Method for controlling distribution of fluid components on a body

Information

  • Patent Grant
  • 7981481
  • Patent Number
    7,981,481
  • Date Filed
    Friday, December 8, 2006
    18 years ago
  • Date Issued
    Tuesday, July 19, 2011
    13 years ago
Abstract
The present invention provides a method of controlling the distribution of a fluid on a body that features compensating for varying distribution of constituent components of a composition that moved over a surface of a substrate. To that end, the method includes generating a sequence of patterns of liquid upon a substrate, each of which includes a plurality of spaced-apart liquid regions, with voids being defined between adjacent liquid regions. A second of the patterns of liquid of the sequence is arranged so that the liquid regions associated therewith are in superimposition with the voids of a first of the patterns of liquid of the sequence.
Description
BACKGROUND OF THE INVENTION

The field of invention relates generally to nano-fabrication of structures. More particularly, the present invention is directed to methods for controlling distribution of fluid components on a body in imprint lithographic processes.


Nano-scale fabrication involves the fabrication of very small structures, e.g., having features on the order of one nanometer or more. A promising process for use in nano-scale fabrication is known as imprint lithography. Exemplary imprint lithography processes are described in detail in numerous publications, such as United States published patent application 2004/0065976 filed as U.S. patent application Ser. No. 10/264,960, entitled “Method and a Mold to Arrange Features on a Substrate to Replicate Features having Minimal Dimensional Variability”; United States published patent application 2004/0065252 filed as U.S. patent application Ser. No. 10/264,926, entitled “Method of Forming a Layer on a Substrate to Facilitate Fabrication of Metrology Standards”; and U.S. Pat. No. 6,936,194, issued Aug. 30, 2005 and entitled “Functional Patterning Material For Imprint Lithography Processes,” all of which are assigned to the assignee of the present invention.


Referring to FIG. 1, the basic concept behind imprint lithography is forming a relief pattern on a substrate that may function as, inter alia, an etching mask so that a pattern may be formed into the substrate that corresponds to the relief pattern. A system 10 employed to form the relief pattern includes a stage 11 upon which a substrate 12 is supported, and a template 14 having a mold 16 with a patterning surface 18 thereon. Patterning surface 18 may be substantially smooth and/or planar, or may be patterned so that one or more recesses are formed therein. Template 14 is coupled to an imprint head 20 to facilitate movement of template 14. A fluid dispense system 22 is coupled to be selectively placed in fluid communication with substrate 12 so as to deposit polymerizable material 24 thereon. A source 26 of energy 28 is coupled to direct energy 28 along a path 30. Imprint head 20 and stage 11 are configured to arrange mold 16 and substrate 12, respectively, to be in superimposition, and disposed in path 30. Either imprint head 20, stage 11, or both vary a distance between mold 16 and substrate 12 to define a desired volume therebetween that is filled by polymerizable material 24.


Typically, polymerizable material 24 is disposed upon substrate 12 before the desired volume is defined between mold 16 and substrate 12. However, polymerizable material 24 may fill the volume after the desired volume has been obtained. After the desired volume is filled with polymerizable material 24, source 26 produces energy 28, which causes polymerizable material 24 to solidify and/or cross-link, forming polymeric material conforming to the shape of the substrate surface 25 and mold surface 18. Control of this process is regulated by processor 32 that is in data communication with stage 11 imprint head 20, fluid dispense system 22, and source 26, operating on a computer-readable program stored in memory 34.


An important characteristic with accurately forming the pattern in the polymerizable material is to reduce, if not prevent, adhesion to the mold of the polymeric material, while ensuring suitable adhesion to the substrate. This is referred to as preferential release and adhesion properties. In this manner, the pattern recorded in the polymeric material is not distorted during separation of the mold. Prior art attempts to improve the release characteristics employ a release layer on the surface of the mold. The release layer is typically hydrophobic and/or has low surface energy. The release layer adheres to the mold by covalent chemical bonding. Providing the release layer improves release characteristics. This is seen by minimization of distortions in the pattern recorded into the polymeric material that are attributable to mold separation. This type of release layer is referred to, for purposes of the present discussion, as an a priori release layer, i.e., a release layer that is solidified to the mold.


Another prior art attempt to improve release properties is described by Bender et al. in “Multiple Imprinting in UV-based Nanoimprint Lithography: Related Material Issues,” Microeletronic Engineering 61-62 (2002), pp. 407-413. Specifically, Bender et al. employ a mold having an a priori release layer in conjunction with a fluorine-treated UV curable material. To that end, a UV curable layer is applied to a substrate by spin-coating a 110 cPs UV curable fluid to form a UV curable layer. The UV curable layer is enriched with fluorine groups to improve the release properties.


A need exists, therefore, to improve the preferential release and adhesion properties of a mold employed in imprint lithography processes.


SUMMARY OF THE INVENTION

The present invention provides a method of controlling the distribution of a fluid on a body that features compensating for varying distribution of constituent components of a composition that move over a surface of a substrate. Specifically, the quantity of a surfactant component of a composition varied over the surface upon which the composition was spread to form a contiguous layer. Typically, the composition is deposited upon the surface as a plurality of spaced-apart droplets. It was discovered that the air-liquid interface of each droplet varied in dimension as the same was spread over the surface. This resulted in there being a depletion of surfactants, referred to as surfactant depletion regions (SDR) in the area of the contiguous layer proximate to the situs of the droplets and a surfactant rich region (SRR) in area of the layer located proximate to spaces between the droplets. This is believed to increase the probability that pitting of a solidified layer formed from the contiguous layer occurs. The pitting is believed to be attributable to, inter alia, from an uneven distribution of surfactant on the mold. A lamella layer is generated on the mold after each imprint. The lamella layer is formed primarily from surfactants present in the material disposed between the mold and the substrate during imprinting. An uneven distribution of surfactants in this material causes an uneven distribution of surfactants in the lamella layer. This in turn exacerbates the differences in surfactant quantities in the SDR and SRR as the number of imprints increases. To compensate for the varying distribution of surfactants in a given layer, the method includes generating a sequence of patterns of liquid upon a substrate, each of which includes a plurality of spaced-apart liquid regions, with interstices being defined between adjacent liquid regions. A second of the patterns of liquid of the sequence is arranged so that the liquid regions associated therewith are in superimposition with the interstices of a first of the patterns of liquid of the sequence. These and other embodiments are described below.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a simplified plan view of a lithographic system in accordance with the prior art;



