Method and system for manufacture of field emission display

Abstract

High resolution color displays for field emission displays are formed by applying a grille to a screen layer, the grille having a set of holes formed therein exposing areas of the screen layer. A layer of photoresist is applied to the grille and the exposed areas of the screen layer, whereby a plurality of photoresist-covered screen layer areas are defined. One set of the plurality of photoresist-covered screen layer areas is fixed, whereby a fixed set and an unfixed set are defined. The photoresist is removed from the unfixed set and a light emitting substance is deposited on the exposed screen layer area The fixed set of photoresist is plasma etched.

Description

BACKGROUND OF THE INVENTION

[0002] This invention relates to the art of manufacture of field emission displays. In one specific application, the present invention relates to the fabrication of patterned phosphor screens for high resolution displays.

[0003] In the manufacture of field emission displays, photoresist masks are used, as described in, for example, U.S. Pat. No. 4,891,110, issued to Libman, et al., on Jan. 2, 1990, and listing Zenith Electronics Corporation as the assignee, which patent is incorporated herein by reference.

[0004] As described in Libman, the photoresist is fixed in certain areas over a conductive surface, the unfixed photoresist is then removed by a wash, such as water, and the exposed conductive surface is then subjected to a cataphoretic bath to apply a phosphor to the conductive surface. After that application, the fixed photoresist material must be removed, which is accomplished in the field emission display art by way of washing with, for example, a hydrogen peroxide solution. Such washing causes mechanical agitation and dislodges particles of phosphor, resulting in unacceptable displays. This quality problem becomes even more critical as phosphor spot size or line width shrinks to achieve higher resolution products.

[0005] Accordingly, there is a need for a method and system for manufacture of field emission displays that will not mechanically agitate the phosphor during removal of photoresist material, and it is an object of the present invention to fill that need.

SUMMARY OF THE INVENTION

[0006] According to one embodiment of the present invention, a method is provided for producing high resolution displays, the method comprising: depositing an electrically conductive coating over a screening surface; shielding the electrically conductive coating with a grille having a set of holes formed therein exposing a set of areas of the electrically conductive coating; applying a layer of insulative photoresist to the grille and the exposed areas of electrically conductive coating, whereby a plurality of photoresist-covered conductive areas are defined; fixing one set of the plurality of photoresist-covered conductive areas, whereby a fixed set is defined, and an unfixed set is defined; removing the photoresist from the unfixed set; depositing a light emitting substance on the exposed-conductive area; and plasma etching the fixed set of insulative photoresist.

[0007] According to a further embodiment of the invention, a system for producing high resolution displays is also provided. The system comprising: depositor of an electrically conductive coating over a screening surface; depositor of a grille having a set of holes formed therein applied to the screening surface and exposing a set of areas of the electrically conductive coating; applicator of a layer of insulative photoresist to the grille and the exposed areas of electrically conductive coating, whereby a plurality of photoresist-covered conductive areas are defined; fixer of one set of the plurality of photoresist-covered conductive areas, whereby a fixed set is defined, and an unfixed set is defined; remover of the photoresist from the unfixed set; depositor of a light emitting substance on the exposed-conductive area; and plasma etcher of the fixed set of insulative photoresist.

DESCRIPTION OF THE DRAWINGS

[0008] For a more complete understanding of the present invention and for further advantages thereof, reference is made to the following Detailed Description taken in conjunction with the accompanying drawings, in which:

[0009] FIG. 1 is a sectional, side elevation, diagrammatic view of an embodiment of the present invention near the start of processing;

[0010] FIG. 2 is a sectional, side elevation, diagrammatic view of the embodiment of FIG. 1 at a further stage of processing;

[0011] FIG. 3 is a sectional, side elevation, diagrammatic view of a cataphoretic deposition device useful according to one example embodiment of the present invention;

[0012] FIG. 4 is a flow chart of a process provided according to one aspect of the present invention;

[0013] FIGS. 5A and 5B are sectional, side elevation, diagrammatic views of the embodiment of the present invention in a still further stage of processing;

[0014] FIGS. 6A to 6C are sectional, side elevation, diagrammatic views of an embodiment of the present invention for forming the grille; and

[0015] FIG. 7 is a sectional, side elevation, diagrammatic view of another cataphoretic deposition device useful with the embodiment of the FIGS. 6A to 6C.

[0016] It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.

DETAILED DESCRIPTION

[0017] Referring now to FIG. 1, an embodiment of the present invention will be described in which a method for producing high resolution displays is provided. The method comprises forming a faceplate 10 by: depositing an electrically conductive coating 12 over a screening surface 14; shielding the electrically conductive coating 12 with a grille 16 having a set of holes 18 formed therein exposing a matrix of areas 20 on the electrically conductive coating 12. The grille is formed in much the same manner as the phosphor coating, namely, coating with a resist, soft baking, exposing, developing, and depositing the grille material. According to alternate embodiments, non-conductive coatings are used. Also, according to another embodiment, no such conductive layer is used, and a grille is applied directly to a screen. As used herein, the term “screen layer” defines either the screen or a layer applied to the screen, such as electrically conductive coating 12.

