Claims
- 1) A system for indicating orientation of a packaged IC comprising:
a) a socket; b) an audio source, the audio source physically and electrically connected to the socket; c) wherein the audio source is activated when the packaged IC is correctly inserted in the socket.
- 2) A system for indicating orientation of a packaged IC comprising:
a) a socket; b) an audio source, the audio source physically and electrically connected to the socket; c) wherein the audio source is activated when the packaged IC is incorrectly inserted in the socket.
- 3) A system for indicating orientation of a packaged IC comprising:
a) a socket; b) an audio source, the audio source physically mounted to the socket and electrically connected between a first socket hole and a second socket hole on the socket; c) wherein the audio source is activated when the packaged IC is correctly inserted in the socket.
- 4) A system for indicating orientation of a packaged IC comprising:
a) a socket; b) an audio source, the audio source physically mounted to the socket and electrically connected between a first socket hole and a second socket hole on the socket; c) wherein the audio source is activated when the packaged IC is incorrectly inserted in the socket.
- 5) A system for indicating orientation of a packaged IC comprising:
a) a socket; b) an audio source, the audio source physically mounted to the socket and electrically connected between a first socket hole and second socket hole on the socket; c) wherein the first socket hole is connected to a positive voltage; d) wherein the second socket hole is connected to a ground path on the packaged IC when the packaged IC is oriented correctly; e) wherein the audio source is activated when the packaged IC is oriented correctly.
- 6) The system in claim 5 wherein the audio source is a piezo-electric buzzer.
- 7) The system in claim 5 wherein the socket is a ZIF socket.
- 8) A system for indicating orientation of a packaged IC comprising:
a) a socket; b) an audio source, the audio source physically mounted to the socket and electrically connected between a first socket hole and second socket hole on the socket; c) wherein the first socket hole is connected to a positive voltage; d) wherein the second socket hole is connected to a ground path on the packaged IC when the packaged IC is oriented incorrectly; e) wherein the audio source is activated when the packaged IC is oriented incorrectly.
- 9) The system in claim 8 wherein the audio source is a piezo-electric buzzer.
- 10) The system in claim 8 wherein the socket is a ZIF socket.
- 11) A method for indicating orientation of a packaged IC comprising:
a) physically mounting an audio source to a socket; b) electrically connecting the audio source between a first socket hole and a second socket hole on the socket; c) inserting the packaged IC in the socket; d) providing a positive voltage to the first socket hole; e) wherein the second socket hole is connected to a ground path on the packaged IC when the packaged IC is oriented correctly; f) wherein the audio source is activated when the packaged IC is oriented correctly.
- 12) The method in claim 11 wherein the audio source is a piezo-electric buzzer.
- 13) The method in claim 11 wherein the socket is a ZIF socket.
- 14) A method for indicating orientation of a packaged IC comprising:
a) physically mounting an audio source to a socket; b) electrically connecting the audio source between a first socket hole and a second socket hole on the socket; c) inserting the packaged IC in the socket; d) providing a positive voltage to the first socket hole; e) wherein the second socket hole is connected to a ground path on the packaged IC when the packaged IC is oriented incorrectly; f) wherein the audio source is activated when the packaged IC is oriented incorrectly.
- 15) The method in claim 14 wherein the audio source is a piezo-electric buzzer.
- 16) The method in claim 14 wherein the socket is a ZIF socket.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of application Ser. No. 10/420,577 also entitled, “A Method and System for Sensing IC Package Orientation in Sockets,” filed on Apr. 21, 2003 hereby incorporated herein by reference.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10420577 |
Apr 2003 |
US |
Child |
10888897 |
Jul 2004 |
US |