FIG. 2 is a simplified elevation view of a template and imprinting material disposed on a substrate in accordance with the present invention;



FIG. 3 is a top down view of a region of the substrate, shown in FIG. 2, upon which patterning occurs employing a pattern of droplets of polymerizable fluid disposed thereon;



FIG. 4 is a simplified elevation view of an imprint device spaced-apart from the patterned imprinting layer, shown in FIG. 1, after patterning in accordance with the present invention;



FIG. 5 is a detailed view of the template, shown in FIG. 2 being removed after solidification of imprinting material in accordance with a second embodiment of the present invention;



FIG. 6 is a cross-sectional view of an imprinted layer showing varying thickness that the present invention is directed to reduce if not avoid;



FIG. 7 is a top down view of a region of the substrate, shown in FIG. 2, showing an intermediate pattern formed by the droplets of polymerizable fluid shown in FIG. 3, during spreading;



FIG. 8 is a detailed cross-sectional view of a portion of one droplet of imprinting material showing the change in shape of the same during formation of intermediate pattern in accordance with the present invention;



FIG. 9 is a detailed cross-sectional view of a portion of one droplet of imprinting material showing the change is surfactant molecule distribution as the shape of the same changes during formation of intermediate patterns; and



FIG. 10 is a partial top down view of FIG. 3 showing a sequence of droplets deposited on a surface in furtherance of forming a sequence of contiguous layers of imprinting material in accordance with one embodiment of the present invention.





DETAILED DESCRIPTION OF THE INVENTION

Referring to FIGS. 1 and 2, a mold 36, in accordance with the present invention, may be employed in system 10, and may define a surface having a substantially smooth or planar profile (not shown). Alternatively, mold 36 may include features defined by a plurality of spaced-apart recessions 38 and protrusions 40. The plurality of features defines an original pattern that forms the basis of a pattern to be formed on a substrate 42. Substrate 42 may comprise a bare wafer or a wafer with one or more layers disposed thereon, one of which is shown as primer layer 45. To that end, reduced is a distance “d” between mold 36 and substrate 42. In this manner, the features on mold 36 may be imprinted into a conformable region of substrate 42, such as an imprinting material disposed on a portion of surface 44 that presents a substantially planar profile. It should be understood that the imprinting material may be deposited using any known technique, e.g., spin-coating, dip coating and the like. In the present example, however, the imprinting material is deposited as a plurality of spaced-apart discrete droplets 46 on substrate 42.


Referring to both FIGS. 3 and 4, droplets 46 are arranged in a pattern 49 to facilitate formation of a contiguous layer 50. Imprinting material is formed from a composition that may be selectively polymerized and cross-linked to record the original pattern therein, defining a recorded pattern. Specifically, the pattern recorded in the imprinting material is produced, in part, by interaction with mold 36, e.g., electrical interaction, magnetic interaction, thermal interaction, mechanical interaction or the like. In the present example, mold 36 is spaced-apart from substrate 42 with the area of surface 44 in superimposition therewith being shown by periphery 51. Portions of surface 44 not covered by droplets 46 and within periphery 51 define voids 53. Regions of mold 36 in superimposition with droplets 46 define deposition zones. It should be understood that for purposes of the present example, each side of periphery 51 is 25 millimeters in length, i.e., the area encompassed by periphery is 25×25 mm square. Droplets 46 are shown to reflect an accurate depiction of proportional size a diameter thereof compared to the length of one side of periphery 51. Although droplets 46 are shown being different sizes, the present invention envisions an embodiment wherein all the droplets 46 are of the same size, i.e., contain the same quantity of liquid. Regions of mold 36 in superimposition with voids 53 define interstices. Mold 36 comes into mechanical contact with the imprinting material, spreading droplets 46, so as to generate a contiguous layer 50 of the imprinting material over surface 44. In one embodiment, distance “d” is reduced to allow sub-portions 52 of imprinting material to ingress into and fill recessions 38. To facilitate filling of recessions 38, before contact between mold 36 and droplets 46, the atmosphere between mold 36 and droplets 46 is saturated with helium or is completely evacuated or is a partially evacuated atmosphere of helium. It may be desired to purge the volume, defined between mold 36, surface and droplets 46, shown in FIG. 2, for example with Helium gas flowed at 5 pounds per square inch (psi), before contact occurs. An exemplary purging technique is disclosed in U.S. Pat. No. 7,090,716 issued Aug. 15, 2006, entitled SINGLE PHASE FLUID IMPRINT LITHOGRAPHY, which is incorporated by reference herein.


The imprinting material is provided with the requisite properties to completely fill recessions 38 while covering surface 44 with a contiguous formation of the imprinting material. In the present embodiment, sub-portions 54 of imprinting material in superimposition with protrusions 40 remain after the desired, usually minimum, distance “d” has been reached. This action provides contiguous layer 50 with sub-portions 52 having a thickness t1, and sub-portions 54, having a thickness t2. Thicknesses “t1,” and “t2” may be any thickness desired, dependent upon the application. Thereafter, contiguous layer 50 is solidified by exposing the same to the appropriate curing agent, e.g., actinic energy, such as broadband ultra violet energy, thermal energy or the like, depending upon the imprinting material. This causes the imprinting material to polymerize and cross-link. The entire process may occur at ambient temperatures and pressures, or in an environmentally-controlled chamber with desired temperatures and pressures. In this manner, contiguous layer 50 is solidified to provide side 56 thereof with a shape conforming to a shape of a surface 58 of mold 36.