[0018] Referring now to FIG. 2, the process further comprises applying a layer 22 of insulative photoresist to the grille 16 and the areas 20 of electrically conductive coating 12 exposed by the grille; fixing sets of areas 24G and 24B of photoresist-covered areas, whereby fixed sets of area 24G and 24B and an unfixed set of areas 24R are defined. According to the embodiment shown, the fixing is accomplished by shining ultraviolet light 26 though a mask 28, which is similar to a semiconductor lithography mask. These masks are made of quartz (or glass) and have opaque layer 29 on them (such as chrome oxide or black chrome) to set a pattern, as is known to those skilled in the art. Alternative methods of fixing include the use of a positive photoresist, where the fixing comprises application of the photoresist and light is applied to the areas where it is desired that the photoresist be unfixed.

[0019] Referring now to FIG. 3, the process further comprises: removing the photoresist from the unfixed set; and depositing a light emitting substance 30R on the exposed-conductive area. According to one embodiment, the depositing is accomplished through cataphoretic deposition as known to those of skill in the art. The illustrated tank 32 is filled with an appropriate electrolyte 34 and contains an electrode 36 connected to a power supply 38, which is also connected to the electrode of the faceplate 10.

[0020] According to a more specific embodiment, the light emitting substance 30R comprises a phosphor, having the following characteristics:

[0021] Zinc silicate: manganese

[0022] Zinc sulphide: copper

[0023] Zinc beryllium silicate: manganese

[0024] Zinc sulphide: silver and Zinc cadmium sulphide: silver

[0025] Calcium tungstate

[0026] Zinc sulphide: silver and Zinc cadmium sulphide: copper

[0027] Calcium pyrophosphate

[0028] Potassium chloride (Dark trace-nonluminescent-called a Scotophor)

[0029] Zinc sulphide: silver

[0030] Zinc magnesium fluoride: manganese

[0031] Magnesium silicate: manganese

[0032] Zinc oxide

[0033] Calcium magnesium silicate: cerium

[0034] Zinc oxide and Zinc cadmium sulphide: copper

[0035] Calcium magnesium silicate: titanium and Calcium beryllium silicate: manganese

[0036] Potassium magnesium fluoride: manganese

[0037] Zinc cadmium sulphide: silver

[0038] Magnesium fluoride: manganese

[0039] Zinc sulphide: silver, Zinc silicate: manganese, Zinc phosphate: manganese

[0040] Zinc sulphide: silver, Zinc cadmium sulphide: cadmium sulphide: silver

[0041] Zinc sulphide: silver, Zinc cadmium sulphide: vanadate: europium

[0042] Zinc sulphide: silver, Zinc cadmium sulphide: oxysulphide: europium

[0043] Zinc sulphide: silver, Zinc cadmium sulphide: oxide: europium

[0044] Zinc sulphide: silver, Zinc cadmium sulphide: copper, Yttrium oxysulphide: europium

[0045] Zinc oxide

[0046] Calcium silicate: lead: manganese

[0047] Zinc phosphate: manganese

[0048] Zinc cadmium sulphide: copper

[0049] Zinc sulphide: copper

[0050] Calcium magnesium silicate: titanium Zinc cadmium sulphide: copper

[0051] Magnesium fluoride: manganese

[0052] Zinc sulphide: lead: copper

[0053] Zinc sulphide selenide: silver

[0054] Zinc sulphide: silver: nickel

[0055] Zinc cadmium sulphide: silver: nickel

[0056] Zinc magnesium fluoride: manganese

[0057] Zinc silicate: manganese: arsenic

[0058] Zinc sulphide: silver Zinc cadmium sulphide: copper

[0059] Zinc magnesium fluoride: manganese Calcium Magnesium silicate: cerium

[0060] Zinc sulphide: copper: Zinc silicate: manganese: arsenic

[0061] Gadolinium oxysulphide: terbium

[0062] Lanthanum oxysulphide: terbium

[0063] Yttrium oxysulphide: terbium

[0064] Yttrium aluminate: cerium

[0065] Yttrium silicate: cerium

[0066] Penetron phosphor-yttrium vanadate: europium (Red) (10 KeV) Zinc silicate: manganese (Green) (17 keV)

[0067] Penetron phosphor-Red @ 8 keV/Green @ 15 keV

[0068] Penetron phosphor-Red @ 6 keV/Green @ 12 keV

[0069] Zinc silicate: titanium

[0070] Yttrium gallium aluminum garnet: terbium

[0071] Yttrium oxyeulphide: terbium Zinc cadmium sulphide: copper

[0072] Zinc sulphide: silver

[0073] yttrium oxide: europium

[0074] It is fully within the scope of the present invention to apply a binder material to the substrate in order to firmly attach the phosphor and grille material to the substrate. A suitable binder would be a 1% by wt solution of an organo-silicate, such as Techniglas GR650F, in isopropanol or other suitable solvent. This could be applied by a puddle or spray application, or other suitable method, with the substrate then being spun dry at approximately 1000 RPM.

