Claims
- 1. A system for cleaning a substrate using a pressurized fluid solvent, the system comprising:
- a pressurized vessel having a chamber for containing the substrate to be cleaned and a volume of the pressurized fluid solvent;
- a primary flow line extending from and in fluid communication with the chamber, the primary flow line including a pump for cycling a primary flow of the pressurized fluid solvent therethrough;
- at least one filter positioned along the primary flow line to remove contaminants from the pressurized fluid solvent of the primary flow, the primary flow line configured to cycle the pressurized fluid solvent of the primary flow back to the chamber after passing through the filter;
- a secondary flow line extending from and in fluid communication with the chamber, the secondary flow line including an evaporator to evaporate a secondary flow of the pressurized fluid solvent directed through the secondary flow line into a vapor and separate contaminants therefrom;
- a vent connected in fluid communication with the evaporator to vent the vapor from the evaporator to a location outside the system; and
- a source of new pressurized fluid solvent in fluid communication with the chamber to replace new pressurized fluid solvent into the chamber at a flow substantially equivalent to the secondary flow vented by the vent.
- 2. The system of claim 1 further including a pressure equalization line in fluid communication with and extending between the source of pressurized fluid solvent and at least one of either the filter and the chamber for displacing solvent vapor therebetween.
- 3. A system for cleaning a substrate using a pressurized fluid solvent, the system comprising:
- a pressurized vessel having a chamber for containing the substrate to be cleaned and a volume of the pressurized fluid solvent;
- a primary flow line extending from and in fluid communication with the chamber, the primary flow line including a pump for continuously cycling a primary flow of the pressurized fluid solvent therethrough;
- at least one filter positioned along the primary flow line to continuously remove contaminants from the pressurized fluid solvent of the primary flow, the primary flow line configured to cycle the pressurized fluid solvent of the primary flow back to the chamber after passing through the at least one filter;
- a secondary flow line extending from and in fluid communication with the chamber, the secondary flow line including an evaporator adapted to form a vapor of a secondary flow of the pressurized fluid solvent directed through the secondary flow line and to separate contaminants from the secondary flow of the pressurized fluid solvent;
- a condenser in fluid communication with the evaporator to liquify the vapor from the evaporator to create rejuvenated pressurized fluid solvent substantially free of contaminants, the condenser also in fluid communication with the chamber to redirect the rejuvenated pressurized fluid solvent to the chamber for further use; and
- a selectively-operated vent connected in fluid communication with the evaporator and in parallel with the condenser to selectively vent at least a portion of the vapor from the evaporator to a location outside the system.
- 4. The system of claim 3, wherein the evaporator and the condenser each include a heat exchanger for adjusting temperature respectively therein.
- 5. The system of claim 3, wherein the evaporator and the condenser each include a pressure regulator for adjusting pressure respectively therein.
- 6. The system of claim 3, wherein the evaporator and the condenser are provided together as an integral unit.
- 7. The system of claim 3, wherein the secondary flow line extends from and is in fluid communication with the chamber through fluid communication with the primary flow line so that the secondary flow of pressurized fluid solvent is obtained from at least a portion of the primary flow of pressurized fluid solvent.
- 8. The system of claim 3 further including a tank in fluid communication with the chamber for storing and supplying pressurized fluid solvent, and a pressure equalization line in fluid communication with and extending between the tank and at least one of either the filter and the chamber for displacing solvent vapor therebetween.
- 9. A system for cleaning a substrate using a pressurized fluid solvent, the system comprising:
- a pressurized vessel having a chamber for containing the substrate to be cleaned and a volume of the pressurized fluid solvent;
- a primary flow line extending from and in fluid communication with the chamber, the primary flow line including a pump for continuously cycling a primary flow of the pressurized fluid solvent therethrough;
- at least one filter positioned along the primary flow line to continuously remove contaminants from the pressurized fluid solvent of the primary flow, the primary flow line configured to cycle the pressurized fluid solvent of the primary flow back to the chamber after passing through the at least one filter;
- a secondary flow line extending from and in fluid communication with the chamber, the secondary flow line including an evaporator adapted to form a vapor of a secondary flow of the pressurized fluid solvent directed through the secondary flow line and to separate contaminants from the secondary flow of the pressurized fluid solvent;
- a compressor in fluid communication with the evaporator to compress the vapor from the evaporator to create rejuvenated pressurized fluid solvent substantially free of contaminants, the compressor also in fluid communication with the chamber to redirect the rejuvenated pressurized fluid solvent to the chamber for further use;
- a selectively-operated vent connected in fluid communication with the evaporator and in parallel with the compressor to selectively vent at least a portion of the vapor from the evaporator to a location outside the system; and
- a source of new pressurized fluid solvent in fluid communication with the chamber to replace new pressurized fluid solvent into the chamber at a flow substantially equivalent to the portion of secondary flow vented by the vent.
Parent Case Info
This is a divisional of U.S. patent application Ser. No. 08/680,909, filed Jul. 12, 1996, now U.S. Pat. No. 5,772,783, which is a continuation of U.S. patent application Ser. No. 08/506,508, filed Jul. 25, 1995, now abandoned, which is a continuation-in-part of U.S. patent application, Ser. No. 08/336,588, filed Nov. 9, 1994, now abandoned. The entire disclosures of applications Ser. Nos. 08/680,909, 08/506,508, and 08/336,588 are incorporated herein by reference.
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Divisions (1)
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Number |
Date |
Country |
Parent |
680909 |
Jul 1996 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
506508 |
Jul 1995 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
336588 |
Nov 1994 |
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