Referring to FIGS. 1, 2 and 3, the characteristics of the imprinting material are important to efficiently pattern substrate 42 in light of the unique patterning process employed. For example, it is desired that the imprinting material have certain characteristics to facilitate rapid and even filling of the features of mold 36 so that all thicknesses t1 are substantially uniform and all thicknesses t2 are substantially uniform. To that end, it is desirable that the viscosity of the imprinting material be established, based upon the deposition process employed, to achieve the aforementioned characteristics. As mentioned above, the imprinting material may be deposited on substrate 42 employing various techniques. Were the imprinting material deposited as a plurality of discrete and spaced-apart droplets 46, it would be desirable that a composition from which the imprinting material is formed have relatively low viscosity, e.g., in a range of 0.5 to 30 centipoises (cPs).


Considering that the imprinting material is spread and patterned concurrently, with the pattern being subsequently solidified into contiguous layer 50 by exposure to radiation, it would be desired to have the composition wet surface of substrate 42 and/or mold 36 and to avoid subsequent pit or hole formation after polymerization. Were the imprinting material deposited employing spin-coating techniques, it would be desired to use higher viscosity materials, e.g., having a viscosity greater than 10 cPs and typically, several hundred to several thousand cPs, with the viscosity measurement being determined in the absence of a solvent. The total volume contained in droplets 46 may be such so as to minimize, or avoid, a quantity of the imprinting material from extending beyond the region of surface 44 in superimposition with mold 36, while obtaining desired thicknesses t1 and t2, e.g., through capillary attraction of the imprinting material with mold 36 and surface 44 and surface adhesion of the imprinting material.


In addition to the aforementioned characteristics, referred to as liquid phase characteristics, it is desirable that the composition provides the imprinting material with certain solidified phase characteristics. For example, after solidification of contiguous layer 50, it is desirable that preferential adhesion and release characteristics be demonstrated by the imprinting material. Specifically, it is beneficial for the composition from which the imprinting material is fabricated to provide contiguous layer 50 with preferential adhesion to substrate 42 and preferential release of mold 36. In this fashion, reduced is the probability of distortions in the recorded pattern resulting from the separation of mold 36 therefrom due to, inter alia, tearing, stretching or other structural degradation of contiguous layer 50.


For example, with reference to FIGS. 4 and 5, upon separation of mold 36, contiguous layer 50 is subjected to a separation force Fs. Separation force Fs is attributable to a pulling force FP on mold 36 and adhering forces, e.g., Van der Waals forces, between contiguous layer 50 and mold 36. Pulling force FP is used to break vacuum seal. It is desired to decouple mold 36 from contiguous layer 50 without unduly distorting contiguous layer 50. One manner in which to control distortion of contiguous layer 50 during separation of mold 36 therefrom is by providing the composition from which the imprinting material is formed with releasing agents, such as surfactants.


The constituent components of the composition that form the imprinting material and layer 45 to provide the aforementioned characteristics may differ. This results from substrate 42 being formed from a number of different materials, i.e. providing differing magnitudes of adhering forces FA. As a result, the chemical composition of surface 44 varies dependent upon the material from which substrate 42 is formed. For example, substrate 42 may be formed from silicon, plastics, gallium arsenide, mercury telluride, and composites thereof. As mentioned above, substrate 42 may include one or more layers shown as primer layer 45, e.g., dielectric layer, metal layer, semiconductor layer, planarization layer and the like, upon which contiguous layer 50 is generated. To that end, primer layer 45 would be deposited upon a wafer 47 employing any suitable technique, such as chemical vapor deposition, spin-coating and the like. Additionally, primer layer 45 may be formed from any suitable material, such as silicon, germanium and the like. Additionally, mold 36 may be formed from several materials, e.g., fused-silica, quartz, indium tin oxide diamond-like carbon, MoSi, sol-gels and the like.


An exemplary composition that may be employed from which to form contiguous layer 50 is as follows:


Composition





    • isobornyl acrylate

    • n-hexyl acrylate

    • ethylene glycol diacrylate

    • 2-hydroxy-2-methyl-1-phenyl-propan-1-one

    • R1R2





An acrylate component of the bulk material, isobornyl acrylate (IBOA), has the following structure:




embedded image



and comprises approximately 47% of COMPOSITION by weight, but may be present in a range of 20% to 80%, inclusive. As a result, the mechanical properties of solidified imprinting layer 134 are primarily attributable to IBOA. An exemplary source for IBOA is Sartomer Company, Inc. of Exton, Pa. available under the product designation SR 506.


The component n-hexyl acrylate (n-HA) has the following structure:




embedded image



and comprises approximately 25% of bulk material by weight, but may be present in a range of 0% to 40%, inclusive. Also providing flexibility to formation 50, n-HA is employed to reduce the viscosity of the prior art bulk material so that bulk material, in the liquid phase, has a viscosity in a range 2-9 Centipoises, inclusive. An exemplary source for the n-HA component is the Aldrich Chemical Company of Milwaukee, Wis.


A cross-linking component, ethylene glycol diacrylate, has the following structure:




embedded image



and comprises approximately 15% of bulk material by weight, and may be present in a range of 10% to 50%, inclusive. EGDA also contributes to the modulus and stiffness buildup, as well as facilitates cross-linking of n-HA and IBOA during polymerization of the bulk material.


An initiator component, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, is available from Ciba Specialty Chemicals of Tarrytown, N.Y. under the trade name DAROCUR® 1173, and has the following structure:




embedded image



and comprises approximately 3% of the bulk material by weight, and may be present in a range of 1% to 5%, inclusive. The initiator is responsive to a broad band of ultra-violet radiation generated by a medium-pressure mercury lamp. In this manner, the initiator facilitates cross-linking and polymerization of the components of the bulk material. The constituent components of COMPOSITION, IBOA, n-HA, EGDA and 2-hydroxy-2-methyl-1-phenyl-propan-1-one form the bulk material of the same.


A surfactant component, R1R2, is a non-ionic surfactant sold by Mason Chemical Company of Arlington Heights, Ill. under the product names MASURF® FS-2000. The surfactant component consists of approximately 2%, by weight, of the bulk material and acts as a release agent of COMPOSITION by facilitating preferential adhesion and release of contiguous layer 50, once solidified.


