Claims
- 1. A method for manufacturing a color microlens array comprising:
forming a first colored microlens resist layer on a surface, over a plurality of photodetecting regions that will define an image sensing area of an integrated circuit die; patterning the first colored microlens resist layer; and baking the patterned first colored microlens resist layer to cause flowing of the patterned layer resulting in a microlens, with a curved top surface, being formed above each of the plurality of photodetecting regions.
- 2. The method of claim 1 further comprising:
repeating the forming, patterning, and baking operations using a second colored microlens resist layer, the second resist layer to filter a different color than the first resist layer.
- 3. The method of claim 1 further comprising:
fixing the patterned first colored microlens resist layer by deep ultraviolet exposure to cause cross-linking, prior to baking.
- 4. The method of claim 1 further comprising:
stabilizing a surface of the microlens using silylation.
- 5. The method of claim 1 further comprising:
exposing the microlens to deep ultra-violet bleaching to improve transparency.
- 6. The method of claim 1 wherein the depositing, patterning, and baking operations are repeated three times, each time on a different colored polymer resist layer.
- 7. The method of claim 1 wherein the patterning operation is performed using a photolithographic process.
- 8. The method of claim 1 further comprising planarizing the surface prior to forming the first colored microlens resist layer.
- 9. The method of claim 8 wherein the surface is planarized by spin coating a planarization layer and then baking the spin coated planarization layer.
- 10. The method of claim 9 wherein the planarization layer is of a photo-definable material.
- 11. The method of claim 1 wherein the first microlens resist layer is soft baked prior to being patterned.
- 12. The method of claim 1 wherein the patterning includes exposing the resist layer to ultraviolet light, developing the exposed resist layer, and removing excess resist material from the exposed resist layer.
- 13. A method for manufacturing a color microlens array comprising:
forming a first colored microlens resist layer on a surface, over a plurality of pixel regions in a color display layer; patterning the first colored microlens resist layer; and baking the patterned first colored microlens resist layer to cause flowing of the patterned layer resulting in a microlens, with a curved top surface, being formed above each of the plurality of pixel regions.
- 14. The method of claim 13 further comprising:
repeating the forming, patterning, and baking operations using a second colored microlens resist layer, the second resist layer to filter a different color than the first resist layer.
- 15. The method of claim 13 further comprising:
fixing the patterned first colored microlens resist layer by deep ultraviolet exposure to cause cross-linking, prior to baking.
- 16. The method of claim 13 further comprising:
stabilizing a surface of the microlens using silylation.
- 17. The method of claim 13 further comprising:
exposing the microlens to deep ultra-violet bleaching to improve transparency.
- 18. The method of claim 13 wherein the depositing, patterning, and baking operations are repeated three times, each time on a different colored polymer resist layer.
- 19. The method of claim 13 wherein the patterning operation is performed using a photolithographic process.
- 20. The method of claim 13 further comprising planarizing the surface prior to forming the first colored microlens resist layer.
- 21. The method of claim 20 wherein the surface is planarized by spin coating a planarization layer and then baking the spin coated planarization layer.
- 22. The method of claim 21 wherein the planarization layer is of a photo-definable material.
- 23. The method of claim 13 wherein the first microlens resist layer is soft baked prior to being patterned.
- 24. The method of claim 13 wherein the patterning includes exposing the resist layer to ultraviolet light, developing the exposed resist layer, and removing excess resist material from the exposed resist layer.
Parent Case Info
[0001] This Application is a Divisional of Ser. No. 09/902,012, filed on Jul. 9, 2001; which is a Divisional of Ser. No. 09/052,609, filed on Mar. 31, 1998 and which issued as U.S. Pat. No. 6,271,900 on Nov. 27, 2001.
Divisions (2)
|
Number |
Date |
Country |
Parent |
09902012 |
Jul 2001 |
US |
Child |
10185777 |
Jun 2002 |
US |
Parent |
09052609 |
Mar 1998 |
US |
Child |
09902012 |
Jul 2001 |
US |