, it is desirable to precisely align the light source to the input coupler during assembly to minimize optical transmission losses in the optical delivery path. This alignment can be challenging due to, among other things, the small size of the laser diode and slider, which can have dimensions on the order of 500 μm or smaller when the light source is a laser diode. Due to imperfect mode mismatch between the laser diode and the channel waveguide input coupler, only one portion of light can be coupled into the waveguide input coupler. The rest of the light will become radiation modes, referred to as “stray light”. These radiation modes can propagate in the slider and in the surrounding structures and a portion of this light still reaches the opposite side of the slider (i.e., the air-bearing surface or ABS).
Media-facing surface (air-bearing surface) 110 can be configured as an air-bearing surface (ABS) that maintains a cushion of air between slider body 108 and the recording medium. Transducer region 113 of slider body 108 includes at least a write transducer that generates a magnetic field and an optical transducer that receives energy from laser diode 102 and directs the energy to the recording medium. The optical transducer can include a near-field transducer (NFT) 112 that directs the energy via surface plasmon resonance. Optical channel waveguide 114 includes optical components (e.g., waveguides, mirrors, couplers, decouplers, etc.) that are integrated in slider body 108 and facilitate delivering energy from laser diode 102 to NFT 112.
In the illustrated slider assembly 100, laser diode 102, submount 104 and slider body 108 can be formed using integrated circuit/optics manufacturing techniques. For example, the components can be formed by (among other things) depositing layers of material on a wafer substrate, creating features in the layers using photolithography, chemical/mechanical polishing, and dividing the wafer into individual components. Afterwards, laser diode 102 can be bonded or attached (e.g., soldered) to submount 104 and submount 104 can then be attached to slider body 108. These components can be attached by bonding features such as a solder pads, bond lines, bond layers, etc. Attachment/bonding can occur in another order, e.g., submount 104 can be bonded to slider body 108 before laser diode 102 is attached. In either case, it can be desirable to precisely align the output of laser diode 102 with the optical waveguide 114 to minimize optical losses. The alignment between components described herein can occur, for example, before or during reflow of bonding features.
Light from the laser diode that is guided into the channel waveguide can be routed by the channel waveguide and, if present, additional optical elements such as mirrors, into the center of the slider and can be focused by a solid immersion mirror (SIM). If the laser diode is not properly aligned with the waveguide input coupler, then less light can reach the solid immersion mirror and, ultimately, any recording media at the air-bearing surface of the HAMR recording device. Laser diode—waveguide input coupler alignment can be carried out by maximizing light transmission through the SIM if an offset between the SIM and the waveguide input coupler is large (for example, 200 μm), stray light propagating through the slider will not be collected by an objective of high numerical aperture focused at the SIM center.
For straight-through light delivery, such as in an LOS configuration, stray light and guided modes can be mixed at the air-bearing surface. The SIM can have a high numerical aperture, causing only a fraction of the light reflected from the SIM sidewall to propagate to the far-field due to total internal reflection. Consequently, in the far-field, before the laser diode is aligned to an input coupler, such as a waveguide input coupler, any detector used to align the laser diode and the waveguide input coupler cannot rely on far-field transmission feedback.