The advantages of this patterning process are manifold. For example, the thickness differential between protrusions 40 and recessions 38 facilitates formation, in substrate 42, of a pattern corresponding to the recorded pattern formed in contiguous layer 50. Specifically, the thickness differential between t1 and t2 of protrusions 40 and recession 38, respectively, results in a greater amount of etch time being required before exposing regions of substrate 42 in superimposition with protrusions 40 compared with the time required for regions of substrate 42 in superimposition with recession 52 being exposed. For a given etching process, therefore, etching will commence sooner in regions of substrate 42 in superimposition with recessions 38 than regions in superimposition with protrusions 40. This facilitates formation of a pattern in substrate corresponding to the aforementioned recorded pattern. By properly selecting the imprinting materials and etch chemistries, the relational dimensions between the differing features of the pattern eventually transferred into substrate 42 may be controlled as desired. To that end, it is desired that the etch characteristics of the recorded pattern, for a given etch chemistry, be substantially uniform.


As a result, the characteristics of the imprinting material are important to efficiently pattern substrate 42 in light of the unique patterning process employed. As mentioned above, the imprinting material is deposited on substrate 42 as a plurality of discrete and spaced-apart droplets 46. The combined volume of droplets 46 is such that the imprinting material is distributed appropriately over an area of surface 44 where the recorded pattern is to be formed. In this fashion, the total volume of the imprinting material in droplets 46 defines the distance “d”, to be obtained so that the total volume occupied by the imprinting material in the gap defined between mold 36 and the portion of substrate 42 in superimposition therewith once the desired distance “d” is reached is substantially equal to the total volume of the imprinting material in droplets 46. To facilitate the deposition process, it is desired that the imprinting material provide rapid and even spreading of the imprinting material in droplets 46 over surface 44 so that all thicknesses t1 are substantially uniform and all residual thicknesses t2 are substantially uniform.


Referring to FIGS. 3 and 6, a problem recognized by the present invention involves varying characteristics of a contiguous layer of imprinting material. Specifically, formed on a substrate 142 was a layer 100 in the manner discussed above, i.e., except with a non-patterned mold (not shown) having a smooth surface, to spread droplets 46. After spreading of droplets 46 the imprinting material was exposed for approximately 700 ms to actinic energy having a wavelength of approximate 365 nm a flux of 77 mW/cm2 to solidify the same. After sequentially forming and solidifying several layers 100 employing mold 36, observed were pits 102 over the area of layers 100 formed later in the sequence. Pits 102 were found to be a complete absence of layer 100 in superimposition with portions 104 of substrate 142 and located between portions 106 of layer 100 having a desired thickness. It is believed that pits 102 result from an uneven surfactant distribution over layer 100 that prevents the bulk material of COMPOSITION from being in superimposition with regions 104. The difference becomes more pronounced as the number of layers 100 imprinted.


Referring to FIGS. 3, 4 and 6, the present invention overcomes these drawbacks by changing the position of droplets 46 in pattern 49 on sequential formation of contiguous layers, such as contiguous layer 50 or 100. The present discussion concerns contiguous layer 100, with the understanding that the same applies to contiguous layer 50, as well. Specifically, it was found that the quantity of the surfactant component of COMPOSITION varied in contiguous layer 100 over the surface upon which the composition was spread to form solidified contiguous layer 100. Typically, the composition is deposited upon surface 44 as a plurality of spaced-apart droplets 46. It was discovered that the surfactant concentration in the air-liquid interface of each droplet varied as the droplet was spread over the surface. This resulted from several factors, including the viscosity differential between the surfactant component of COMPOSITION and the bulk material component of the same and the consumption of the surfactant component by clinging to the mold 36 surface in contact with the COMPOSITION. The presented as surfactant depletion regions (SDR) in the area of the contiguous layer proximate to the situs of the droplets 46, regions 106, and a surfactant rich region (SRR) in areas of the layer located proximate to spaces between the droplets, regions 104.


Referring to FIGS. 3, 8 and 9, observing that surfactants have an affinity for the region of a liquid proximate to a liquid-air interface it was realized that during formation of a contiguous layer, surfactant molecules underwent redistribution due to the varying size of the liquid-air-interface. Upon deposition of droplets 46 on surface 44, each of the droplets 46 generates an initial liquid-air interface 120. Surfactant molecules 122 are packed tightly, after a predetermined time, at interface 120. As mold 36 interacts with droplets 46, liquid in droplets 46 moves with respect to substrate 42, in direction of the movement shown by arrow 124 forming a series of intermediate patterns, such as pattern 110, before droplets 46 merge to form contiguous layer 100. As droplets 46 move the air-liquid interface 120 moves, shown by liquid-air interface 220, which finally becomes ambient-air interface 108, shown in FIG. 7. This results in the spacing between adjacent surfactant molecules 122 increasing, shown in FIG. 9, for the reasons discussed above. As a result, a greater number of surfactant molecules travel from regions of liquids in superimposition with deposition zones of mold 36, creating SDR regions thereat, and an SRR region in areas of liquid in superimposition with interstices of mold 36, shown in FIG. 4.


Referring to FIGS. 4, 6, 8 and 9, the presence of surfactant molecules 122 in contiguous layer 100 generates a lamella layer 150 on mold 36 after formation of each contiguous layer 100. Lamella layer 150 comprises a densely packed fluid composition of surfactant molecules 122. The distribution of surfactant molecules 122 in lamella layer 150 matches the distribution of surfactant molecules in contiguous layer 100, i.e. SDR regions 102 and SRR region 104. Thus, there is an uneven distribution of surfactant molecules 122 in lamella layer 150. On formation of subsequent contiguous layers, the difference in surfactant molecule distribution in lamella layer 150 may become exacerbated, resulting in an increasing probability that voids may be present in contiguous layer 100. To reduce, if not avoid an uneven distribution of surfactant molecules 122 in layers 100 and 150, a subsequent layer formed by mold 36 would be generated by locating deposition zones of the same to be in superimposition with interstices of a previously formed contiguous layer 100 that includes regions 104, shown more clearly in FIG. 10.