[0075] It would also be within the scope of the invention to eliminate the organics from the screen, and the binder, by a baking operation. If the organics are not baked out, then there may be problems with carbon contamination which could adversely affect the future performance of the phosphor. The preferred baking would be done in a suitable oven ramped to 650-700° C. at a rate the substrate can handle without breaking. The parts need be held at temperature for only about 30 minutes before cooling and removing them from the oven.

[0076] Referring now to FIG. 4, which shows the process flow in block diagram form, the process further comprises plasma etching the fixed set 24G and 24B of insulative photoresist. Examples of acceptable etchers include either barrel type or parallel plate etchers, as are known by those skilled in the art.

[0077] Referring now to FIGS. 5A and 5B, the method further comprises applying a layer 40 of insulative photoresist (for example, an OCG SC series photoresist) to the entire substrate and fixing the photoresist in all areas except 24G of the insulative photoresist covering the exposed-conductive area 20. Using, for example, a gentle wash with developer appropriate for photoresist, the unfixed portion of the insulative photoresist covering is then removed, and a second color light emitting substance 30G is deposited on the exposed-conductive area, as discussed above with respect to the first color light emitting substance. Acceptable examples for applying layer 40 comprise: meniscus coating, spin coating, curtain coating, and other methods that will occur to those skilled in the art. It is believed that another acceptable example comprises cataphoretic deposition. Phosphors useful with various means of application will be understood by those of skill in the art from the present description.

[0078] Referring now to FIGS. 6A-6C, an acceptable method for forming grilles, having a patterned array of holes therein, will be described. According to this method, the forming comprises: applying a layer 42 of insulative photoresist to the electrically conductive coating 12; fixing one set 44 of photoresist-covered conductive areas; and removing the unfixed photoresist with, for example, a gentle wash with developer appropriate for the photoresist used (for example, Waycoat Negative Photoresist Developer for SC resists made by OCG).

[0079] Referring now to FIG. 7, the faceplate 10 is subjected to a cataphoretic bath 46, wherein a potential is developed between the conductive coating 12 and electrode 46, which comprises, in this example, stainless steel. As a result, the grille 52 forms on the conductive surface 12 where the unfixed photoresist was removed. The fluid used in the cataphoretic bath 46 comprises, for example, about 99.7% by weight of vehicle (for example, isopropyl alcohol) no more than 0.02% by weight electrolyte (for example, lanthanum hitrate hexahydrate), about 0.05 to 0.10% by weight Glycerol, and a powder phosphor or a light-absorbing material. Acceptable examples include: manganese carbonate, cobalt oxide black, and iron oxides mixed with cobalt oxides. Up to 1% water can be added to the phosphor or light absorbing material.

[0080] Other grille materials believed to be useful with the present invention include: boron carbide, lead (IV) oxide, niobium (II) oxide, niobium (IV) oxide, palladium (II) oxide, rhenium (IV) oxide, tungsten carbide, silicon carbide, vanadium carbide, copper oxide, boron silicide, chrome (II) oxide, germanium oxide, iridium oxide, titanium oxide, manganese carbide, manganese phosphide, manganese tantalate, osmium oxide, strontium boride, strontium carbide, thorium silicide, molybdenum (II) oxide, molybdenum (III) oxide, molybdenum sulfide, and praseodymium manganese oxide.

[0081] The voltage applied according to this embodiment is between about 100 volts and about 200 volts, with a current at about 0.01×10−3 amperes per square centimeter. And the specific resistance of the bath is between about 5×105 and about 1.0×106 ohms per centimeter. The application of insulative grilles in the above-described manner provides for holes in the fixed set of photoresist-covered conductive areas.

[0082] Next, photoresist is then removed by plasma etching, conducted as is known to those of skill in the art. However, according to some specific embodiments of the invention, the photoresist used should be chosen from a group that does not leave a residual ash after plasma etching. The following are believed or known to be acceptable: polyisoprene based photoresists, polyvinyl alcohol based photoresists, some polyimide based resists and some negative chemically amplified resists.