Embodiments of methods, systems, and apparatuses for alignment of laser diodes to channel waveguide input couplers for laser-on-slider light delivery in a HAMR device are based upon imaging light at the air-bearing surface. In some embodiments, the imaging can be accomplished using a charge-coupled device (CCD) or a photodiode. In some embodiments, a multi-mode fiber may be used to deliver the light onto the photodiode. The methods include coupling light from a light source, such as a laser diode, into a waveguide input coupler embedded in a slider. The light source can be capable of being positioned in a cross-track, a down-track, and a vertical direction with regards to the waveguide coupler and referenced to recording media at the air-bearing surface. Generally, the term “vertical” in this disclosure is intended to describe a direction normal to the respective interface surfaces of two components, such as the light source 210 and slider 201 shown in the embodiments shown in
All of the optical components in slider 201 can be built into the slider during fabrication of the slider. Thus, waveguide input coupler 220, beam expander 225, and solid immersion mirror 228 can all be integrated optics devices. Light that is captured by solid immersion mirror 228 can emerge from slider 201 at air-bearing surface 203 and can diverge at that point as shown by the diverging arrows emerging from solid immersion mirror 228. Objective 230 can collimate the divergent light followed by imaging lens 250 which can focus the image obtained from air-bearing surface 203 through beam splitter 260 into CCD camera 280. CCD camera 280 can feed digital information to computer/processor 290 for image processing. Objective 230 can function as a light collector. Light exiting from the solid immersion mirror 228 can be collected by an objective of high numerical aperture. In the embodiment shown in
Beam splitter 260 can divert some of the focused light from imaging lens 250 to an additional or alternative detection device. In the embodiments exemplified in
Waveguide input coupler 220 can include waveguide core 222 that is surrounded by cladding 224. There can be a high contrast in the index of refraction between the materials that make up waveguide core 222 and cladding 224. Waveguide core 222 can be fabricated with high refractive index materials such as, for example, Ta2O5, SiNx, TiOx, and ZnS. Cladding material can be fabricated with low refractive index material (lower, for example, than the material used for the cladding). Examples of cladding material can include, for example, Al2O3, SiO2, SiONx, Y2O3, Nb2O3, and MgO2.
Some embodiments of the disclosed method include coupling light from a light source into a waveguide coupler embedded in a slider and imaging the light emanating from an air-bearing surface of the slider using a device that generated an optical image of the air-bearing surface as described above and illustrated in
Additionally, these embodiments also can include identifying a down-track alignment position (y-direction in
If desired, fine-tuning of the alignment can be done by pattern matching of the light image on, for example, the CCD detector. The pattern for matching can be created by minimizing the spread of the central beam in the cross-track direction (x-direction) and balancing the light intensity centered at the SIM using the signal as shown in
FIGS. 5A′-D′ show a drop off of light intensity in the near-field as the diode is moved from x=0 in the x-direction. It can be observed that the maximum intensity is shown in FIG. 5B′.
A SIM with two asymmetric mirror sidewalls such that there is a π phase difference in the reflected rays from the two sidewalls can be built into the slider for near-field transducer excitation. Two focused spots are expected in the near-field intensity profile using a slider that includes a SIM with asymmetric sidewalls.
Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that a variety of alternate and/or equivalent implementations can be substituted for the specific embodiments shown and described without departing from the scope of the present disclosure. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, it is intended that this disclosure be limited only by the claims and the equivalents thereof.
Number | Name | Date | Kind |
---|---|---|---|
7289422 | Rettner et al. | Oct 2007 | B2 |
8149654 | Komura et al. | Apr 2012 | B2 |
8243561 | Matsumoto | Aug 2012 | B2 |
8248895 | Shimazawa et al. | Aug 2012 | B2 |
8345517 | Hurley et al. | Jan 2013 | B2 |
8355299 | Sasaki et al. | Jan 2013 | B2 |
8393074 | Takayama et al. | Mar 2013 | B1 |
8395971 | Sasaki et al. | Mar 2013 | B2 |
8406089 | Sasaki et al. | Mar 2013 | B2 |
8424191 | Shimazawa et al. | Apr 2013 | B2 |
8456961 | Wang et al. | Jun 2013 | B1 |
8477570 | Arai et al. | Jul 2013 | B2 |
8477571 | Zhou et al. | Jul 2013 | B1 |
8509036 | Shimazawa et al. | Aug 2013 | B2 |
8531795 | Mukoh et al. | Sep 2013 | B2 |
20060233061 | Rausch et al. | Oct 2006 | A1 |
20070159718 | Kim et al. | Jul 2007 | A1 |
20090059411 | Tanaka et al. | Mar 2009 | A1 |
20090266789 | Shimazawa et al. | Oct 2009 | A1 |
20100232281 | Sekine | Sep 2010 | A1 |
20110157738 | Shimazawa et al. | Jun 2011 | A1 |
20110242697 | Mori et al. | Oct 2011 | A1 |
20120092971 | Schreck et al. | Apr 2012 | A1 |
20130142478 | Shzewski et al. | Jun 2013 | A1 |
20130277575 | Peng et al. | Oct 2013 | A1 |
Number | Date | Country |
---|---|---|
2011-198451 | Oct 2011 | JP |
2013-004148 | Jan 2013 | JP |