Referring again to FIGS. 4, 6, 8 and 9, in this manner, the existing surfactant molecule 122 distribution present in lamella 150 may be compensated for, at least in part, by the resulting surfactant molecule 122 distribution from spreading of droplets 46 to form contiguous layer 100. This is referred to as a droplet pattern shift in which sequential contiguous layers formed from COMPOSITION is generated by shifting the droplets in the pattern for one of the contiguous layers in the sequence compared to the position of the droplets in the pattern employed to form the previous contiguous layer in the sequence.


Referring to FIG. 10, it should be understood, however, that it need not be necessary to shift the pattern 49 of droplets so that the entire area of droplets 46 are in superimposition with the interstices. Rather, it is within the spirit of the present invention that there may be an overlap between droplets 46 of one pattern and droplets 146 of the next pattern formed in a sequence. This may be repeated until a pattern is formed corresponding to a subsequent contiguous layer the area of which is entirely within a void 53 of an initial pattern and, therefore, the interstice. Moreover, it may be desirable to vary the quantity of surfactants in one or more of droplets 46, 146, 246 and 346 to avoid pitting of contiguous layer 100, shown in FIG. 6.


The embodiments of the present invention described above are exemplary. Many changes and modifications may be made to the disclosure recited above while remaining within the scope of the invention. The scope of the invention should not, therefore, be limited by the above description, but instead should be determined with reference to the appended claims along with their full scope of equivalents.