[0083] During the plasma etching, it is acceptable to use a pressure of about 1 Torr, power of between about 400 to about 500 watts, in a gas atmosphere of: air, oxygen/nitrogen mixture, or any other suitable gases for stripping the photoresist. Other examples known or believed to be effective include oxygen and hydrogen/argon mixtures.

[0084] Process time during the etch is, according to some embodiments, about 30 minutes, but this time varies depending upon etch process parameters and the particular photoresist used. It will be recognized that changes may be made in the above-described example embodiments without departing from the spirit and scope of the present invention.

[0085] The present invention may be subject to many modifications and changes without departing from the spirit or characteristics thereof. The present disclosure is therefore intended in all respects as being illustrative and not restrictive as to the scope of the present invention as defined by the appended claims.

Claims

1. A method for producing high resolution displays, comprising the steps of: applying a grille to a screen layer, the grille having a set of holes formed therein exposing an exposed set of areas of the screen layer; applying a layer of photoresist to the grille and the exposed areas of the screen layer, whereby a plurality of photoresist-covered screen layer areas are defined; fixing one set of the plurality of photoresist-covered screen layer areas, whereby a fixed set is defined, and an unfixed set is defined; removing the photoresist from the unfixed set; depositing a light emitting substance on the exposed areas of the screen layer; and plasma etching the fixed set of photoresist.

2. A method as in claim 1 further comprising: depositing an electrically conductive coating over a screening surface.

3. A method as in claim 2, wherein said plasma etching of the photoresist to define an exposed-conductive area, and said depositing a light emitting substance on the exposed-conductive area comprises depositing a first color light emitting substance and defining a first deposit area, the method further comprising: applying a layer of photoresist to the exposed-conductive area and the entire substrate; fixing the photoresist everywhere except where phosphor is to be deposited; removing the unfixed portion of the photoresist covering; and depositing a second color light emitting substance on the exposed-conductive area.

4. A method as in claim 3 wherein said fixing one set comprises: exposing all areas of the photoresist-covered conductive areas that are not to be deposited on to light.

5. A method as in claim 4 wherein said exposing comprises: shining light through a mask.

6. A method as in claim 5 wherein said exposing comprises: generating ultraviolet light from a light source; and passing the ultraviolet light through the mask wherein light passing though the mask impinges upon the set of the plurality of photoresist-covered conductive areas.

7. A method as in claim 3 further comprising: etching the fixed photoresist.

8. A method as in claim 1 wherein said depositing the light emitting substance on the exposed areas of the screen comprises: cataphoretic deposition.

9. A method as in claim 1 wherein said removing the photoresist from the unfixed set comprises: rinsing with developer.

10. A method as in claim 1 wherein said light emitting substance comprises phosphor.

11. A system for producing high resolution displays, the system comprising: a depositor of a grille having a set of holes formed therein applied to the screening surface that exposes a first set of exposed areas of the screening surface; an applicator of a layer of photoresist to the grille and the first set of exposed areas of the screening surface, whereby a plurality of photoresist-covered screening surface areas are defined; a fixer of one set of the plurality of photoresist-covered screening surface areas, whereby a fixed set of areas is defined, and an unfixed set of areas is defined; a remover of the photoresist from the unfixed set, whereby a second set of exposed areas are defined; and a depositor of a light emitting substance in the second set of exposed areas; and a plasma etcher of the fixed set of photoresist.

12. A system as in claim 11 wherein said depositor of a light emitting substance on the second set of exposed areas comprises deposition of a first color light emitting substance that defines a first deposit area, and said plasma etcher of the fixed set defines an exposed-conductive area, the system further comprising: an applicator of a layer of photoresist to the entire substrate; a fixer of those portions of the photoresist covering the areas where deposition is not wanted; a remover of the unfixed portion of the photoresist covering; and a depositor of a second color light emitting substance on the exposed-conductive area.

13. A system as in claim 12 wherein the fixer comprises a light source.

14. A system as in claim 13 wherein the light source comprises an ultraviolet light source.

15. A system as in claim 14 wherein said light source further comprises: a mask though which the ultraviolet light shines onto a portion of the photoresist to be fixed.

16. A system as in claim 12 wherein said depositor of a light emitting substance on the exposed-conductive area comprises: a cataphoretic bath.

17. A system as in claim 16 wherein said cataphoretic bath comprises: a voltage source connected between the conductive coating and an anode, having disposed therebetween an electrolytic fluid; the electrolytic fluid comprising: light-absorptive, non-conductive material, chosen from a group consisting of: manganese carbonate, cobalt oxide black, and iron oxides with cobalt oxides; and the voltage applied by the voltage source being between about 100 volts and about 600 volts, applied for between about 1 minute and about 10 minutes.

18. A system as in claim 11 wherein said remover of the photoresist from the unfixed set comprises: a developer.

19. A system as in claim 11 wherein said light emitting substance comprises phosphor.