Claims
  • 1. A method of controlling the distribution of fluid components on a body in superimposition with a substrate, the method comprising: sequentially contacting the body with a series of patterns of liquid formed on one or more substrates, each pattern in the series comprising a plurality of spaced-apart liquid regions with voids defined between adjacent spaced-apart liquid regions, wherein an arrangement of the plurality of spaced-apart liquid regions in the first pattern of the series differs from an arrangement of the plurality of spaced-apart liquid regions in the second pattern of the series, such that regions of the body that initially contact the spaced-apart liquid regions in the first pattern do not initially contact the spaced-apart liquid regions in the second pattern.
  • 2. A method of controlling the distribution of fluid components on a body in superimposition with a substrate, the method comprising: sequentially contacting the body with a series of patterns of liquid formed on one or more substrates, each pattern in the series comprising a plurality of spaced-apart liquid regions with voids defined between adjacent spaced-apart liquid regions, wherein an arrangement of the plurality of spaced-apart liquid regions in the first pattern of the series differs from an arrangement of the plurality of spaced-apart liquid regions in the second pattern of the series, such that regions of the body that initially contact the spaced-apart liquid regions in the first pattern initially partially contacts at least one of the spaced-apart liquid regions in the second pattern.
  • 3. A method of controlling the distribution of fluid components on a body in superimposition with a substrate, the method comprising: sequentially contacting the body with a series of patterns of liquid formed on one or more substrates, each pattern in the series comprising a plurality of spaced-apart liquid regions with voids defined between adjacent spaced-apart liquid regions, wherein an arrangement of the plurality of spaced-apart liquid regions in the first pattern of the series differs from an arrangement of the plurality of spaced-apart liquid regions in the second pattern of the series, wherein the spaced-apart liquid regions are droplets of a polymerizable liquid, and wherein sequentially contacting the body with the series of patterns of liquid formed on the one or more substrates comprises:depositing a pattern of a first polymerizable liquid comprising a first surfactant upon a first substrate of the one or more substrates to form the first pattern in the series of patterns, the first pattern comprising a first plurality of spaced-apart droplets at first droplet locations, with first voids defined at first void locations between adjacent spaced-apart droplets of the first plurality of droplets;contacting the body with the first plurality of spaced-apart droplets to spread the spaced-apart droplets to form a first contiguous layer of the first polymerizable liquid on the first substrate, the first contiguous layer comprising surfactant depletion regions proximate the first droplet locations and surfactant rich regions proximate the first void locations;forming a first lamella layer upon the body, wherein the first lamella layer has surfactant rich regions corresponding to the surfactant rich regions of the first contiguous layer and surfactant depletion regions corresponding to the surfactant depletion regions of the first contiguous layer;solidifying the first polymerizable liquid to form a solidified layer on the first substrate;separating the body with the first lamella layer from the solidified layer;depositing a pattern of a second polymerizable liquid comprising a second surfactant upon the first one or another one of the one or more substrates to form the second pattern in the series of patterns, the second pattern comprising a second plurality of spaced-apart droplets at second droplet locations; andcontacting the body with the second plurality of spaced-apart droplets, wherein at least some of the second droplet locations are in superimposition with at least some of the first surfactant rich regions of the first lamella layer of the body.
  • 4. The method as recited in claim 3 wherein a sub-portion of the second plurality of spaced-apart droplets is partially in superimposition with the surfactant depletion regions of the first lamella layer of the body.
  • 5. The method as recited in claim 3 wherein the droplets of the first plurality of droplets have a first quantity of liquid and the droplets of the second plurality of droplets have a second quantity of liquid, wherein the second quantity of liquid differs from the first quantity of liquid.
  • 6. The method as recited in claim 3 wherein the droplets of the first plurality of droplets have a first quantity of the first surfactant and the droplets of the second plurality of droplets have a second quantity of the second surfactant, wherein the second quantity of the second surfactant differs from the first quantity of the first surfactant.
  • 7. The method as recited in claim 3 wherein the droplets of the first plurality of droplets have a first quantity of the first surfactant and the droplets of the second plurality of droplets have a second quantity of the second surfactant, wherein the second quantity of the second surfactant is the same as said first quantity of the first surfactant.
  • 8. A method of controlling the distribution of fluid components on a body, the method comprising: depositing a first plurality of spaced-apart droplets of a first polymerizable liquid comprising a first surfactant upon a substrate;aligning the body and the substrate, with portions of the body in superimposition with the droplets defining first deposition zones and portions of the body between said first deposition zones defining first interstices;contacting the body with the first plurality of spaced-apart droplets to form a contiguous layer of the polymerizable liquid between the body and the substrate and to form surfactant depletion regions and surfactant rich regions on the body;solidifying the contiguous layer to form a solidified layer;separating the body from the solidified layer;forming a second plurality of spaced-apart droplets of a second polymerizable liquid comprising a second surfactant upon the same or an additional substrate; andaligning the body and the same or the additional substrate, with portions of the body in superimposition with the droplets of the second plurality of droplets defining second deposition zones and portions of the body between the second deposition zones defining second interstices, wherein the second plurality of spaced-apart droplets is arranged with the second deposition zones in superimposition with the first interstices and the second interstices in superimposition with the first deposition zones.
  • 9. The method as recited in claim 8 wherein solidifying comprises exposing the contiguous layer to actinic energy, and wherein the surfactant rich regions of the body are in superimposition with the second deposition zones and the surfactant depletion regions of the body are in superimposition with the second interstices.
  • 10. The method as recited in claim 8 wherein forming the second plurality of droplets comprises forming each of the droplets of the second plurality of droplets with an area such that each of the droplets is completely in superimposition with one of the first interstices.
  • 11. The method as recited in claim 8 wherein forming the second plurality of droplets comprises forming each of the droplets such that a sub-portion of each of the droplets of the second plurality of droplets is in superimposition with one of the first deposition zones.
  • 12. The method as recited in claim 8 wherein depositing the first plurality of spaced-apart droplets comprises providing each of the droplets of the first plurality with a first quantity of liquid and forming the second plurality of droplets comprises providing each of the droplets of the second plurality of droplets with a second quantity of liquid, wherein the second quantity of liquid differs from the first quantity of liquid.
  • 13. The method as recited in claim 8 wherein depositing the first plurality of spaced-apart droplets comprises providing each of the droplets of the first plurality of droplets with a first quantity of the first surfactant and forming the second plurality of droplets comprises providing the droplets of the second plurality of droplets with a second quantity of the second surfactant, wherein the second quantity of the second surfactant differs from the first quantity of the first surfactant.
  • 14. The method as recited in claim 8 wherein depositing the first plurality of spaced-apart droplets comprises forming the droplets of the first plurality of droplets to have a first quantity of the first surfactant and forming the second plurality of droplets comprises forming the droplets of the second plurality of droplets to have a second quantity of the second surfactant, wherein the second quantity of the second surfactant is the same as the first quantity of the first surfactant.
  • 15. A method of controlling the distribution of fluid components on a body in superimposition with a substrate, the method comprising: depositing a first plurality of spaced-apart droplets of a polymerizable liquid comprising a first surfactant upon the substrate, with regions of the body in superimposition with the droplets defining first deposition zones and regions of the body between the first deposition zones defining first interstices;contacting the first plurality of spaced-apart droplets with the body;spreading the droplets of the first plurality of spaced-apart droplets to form a first contiguous layer of the liquid between the body and the substrate;exposing the first contiguous layer of the polymerizable liquid to actinic energy to form a first solidified layer, wherein the first solidified layer comprises surfactant rich regions in superimposition with the first interstices and surfactant depletion regions in superimposition with the first deposition zones;separating the body from the first solidified layer;forming a second plurality of spaced-apart droplets of a second polymerizable liquid comprising a second surfactant upon the first solidified layer, with portions of the body in superimposition with the droplets of the second plurality defining second deposition zones and portions of the body between the second deposition zones defining second interstices, wherein the second plurality of spaced-apart droplets is arranged with the second deposition zones in superimposition with the surfactant rich regions of the first solidified layer and the second interstices in superimposition with the surfactant depletion regions of the first solidified layer;contacting the second plurality of spaced-apart droplets with the body;spreading the droplets of the second plurality of spaced-apart droplets to form an additional contiguous layer of the liquid between the body and the first solidified layer; andexposing the additional contiguous layer of the liquid to actinic energy to form an additional solidified layer on the first solidified layer.
  • 16. The method as recited in claim 15 wherein forming the second plurality of spaced-apart droplets comprises providing each of the droplets of the second plurality of droplets with an area to completely cover one of the first interstices.
  • 17. The method as recited in claim 15 wherein forming the second plurality of spaced-apart droplets comprises providing each of the droplets of the second plurality of droplets with an area, a sub-portion of which is in superimposition with one of the first deposition zones.
  • 18. The method as recited in claim 15 wherein depositing the first plurality of spaced-apart droplets comprises providing each of the droplets of the first plurality with a first quantity of liquid and forming the second plurality of spaced-apart droplets comprises providing each of the droplets of the second plurality of droplets with a second quantity of liquid, wherein the second quantity of liquid differs from the first quantity of liquid.
  • 19. The method as recited in claim 15 wherein depositing the first plurality of spaced-apart droplets comprises providing each of the droplets of the first plurality of droplets with a first quantity of the first surfactant and forming the second plurality of spaced-apart droplets comprises providing the droplets of the second plurality of droplets with a second quantity of the second surfactant, wherein the second quantity of the second surfactant differs from the first quantity of the first surfactant.
CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a continuation-in-part of U.S. published patent application 2006-0062922-A1, filed as U.S. patent application Ser. No. 10/948,511 on Sep. 23, 2004 entitled “Polymerization Technique to Attenuate Oxygen Inhibition of Solidification of Liquids and Composition Therefor,” which is incorporated by reference herein.

US Referenced Citations (239)
Number Name Date Kind
3810874 Mitsch et al. May 1974 A
3919351 Chang et al. Nov 1975 A
4271258 Watariguchi Jun 1981 A
4512848 Deckman et al. Apr 1985 A
4514439 Rounds Apr 1985 A
4517337 Lockhart et al. May 1985 A
4544572 Sandvig et al. Oct 1985 A
4552833 Ito et al. Nov 1985 A
4614667 Larson et al. Sep 1986 A
4617238 Crivello et al. Oct 1986 A
4687707 Matsuo et al. Aug 1987 A
4722878 Watakabe et al. Feb 1988 A
4731155 Napoli et al. Mar 1988 A
4808511 Holmes Feb 1989 A
4826943 Ito et al. May 1989 A
4931351 McColgin et al. Jun 1990 A
4959252 Bonnebat et al. Sep 1990 A
4988274 Kenmochi Jan 1991 A
5028366 Harakal et al. Jul 1991 A
5028511 Choi Jul 1991 A
5108875 Thackeray et al. Apr 1992 A
5110514 Soane May 1992 A
5169494 Hashimoto et al. Dec 1992 A
5170182 Olson et al. Dec 1992 A
5170192 Pettigrew et al. Dec 1992 A
5180757 Lucey Jan 1993 A
5204381 Zeigler Apr 1993 A
5206983 Guckel et al. May 1993 A
5234793 Sebald et al. Aug 1993 A
5240550 Boehnke et al. Aug 1993 A
5242711 DeNatale et al. Sep 1993 A
5259926 Kuwabara et al. Nov 1993 A
5298556 Stephens Mar 1994 A
5302627 Field et al. Apr 1994 A
5314731 Yoneda et al. May 1994 A
5318870 Hartney Jun 1994 A
5331020 Brown et al. Jul 1994 A
5369722 Heming et al. Nov 1994 A
5389696 Dempsey et al. Feb 1995 A
5395954 Soria et al. Mar 1995 A
5417802 Obeng May 1995 A
5425848 Haisma et al. Jun 1995 A
5439766 Day et al. Aug 1995 A
5459198 Sharp Oct 1995 A
5462700 Beeson et al. Oct 1995 A
5480047 Tanigawa et al. Jan 1996 A
5482768 Kawasato et al. Jan 1996 A
5512131 Kumar et al. Apr 1996 A
5523878 Wallace et al. Jun 1996 A
5527662 Hashimoto et al. Jun 1996 A
5542978 Kindt-Larsen et al. Aug 1996 A
5545367 Bae et al. Aug 1996 A
5594042 Glover et al. Jan 1997 A
5601641 Stephens Feb 1997 A
5629095 Bujanowski et al. May 1997 A
5629128 Shirakawa et al. May 1997 A
5669303 Maracas et al. Sep 1997 A
5723242 Woo et al. Mar 1998 A
5725788 Maracas et al. Mar 1998 A
5772905 Chou Jun 1998 A
5776748 Singhvi et al. Jul 1998 A
5820769 Chou Oct 1998 A
5837314 Beaton et al. Nov 1998 A
5849209 Kindt-Larsen et al. Dec 1998 A
5849222 Jen et al. Dec 1998 A
5861467 Bujanowski et al. Jan 1999 A
5888650 Calhoun et al. Mar 1999 A
5895263 Carter et al. Apr 1999 A
5905104 Eklund et al. May 1999 A
5948470 Harrison et al. Sep 1999 A
5956216 Chou Sep 1999 A
6046056 Parce et al. Apr 2000 A
6063888 Yamaguchi et al. May 2000 A
6066269 Wei et al. May 2000 A
6074827 Nelson et al. Jun 2000 A
6114404 Deeken et al. Sep 2000 A
6117708 Wensel Sep 2000 A
6132632 Haney et al. Oct 2000 A
6174931 Moon et al. Jan 2001 B1
6190929 Wang et al. Feb 2001 B1
6200736 Tan Mar 2001 B1
6204343 Barucha et al. Mar 2001 B1
6218316 Marsh Apr 2001 B1
6261469 Zakhidov et al. Jul 2001 B1
6274294 Hines Aug 2001 B1
6309580 Chou Oct 2001 B1
6316290 Wensel Nov 2001 B1
6326627 Putvinski et al. Dec 2001 B1
6334960 Willson et al. Jan 2002 B1
6335149 Xu et al. Jan 2002 B1
6342097 Terry et al. Jan 2002 B1
6344105 Daugherty et al. Feb 2002 B1
6348999 Summersgill et al. Feb 2002 B1
6355198 Kim et al. Mar 2002 B1
6391217 Schaffer et al. May 2002 B2
6399406 Chan et al. Jun 2002 B2
6446933 Westmoreland Sep 2002 B1
6468642 Bray et al. Oct 2002 B1
6468896 Rohr et al. Oct 2002 B2
6475704 Iwasaki et al. Nov 2002 B1
6482742 Chou Nov 2002 B1
6497961 Kang et al. Dec 2002 B2
6503914 Benish et al. Jan 2003 B1
6517977 Resnick et al. Feb 2003 B2
6517995 Jacobson et al. Feb 2003 B1
6518168 Clem et al. Feb 2003 B1
6518189 Chou Feb 2003 B1
6541356 Fogel et al. Apr 2003 B2
6544594 Linford et al. Apr 2003 B2
6565776 Li et al. May 2003 B1
6580172 Mancini et al. Jun 2003 B2
6583248 Bowen Jun 2003 B1
6600207 Huang et al. Jul 2003 B2
6605849 Lutwak et al. Aug 2003 B1
6607173 Westmoreland Aug 2003 B2
6646662 Nebashi et al. Nov 2003 B1
6649272 Moore et al. Nov 2003 B2
6664026 Nguyen et al. Dec 2003 B2
6664306 Gaddam et al. Dec 2003 B2
6696157 David et al. Feb 2004 B1
6696220 Bailey et al. Feb 2004 B2
6713238 Chou et al. Mar 2004 B1
6721529 Chen et al. Apr 2004 B2
6737489 Linert et al. May 2004 B2
6774183 Palumbo et al. Aug 2004 B1
6776094 Whitesides et al. Aug 2004 B1
6790905 Fitzgerald et al. Sep 2004 B2
6802870 Chang et al. Oct 2004 B2
6809356 Chou Oct 2004 B2
6828244 Chou Dec 2004 B2
6830819 Kaplan et al. Dec 2004 B2
6842229 Sreenivasan et al. Jan 2005 B2
6849558 Schaper Feb 2005 B2
6871558 Choi et al. Mar 2005 B2
6900881 Sreenivasan et al. May 2005 B2
6908861 Sreenivasan et al. Jun 2005 B2
6916584 Sreenivasan et al. Jul 2005 B2
6916585 Sreenivasan et al. Jul 2005 B2
6926929 Watts et al. Aug 2005 B2
6932934 Choi et al. Aug 2005 B2
6936194 Watts Aug 2005 B2
6980282 Choi et al. Dec 2005 B2
6990870 Choi et al. Jan 2006 B2
7019819 Choi et al. Mar 2006 B2
7036389 Choi et al. May 2006 B2
7037639 Voisin May 2006 B2
7071088 Watts et al. Jul 2006 B2
7077992 Sreenivasan et al. Jul 2006 B2
7090716 McMackin et al. Aug 2006 B2
7122079 Xu et al. Oct 2006 B2
7122482 Xu et al. Oct 2006 B2
7138362 Abe et al. Nov 2006 B2
7141188 Li et al. Nov 2006 B2
7157036 Choi et al. Jan 2007 B2
7179079 Sreenivasan et al. Feb 2007 B2
7244386 Sreenivasan et al. Jul 2007 B2
7252715 Watts et al. Aug 2007 B2
7270533 McMackin et al. Sep 2007 B2
7281919 Shackleton et al. Oct 2007 B2
7298456 Cherala et al. Nov 2007 B2
7316554 Choi et al. Jan 2008 B2
7338275 Choi et al. Mar 2008 B2
7360851 Snyder Apr 2008 B1
7462028 Cherala et al. Dec 2008 B2
7473090 McMackin et al. Jan 2009 B2
20010044075 Nishimura et al. Nov 2001 A1
20020042027 Chou et al. Apr 2002 A1
20020115002 Bailey et al. Aug 2002 A1
20020132482 Chou Sep 2002 A1
20020167117 Chou Nov 2002 A1
20020177319 Chou Nov 2002 A1
20030034329 Chou Feb 2003 A1
20030054115 Albano et al. Mar 2003 A1
20030062334 Lee et al. Apr 2003 A1
20030080471 Chou May 2003 A1
20030080472 Chou May 2003 A1
20030129542 Shih et al. Jul 2003 A1
20030166814 Sparrowe et al. Sep 2003 A1
20030235787 Watts et al. Dec 2003 A1
20040036201 Chou et al. Feb 2004 A1
20040046288 Chou Mar 2004 A1
20040065252 Sreenivasan et al. Apr 2004 A1
20040065976 Sreenivasan et al. Apr 2004 A1
20040110856 Young et al. Jun 2004 A1
20040112862 Willson et al. Jun 2004 A1
20040116548 Willson et al. Jun 2004 A1
20040118809 Chou et al. Jun 2004 A1
20040131718 Chou et al. Jul 2004 A1
20040137734 Chou et al. Jul 2004 A1
20040156108 Chou et al. Aug 2004 A1
20040163563 Sreenivasan et al. Aug 2004 A1
20040170770 Nguyen et al. Sep 2004 A1
20040192041 Jeong et al. Sep 2004 A1
20040197843 Chou et al. Oct 2004 A1
20040202872 Fang et al. Oct 2004 A1
20040241338 Foster et al. Dec 2004 A1
20040250945 Zheng et al. Dec 2004 A1
20050037143 Chou et al. Feb 2005 A1
20050061773 Choi et al. Mar 2005 A1
20050072757 McMackin et al. Apr 2005 A1
20050084804 Truskett et al. Apr 2005 A1
20050106321 McMackin et al. May 2005 A1
20050113484 Kamen et al. May 2005 A1
20050118749 Sakamoto et al. Jun 2005 A1
20050156357 Willson et al. Jul 2005 A1
20050189676 Sreenivasan Sep 2005 A1
20050236739 Willson et al. Oct 2005 A1
20050270312 Lad et al. Dec 2005 A1
20050276919 Truskett et al. Dec 2005 A1
20060035029 Xu et al. Feb 2006 A1
20060036051 Xu et al. Feb 2006 A1
20060062867 Choi et al. Mar 2006 A1
20060062922 Xu et al. Mar 2006 A1
20060063112 Sreenivasan Mar 2006 A1
20060076717 Sreenivasan et al. Apr 2006 A1
20060077374 Sreenivasan et al. Apr 2006 A1
20060081557 Xu et al. Apr 2006 A1
20060108710 Xu et al. May 2006 A1
20060115999 Sreenivasan et al. Jun 2006 A1
20060121728 McMackin et al. Jun 2006 A1
20060145398 Bailey et al. Jul 2006 A1
20060175736 Xu et al. Aug 2006 A1
20060177532 Fletcher et al. Aug 2006 A1
20060177535 McMackin et al. Aug 2006 A1
20070017631 Xu Jan 2007 A1
20070063384 Choi et al. Mar 2007 A1
20070114686 Choi et al. May 2007 A1
20070126150 GanapathiSubramanian et al. Jun 2007 A1
20070132152 Choi et al. Jun 2007 A1
20070170617 Choi et al. Jul 2007 A1
20070228593 Jones et al. Oct 2007 A1
20070228608 Shackleton et al. Oct 2007 A1
20070228610 Sreenivasan et al. Oct 2007 A1
20080085465 Xu et al. Apr 2008 A1
20080141862 Xu et al. Jun 2008 A1
20080153312 Sreenivasan et al. Jun 2008 A1
20080174046 Choi et al. Jul 2008 A1
20080199816 Choi et al. Aug 2008 A1
20080303187 Stacey et al. Dec 2008 A1
Foreign Referenced Citations (16)
Number Date Country
61-40845 Feb 1986 JP
1-196749 Aug 1989 JP
02-24848 Jan 1990 JP
02-92603 Apr 1990 JP
02192045 Jul 1990 JP
2-248480 Oct 1990 JP
3-90345 Apr 1991 JP
9-278490 Oct 1997 JP
WO 8702935 May 1987 WO
WO 9905724 Feb 1999 WO
WO 0021689 Apr 2000 WO
WO 0147003 Jun 2001 WO
WO 0207199 Jan 2002 WO
WO 03010289 Feb 2003 WO
WO 03079416 Sep 2003 WO
WO 03099536 Dec 2003 WO
Related Publications (1)
Number Date Country
20070141271 A1 Jun 2007 US
Continuation in Parts (1)
Number Date Country
Parent 10948511 Sep 2004 US
Child 11608374 US